Datasheet TPV803, TPV809, TPV810 (3PEAK) - 5
| 制造商 | 3PEAK |
| 描述 | Low Voltage Supervisory Circuit |
| 页数 / 页 | 15 / 5 — TPV803/809/810. Low Voltage Supervisory Circuit. Specifications. Absolute … |
| 文件格式/大小 | PDF / 708 Kb |
| 文件语言 | 英语 |
TPV803/809/810. Low Voltage Supervisory Circuit. Specifications. Absolute Maximum Ratings. Parameter. Min. Max. Unit. Note:
该数据表的模型线
- TPV803L-3STR TPV803L-3TR TPV803M-3STR TPV803M-3TR TPV803R-3STR TPV803R-3TR TPV803S-3STR TPV803S-3TR TPV803T-3STR TPV803T-3TR TPV803V-3STR TPV803V-3TR TPV803W-3STR TPV803W-3TR TPV803Y-3STR TPV803Y-3TR TPV803Z-3STR TPV803Z-3TR
文件文字版本
TPV803/809/810 Low Voltage Supervisory Circuit Specifications Absolute Maximum Ratings Parameter Min Max Unit
Input Voltage VCC −0.3 6 V source or sink current for Push-pull, and sink Output Current 20 mA current for open drain of RESET/RESET TOP Operating Temperature −40 125 °C TJ Maximum Junction Temperature 150 °C TSTG Storage Temperature Range −65 150 °C TL Lead Temperature (Soldering 10 sec) 260 °C
Note:
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to any Absolute Maximum Rating condition for extended periods may affect device reliability and lifetime. (1) This data was taken with the JEDEC low effective thermal conductivity test board. (2) This data was taken with the JEDEC standard multilayer test boards.
ESD, Electrostatic Discharge Protection Symbol Parameter Condition Minimum Level Unit
HBM Human Body Model ESD ANSI/ESDA/JEDEC JS-001(1) 4000 V CDM Charged Device Model ESD ANSI/ESDA/JEDEC JS-002(2) 2000 V (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
www.3peakic.com.cn 5 / 15 Rev.A.5
Input Voltage VCC −0.3 6 V source or sink current for Push-pull, and sink Output Current 20 mA current for open drain of RESET/RESET TOP Operating Temperature −40 125 °C TJ Maximum Junction Temperature 150 °C TSTG Storage Temperature Range −65 150 °C TL Lead Temperature (Soldering 10 sec) 260 °C
Note:
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to any Absolute Maximum Rating condition for extended periods may affect device reliability and lifetime. (1) This data was taken with the JEDEC low effective thermal conductivity test board. (2) This data was taken with the JEDEC standard multilayer test boards.
ESD, Electrostatic Discharge Protection Symbol Parameter Condition Minimum Level Unit
HBM Human Body Model ESD ANSI/ESDA/JEDEC JS-001(1) 4000 V CDM Charged Device Model ESD ANSI/ESDA/JEDEC JS-002(2) 2000 V (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
www.3peakic.com.cn 5 / 15 Rev.A.5