NDS9948Typical Characteristics 10 600 f = 1 MHz ) I V D = -2.3A V = -20V -30V V = 0 V ( DS GS E 500 8 CISS LTAG -40V pF)O 400 (V 6 300 URCE O 4 -SACITANCETE 200 ACAP, G 2 COSS GS 100 -V CRSS 0 0 0 2 4 6 8 10 0 10 20 30 40 50 60 Qg, GATE CHARGE (nC)-VDS, DRAIN TO SOURCE VOLTAGE (V)Figure 7. Gate Charge Characteristics.Figure 8. Capacitance Characteristics. 100 50 ) W SINGLE PULSE R ( Rθ = 135°C/W JA ) 40 A 100µ TA = 25°C 10 WE ONT ( 1ms R LIMIT DS(ON) 10ms NT P 30 IE 1 100ms 1s 20 VGS = -10V 10s , DRAIN CURRE SINGLE PULSE DC AK TRANSD 0.1 E-I Rθ = 135oC/W JA 10 ), P TA = 25oC (pk P 0.01 0 0.1 1 10 100 0.001 0.01 0.1 1 10 100 1000 -VDS, DRAIN-SOURCE VOLTAGE (V)t1, TIME (sec)Figure 9. Maximum Safe Operating Area.Figure 10. Single Pulse MaximumPower Dissipation.T 1 N IE D = 0.5 RθJA(t) = r(t) * RθJA 0.2 TRANS RθJA = 135oC/W E VANCE 0.1 0.1 TCTIIS S 0.05 P(pk) FFE 0.02 EL REDA t1 E 0.01 ZM R 0.01 t2 ALI TJ - TA = P * RθJA(t) THERM SINGLE PULSE Duty Cycle, D = t1 / t2 NOr(t), 0.001 0.0001 0.001 0.01 0.1 1 10 100 1000 t1, TIME (sec)Figure 11. Transient Thermal Response Curve.Thermal characterization performed using the conditions described in Note 1c. Transient thermal response will change depending on the circuit board design. NDS9948 Rev B 1(W)