Datasheet BAS116 (Nexperia) - 7
| 制造商 | Nexperia |
| 描述 | Low-leakage diode |
| 页数 / 页 | 10 / 7 — Nexperia. BAS116. Low-leakage diode. 13. Soldering. Fig. 8. Reflow … |
| 修订版 | 05082020 |
| 文件格式/大小 | PDF / 205 Kb |
| 文件语言 | 英语 |
Nexperia. BAS116. Low-leakage diode. 13. Soldering. Fig. 8. Reflow soldering footprint for SOT23
该数据表的模型线
文件文字版本
Nexperia BAS116 Low-leakage diode 13. Soldering
3.3 2.9 1.9 solder lands solder resist 3 1.7 2 solder paste occupied area 0.7 0.6 (3×) (3×) Dimensions in mm 0.5 (3×) 0.6 (3×) 1 sot023_fr
Fig. 8. Reflow soldering footprint for SOT23
2.2 1.2 (2×) 1.4 (2×) solder lands 4.6 2.6 solder resist occupied area Dimensions in mm 1.4 preferred transport direction during soldering 2.8 4.5 sot023_fw
Fig. 9. Wave soldering footprint for SOT23
BAS116 All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2020. Al rights reserved
Product data sheet 5 August 2020 7 / 10
Document Outline 1. General description 2. Features and benefits 3. Applications 4. Quick reference data 5. Pinning information 6. Ordering information 7. Marking 8. Limiting values 9. Thermal characteristics 10. Characteristics 11. Test information 12. Package outline 13. Soldering 14. Revision history 15. Legal information Contents
3.3 2.9 1.9 solder lands solder resist 3 1.7 2 solder paste occupied area 0.7 0.6 (3×) (3×) Dimensions in mm 0.5 (3×) 0.6 (3×) 1 sot023_fr
Fig. 8. Reflow soldering footprint for SOT23
2.2 1.2 (2×) 1.4 (2×) solder lands 4.6 2.6 solder resist occupied area Dimensions in mm 1.4 preferred transport direction during soldering 2.8 4.5 sot023_fw
Fig. 9. Wave soldering footprint for SOT23
BAS116 All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2020. Al rights reserved
Product data sheet 5 August 2020 7 / 10
Document Outline 1. General description 2. Features and benefits 3. Applications 4. Quick reference data 5. Pinning information 6. Ordering information 7. Marking 8. Limiting values 9. Thermal characteristics 10. Characteristics 11. Test information 12. Package outline 13. Soldering 14. Revision history 15. Legal information Contents