Datasheet TLV9061, TLV9062, TLV9064 (Texas Instruments) - 2
| 制造商 | Texas Instruments |
| 描述 | 10-MHz, RRIO, CMOS Operational Amplifiers For Cost-Sensivite Systems |
| 页数 / 页 | 82 / 2 — TLV9061,. TLV9062,. TLV9064. www.ti.com. Table of Contents. Features. … |
| 文件格式/大小 | PDF / 5.9 Mb |
| 文件语言 | 英语 |
TLV9061,. TLV9062,. TLV9064. www.ti.com. Table of Contents. Features. Applications. Description. Revision History
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TLV9061, TLV9062, TLV9064
SBOS839J – MARCH 2017 – REVISED SEPTEMBER 2019
www.ti.com Table of Contents 1 Features
.. 1 9.2 Functional Block Diagram ... 23
2 Applications
... 1 9.3 Feature Description... 24
3 Description
... 1 9.4 Device Functional Modes.. 25
4 Revision History
... 2
10 Application and Implementation
.. 26
5 Description (continued)
... 5 10.1 Application Information.. 26 10.2 Typical Applications .. 26
6 Device Comparison Table
... 5
11 Power Supply Recommendations
... 28
7 Pin Configuration and Functions
... 6 11.1 Input and ESD Protection ... 28
8 Specifications
... 12
12 Layout
... 29 8.1 Absolute Maximum Ratings .. 12 12.1 Layout Guidelines ... 29 8.2 ESD Ratings.. 12 12.2 Layout Example .. 30 8.3 Recommended Operating Conditions ... 12
13 Device and Documentation Support
... 31 8.4 Thermal Information: TLV9061 ... 13 13.1 Documentation Support .. 31 8.5 Thermal Information: TLV9061S ... 13 13.2 Related Links .. 31 8.6 Thermal Information: TLV9062 ... 13 13.3 Receiving Notification of Documentation Updates 31 8.7 Thermal Information: TLV9062S ... 14 13.4 Community Resources.. 31 8.8 Thermal Information: TLV9064 ... 14 13.5 Trademarks ... 31 8.9 Thermal Information: TLV9064S ... 14 13.6 Electrostatic Discharge Caution .. 31 8.10 Electrical Characteristics... 15 13.7 Glossary .. 31 8.11 Typical Characteristics .. 17
9 Detailed Description
.. 23
14 Mechanical, Packaging, and Orderable Information
... 32 9.1 Overview ... 23
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision I (May 2019) to Revision J Page
• Deleted TLV9062IDDFR (SOT-23 (8)) package preview notations throughout data sheet ... 1 • Added industry standard package names to Device Comparison Table .. 5 • Added note to packages with thermal pads, specifying that the thermal pads need to be connected to V–... 7 • Added link to Shutdown Function section in SHDN pin function rows ... 11 • Added EMI Rejection section to the Feature Description section .. 24 • Changed Shutdown Function section to add more clarification .. 25
Changes from Revision H (April 2019) to Revision I Page
• Added DDF (SOT-23) thermal information to replace TBDs .. 13
Changes from Revision G (December 2018) to Revision H Page
• Added SOT-23 (8) information to Device Information ... 1 • Added DDF package column to Device Comparison Table ... 5 • Added DDF (SOT-23) package to Pin Functions ... 7 • Added DDF (SOT-23) package to Thermal Information... 13 • Added TLV9062 RUG (X2QFN) thermal information to replace TBDs .. 14 2 Submit Documentation Feedback Copyright © 2017–2019, Texas Instruments Incorporated Product Folder Links: TLV9061 TLV9062 TLV9064 Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Revision History 5 Description (continued) 6 Device Comparison Table 7 Pin Configuration and Functions 8 Specifications 8.1 Absolute Maximum Ratings 8.2 ESD Ratings 8.3 Recommended Operating Conditions 8.4 Thermal Information: TLV9061 8.5 Thermal Information: TLV9061S 8.6 Thermal Information: TLV9062 8.7 Thermal Information: TLV9062S 8.8 Thermal Information: TLV9064 8.9 Thermal Information: TLV9064S 8.10 Electrical Characteristics 8.11 Typical Characteristics 9 Detailed Description 9.1 Overview 9.2 Functional Block Diagram 9.3 Feature Description 9.3.1 Rail-to-Rail Input 9.3.2 Rail-to-Rail Output 9.3.3 EMI Rejection 9.3.4 Overload Recovery 9.3.5 Shutdown Function 9.4 Device Functional Modes 10 Application and Implementation 10.1 Application Information 10.2 Typical Applications 10.2.1 Typical Low-Side Current Sense Application 10.2.1.1 Design Requirements 10.2.1.2 Detailed Design Procedure 10.2.1.3 Application Curve 11 Power Supply Recommendations 11.1 Input and ESD Protection 12 Layout 12.1 Layout Guidelines 12.2 Layout Example 13 Device and Documentation Support 13.1 Documentation Support 13.1.1 Related Documentation 13.2 Related Links 13.3 Receiving Notification of Documentation Updates 13.4 Community Resources 13.5 Trademarks 13.6 Electrostatic Discharge Caution 13.7 Glossary 14 Mechanical, Packaging, and Orderable Information
TLV9061, TLV9062, TLV9064
SBOS839J – MARCH 2017 – REVISED SEPTEMBER 2019
www.ti.com Table of Contents 1 Features
.. 1 9.2 Functional Block Diagram ... 23
2 Applications
... 1 9.3 Feature Description... 24
3 Description
... 1 9.4 Device Functional Modes.. 25
4 Revision History
... 2
10 Application and Implementation
.. 26
5 Description (continued)
... 5 10.1 Application Information.. 26 10.2 Typical Applications .. 26
6 Device Comparison Table
... 5
11 Power Supply Recommendations
... 28
7 Pin Configuration and Functions
... 6 11.1 Input and ESD Protection ... 28
8 Specifications
... 12
12 Layout
... 29 8.1 Absolute Maximum Ratings .. 12 12.1 Layout Guidelines ... 29 8.2 ESD Ratings.. 12 12.2 Layout Example .. 30 8.3 Recommended Operating Conditions ... 12
13 Device and Documentation Support
... 31 8.4 Thermal Information: TLV9061 ... 13 13.1 Documentation Support .. 31 8.5 Thermal Information: TLV9061S ... 13 13.2 Related Links .. 31 8.6 Thermal Information: TLV9062 ... 13 13.3 Receiving Notification of Documentation Updates 31 8.7 Thermal Information: TLV9062S ... 14 13.4 Community Resources.. 31 8.8 Thermal Information: TLV9064 ... 14 13.5 Trademarks ... 31 8.9 Thermal Information: TLV9064S ... 14 13.6 Electrostatic Discharge Caution .. 31 8.10 Electrical Characteristics... 15 13.7 Glossary .. 31 8.11 Typical Characteristics .. 17
9 Detailed Description
.. 23
14 Mechanical, Packaging, and Orderable Information
... 32 9.1 Overview ... 23
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision I (May 2019) to Revision J Page
• Deleted TLV9062IDDFR (SOT-23 (8)) package preview notations throughout data sheet ... 1 • Added industry standard package names to Device Comparison Table .. 5 • Added note to packages with thermal pads, specifying that the thermal pads need to be connected to V–... 7 • Added link to Shutdown Function section in SHDN pin function rows ... 11 • Added EMI Rejection section to the Feature Description section .. 24 • Changed Shutdown Function section to add more clarification .. 25
Changes from Revision H (April 2019) to Revision I Page
• Added DDF (SOT-23) thermal information to replace TBDs .. 13
Changes from Revision G (December 2018) to Revision H Page
• Added SOT-23 (8) information to Device Information ... 1 • Added DDF package column to Device Comparison Table ... 5 • Added DDF (SOT-23) package to Pin Functions ... 7 • Added DDF (SOT-23) package to Thermal Information... 13 • Added TLV9062 RUG (X2QFN) thermal information to replace TBDs .. 14 2 Submit Documentation Feedback Copyright © 2017–2019, Texas Instruments Incorporated Product Folder Links: TLV9061 TLV9062 TLV9064 Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Revision History 5 Description (continued) 6 Device Comparison Table 7 Pin Configuration and Functions 8 Specifications 8.1 Absolute Maximum Ratings 8.2 ESD Ratings 8.3 Recommended Operating Conditions 8.4 Thermal Information: TLV9061 8.5 Thermal Information: TLV9061S 8.6 Thermal Information: TLV9062 8.7 Thermal Information: TLV9062S 8.8 Thermal Information: TLV9064 8.9 Thermal Information: TLV9064S 8.10 Electrical Characteristics 8.11 Typical Characteristics 9 Detailed Description 9.1 Overview 9.2 Functional Block Diagram 9.3 Feature Description 9.3.1 Rail-to-Rail Input 9.3.2 Rail-to-Rail Output 9.3.3 EMI Rejection 9.3.4 Overload Recovery 9.3.5 Shutdown Function 9.4 Device Functional Modes 10 Application and Implementation 10.1 Application Information 10.2 Typical Applications 10.2.1 Typical Low-Side Current Sense Application 10.2.1.1 Design Requirements 10.2.1.2 Detailed Design Procedure 10.2.1.3 Application Curve 11 Power Supply Recommendations 11.1 Input and ESD Protection 12 Layout 12.1 Layout Guidelines 12.2 Layout Example 13 Device and Documentation Support 13.1 Documentation Support 13.1.1 Related Documentation 13.2 Related Links 13.3 Receiving Notification of Documentation Updates 13.4 Community Resources 13.5 Trademarks 13.6 Electrostatic Discharge Caution 13.7 Glossary 14 Mechanical, Packaging, and Orderable Information