Datasheet STB75NF75, STP75NF75, STP75NF75FP (STMicroelectronics) - 10

Package mechanical data STB75NF75 - STP75NF75 - STP75NF75FP 4 Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com 10/16 Document Outline 1 Electrical ratings 2 Electrical characteristics 2.1 Electrical characteristics (curves) 3 Test circuit 4 Package mechanical data 5 Packaging mechanical data 6 Revision history