Datasheet 6N135, 6N136 (Vishay) - 8
| 制造商 | Vishay |
| 描述 | High Speed Optocoupler, 1 MBd, Photodiode with Transistor Output |
| 页数 / 页 | 10 / 8 — 6N135, 6N136. DIP-8, Option 9. PACKAGE MARKING. Notes. SOLDER PROFILES |
| 文件格式/大小 | PDF / 222 Kb |
| 文件语言 | 英语 |
6N135, 6N136. DIP-8, Option 9. PACKAGE MARKING. Notes. SOLDER PROFILES
该数据表的模型线
文件文字版本
6N135, 6N136
www.vishay.com Vishay Semiconductors
DIP-8, Option 9
9.78 ± 0.25 7.62 typ. 10.16 max. 9.75 ± 0.15 6.70 ± 0.15 0.95 ± 0.20 0.25 ± 0.10 3.55 ± 0.20 8.00 min. 0.75 ± 0.20 1.27 ± 0.10 Leads coplanarity 2.54 nom. 0.10 max. 3 x 2.54 = 7.62 0.18 ± 0.08 Recommended Footprint 8 7 6 5 0.76 R0.250 2.54 1 2 3 4 PIN ONE I.D. 1.78 8.00 min. 1.52 11.05
PACKAGE MARKING
6N135 6N136 V YWW 68 V YWW 68 Fig. 12 - 6N135 Fig. 13 - 6N136
Notes
• The VDE logo is only marked on option 1 parts. • Tape and reel suffix (T) is not part of the package marking.
SOLDER PROFILES
300 300 5 s Lead temperature max. 260 °C 255 °C 250 250 245 °C 235 °C to 240 °C second full line: typical 260 °C wave 217 °C first wave dotted line: 200 200 wave process limits max. 30 s ca. 200 K/s ca. 2 K/s 150 150 100 °C to 130 °C max. 120 s max. 100 s 100 100 Temperature (°C) Temperature (°C) max. ramp down 6 °C/s 2 K/s ca. 5 K/s 50 forced cooling 50 max. ramp up 3 °C/s 0 0 0 50 100 150 200 250 0 50 100 150 200 250 300 94 8626 Time (s) 19841 Time (s) Fig. 14 - Wave Soldering Double Wave Profile According to Fig. 15 - Lead (Pb)-free Reflow Solder Profile According to J-STD-020 for DIP-8 Devices J-STD-020 for SMD-8 Devices Rev. 1.9, 02-Nov-15
8
Document Number: 83604 For technical questions, contact: optocoupleranswers@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
www.vishay.com Vishay Semiconductors
DIP-8, Option 9
9.78 ± 0.25 7.62 typ. 10.16 max. 9.75 ± 0.15 6.70 ± 0.15 0.95 ± 0.20 0.25 ± 0.10 3.55 ± 0.20 8.00 min. 0.75 ± 0.20 1.27 ± 0.10 Leads coplanarity 2.54 nom. 0.10 max. 3 x 2.54 = 7.62 0.18 ± 0.08 Recommended Footprint 8 7 6 5 0.76 R0.250 2.54 1 2 3 4 PIN ONE I.D. 1.78 8.00 min. 1.52 11.05
PACKAGE MARKING
6N135 6N136 V YWW 68 V YWW 68 Fig. 12 - 6N135 Fig. 13 - 6N136
Notes
• The VDE logo is only marked on option 1 parts. • Tape and reel suffix (T) is not part of the package marking.
SOLDER PROFILES
300 300 5 s Lead temperature max. 260 °C 255 °C 250 250 245 °C 235 °C to 240 °C second full line: typical 260 °C wave 217 °C first wave dotted line: 200 200 wave process limits max. 30 s ca. 200 K/s ca. 2 K/s 150 150 100 °C to 130 °C max. 120 s max. 100 s 100 100 Temperature (°C) Temperature (°C) max. ramp down 6 °C/s 2 K/s ca. 5 K/s 50 forced cooling 50 max. ramp up 3 °C/s 0 0 0 50 100 150 200 250 0 50 100 150 200 250 300 94 8626 Time (s) 19841 Time (s) Fig. 14 - Wave Soldering Double Wave Profile According to Fig. 15 - Lead (Pb)-free Reflow Solder Profile According to J-STD-020 for DIP-8 Devices J-STD-020 for SMD-8 Devices Rev. 1.9, 02-Nov-15
8
Document Number: 83604 For technical questions, contact: optocoupleranswers@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000