Datasheet CMS03 (Toshiba) - 3

CMS03 IF – VF PF (AV) – IF (AV) 10 1.8 Tj = 150°C 1.6 DC ion ) 1.4 125°C (A ssipat 1.2 α = 180° di ) er α = 120° t I F 25°C 1 75°C (W ren 1 pow ) α d = 60° cur ar 0.8 Rectangular d w F (AV ar waveform for P 0.6 Forw age 0.4 Aver 0° α 360° 0.2 Conduction angle: α Pulse test 0.1 0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0 0.6 1.2 1.8 2.4 3 3.6 4.2 4.8 Forward voltage VF (V) Average forward current IF (AV) (A) Ta max – IF (AV) Tℓ max – IF (AV) 160 160 Device mounted on a ceramic board: Rectangular board size: 50 mm × 50 mm ure 140 waveform Soldering land: 2 mm × 2 mm ure 140 rat board thickness: 0.64 mm at pe 120 120 per tem 0° α 360° tem ent 100 IF (AV) d 100 α = 180° DC Conduction angle: α α bi V lea = 60° R = 15 V am (°C) 80 e (°C) 80 e ax m abl ax Rectangular α = 120° abl Ta 60 low Tℓ m 60 waveform DC al alow α = 180 ° 40 um 40 m im α = 60° 0° α 360° α = 120° ax ximu 20 M 20 IF (AV) Ma Conduction angle: α VR = 15 V 0 0 0 0.6 1.2 1.8 2.4 3 3.6 4.2 4.8 0 0 .6 1.2 1.8 2.4 3 3.6 4.2 4.8 Average forward current I F (AV) (A) Average forward current I F (AV) (A) Repetitive peak forward current Cj – VR (typ.) 50 1000 ) f = 50 Hz f = 1 MHz (A M Ta = 25°C Ta = 25°C 40 ) t I FR (pF j ren 30 C e d cur ar 100 w itanc 20 for ak capac tion 10 titive pe Junc epe R 0 10 1 10 100 1 10 100 Number of cycles Reverse vol tage VR (V) 3 2018-04-04