Datasheet NCS2005 (ON Semiconductor) - 2
| 制造商 | ON Semiconductor |
| 描述 | Operational Amplifier, Low Power, 8 MHz GBW, Rail-to-Rail Input-Output |
| 页数 / 页 | 11 / 2 — NCS2005. Table 1. PIN DESCRIPTION. Pin. Name. Type. Description. Table 2. … |
| 文件格式/大小 | PDF / 579 Kb |
| 文件语言 | 英语 |
NCS2005. Table 1. PIN DESCRIPTION. Pin. Name. Type. Description. Table 2. ABSOLUTE MAXIMUM RATINGS. rating. Symbol. Value. Units
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NCS2005 Table 1. PIN DESCRIPTION Pin Name Type Description
1 OUT Output Amplifier output 2 V− Power Negative power supply 3 IN+ Input Non−inverting input of amplifier 4 IN− Input Inverting input of amplifier 5 V+ Power Positive power supply
Table 2. ABSOLUTE MAXIMUM RATINGS
(Note 1)
rating Symbol Value Units
Supply Voltage Range (V+ − V−) VS 0 to 35 V Input Voltage Range VCM (V−) − 0.3 V to (V+) + 0.3 V V Differential Input Voltage Range Vdiff 0 to 15 V Input Pin Current IIN ±10 mA Output Pin Current (Note 2) IOUT ±20 mA Supply Current Is 25 mA Maximum Junction Temperature (Note 3) TJ(max) +150 °C Storage Temperature Range Tstg −65 to +150 °C ESD Capability (Note 4) V Human Body Model HBM 4000 Charged Device Model CDM 400 Moisture Sensitivity Level (Note 5) MSL Level 1 Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area. 2. Applies to both single supply and split supply operation. Continuous short circuit operation at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of 150°C. 3. The maximum power dissipation is a function of TJ(MAX), TJA, and TA. The maximum allowable dissipation at any ambient temperature is Pd = (TJ(max) – TA)/TJA. All numbers apply for packages soldered directly to a PC board. 4. This device series incorporates ESD protection and is tested by the following methods: ESD Human Body Model tested per JESD22−A114 ESD Charged Device Model tested per ANSI/ESD S5.3.1−2009 5. Moisture Sensitivity Level tested per IPC/JEDEC standard: J−STD−020A
Table 3. THERMAL CHARACTERISTICS Parameter Symbol Package Single Layer Board Multi Layer Board Units
Thermal Resistance Junction−to−Ambient (Note 6) qJA SOT−23−5 408 (Note 6) 355 (Note 7) °C/W 6. Values based on a 1S standard PCB according to JEDEC51−3 with 1.0 oz copper and a 300 mm2 copper area 7. Values based on a 1S2P standard PCB according to JEDEC51−7 with 1.0 oz copper and a 100 mm2 copper area
Table 4. OPERATING RANGES Parameter Symbol Min Max Units
Power Supply Voltage VS 2.2 32 V Common Mode Input Voltage VCM (V−) − 0.1 (V+) + 0.1 V Ambient Temperature TA −40 125 °C Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability.
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NCS2005 Table 1. PIN DESCRIPTION Pin Name Type Description
1 OUT Output Amplifier output 2 V− Power Negative power supply 3 IN+ Input Non−inverting input of amplifier 4 IN− Input Inverting input of amplifier 5 V+ Power Positive power supply
Table 2. ABSOLUTE MAXIMUM RATINGS
(Note 1)
rating Symbol Value Units
Supply Voltage Range (V+ − V−) VS 0 to 35 V Input Voltage Range VCM (V−) − 0.3 V to (V+) + 0.3 V V Differential Input Voltage Range Vdiff 0 to 15 V Input Pin Current IIN ±10 mA Output Pin Current (Note 2) IOUT ±20 mA Supply Current Is 25 mA Maximum Junction Temperature (Note 3) TJ(max) +150 °C Storage Temperature Range Tstg −65 to +150 °C ESD Capability (Note 4) V Human Body Model HBM 4000 Charged Device Model CDM 400 Moisture Sensitivity Level (Note 5) MSL Level 1 Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area. 2. Applies to both single supply and split supply operation. Continuous short circuit operation at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of 150°C. 3. The maximum power dissipation is a function of TJ(MAX), TJA, and TA. The maximum allowable dissipation at any ambient temperature is Pd = (TJ(max) – TA)/TJA. All numbers apply for packages soldered directly to a PC board. 4. This device series incorporates ESD protection and is tested by the following methods: ESD Human Body Model tested per JESD22−A114 ESD Charged Device Model tested per ANSI/ESD S5.3.1−2009 5. Moisture Sensitivity Level tested per IPC/JEDEC standard: J−STD−020A
Table 3. THERMAL CHARACTERISTICS Parameter Symbol Package Single Layer Board Multi Layer Board Units
Thermal Resistance Junction−to−Ambient (Note 6) qJA SOT−23−5 408 (Note 6) 355 (Note 7) °C/W 6. Values based on a 1S standard PCB according to JEDEC51−3 with 1.0 oz copper and a 300 mm2 copper area 7. Values based on a 1S2P standard PCB according to JEDEC51−7 with 1.0 oz copper and a 100 mm2 copper area
Table 4. OPERATING RANGES Parameter Symbol Min Max Units
Power Supply Voltage VS 2.2 32 V Common Mode Input Voltage VCM (V−) − 0.1 (V+) + 0.1 V Ambient Temperature TA −40 125 °C Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability.
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