Datasheet MMSZ, SZMM (ON Semiconductor)
| 制造商 | ON Semiconductor |
| 描述 | Zener Voltage Regulators |
| 页数 / 页 | 7 / 1 — 500 mW SOD−123 Surface Mount. www.onsemi.com. Features. SOD−123. CASE … |
| 文件格式/大小 | PDF / 282 Kb |
| 文件语言 | 英语 |
500 mW SOD−123 Surface Mount. www.onsemi.com. Features. SOD−123. CASE 425. STYLE 1. MARKING DIAGRAM. Mechanical Characteristics CASE:
该数据表的模型线
文件文字版本
link to page 1 link to page 1 link to page 1 link to page 2 MMSZxxxT1G Series, SZMMSZxxxT1G Series Zener Voltage Regulators
500 mW SOD−123 Surface Mount
Three complete series of Zener diodes are offered in the convenient,
www.onsemi.com
surface mount plastic SOD−123 package. These devices provide a convenient alternative to the leadless 34−package style.
Features
• 500 mW Rating on FR−4 or FR−5 Board • Wide Zener Reverse Voltage Range − 2.4 V to 56 V • Package Designed for Optimal Automated Board Assembly
SOD−123 CASE 425
• Small Package Size for High Density Applications
STYLE 1
• ESD Rating of Class 3 (> 16 kV) per Human Body Model • AEC−Q101 Qualified and PPAP Capable • SZ Prefix for Automotive and Other Applications Requiring Unique 1 2 Site and Control Change Requirements Cathode Anode • Pb−Free Packages are Available*
MARKING DIAGRAM Mechanical Characteristics CASE:
Void-free, transfer-molded, thermosetting plastic case
FINISH:
Corrosion resistant finish, easily Solderable 1 xx M G
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
G 260°C for 10 Seconds
POLARITY:
Cathode indicated by polarity band
FLAMMABILITY RATING:
UL 94 V−0 xx = Device Code M = Date Code G = Pb−Free Package
MAXIMUM RATINGS
(Note: Microdot may be in either location)
Rating Symbol Max Unit
Total Power Dissipation on FR−5 Board, PD
ORDERING INFORMATION
(Note 1) @ TL = 75°C 500 mW Derated above 75°C 6.7 mW/°C
Device Package Shipping
† Thermal Resistance, Junction−to−Ambient RqJA 340 °C/W MMSZxxxT1G SOD−123 3,000 / (Note 2) (Pb−Free) Tape & Reel Thermal Resistance, Junction−to−Lead R SZMMSZxxxT1G SOD−123 3,000 / qJL 150 °C/W (Note 2) (Pb−Free) Tape & Reel Junction and Storage Temperature Range T MMSZxxxT3G SOD−123 10,000 / J, Tstg −55 to +150 °C (Pb−Free) Tape & Reel Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be SZMMSZxxxT3G SOD−123 10,000 / assumed, damage may occur and reliability may be affected. (Pb−Free) Tape & Reel 1. FR−5 = 3.5 X 1.5 inches. 2. Thermal Resistance measurement obtained via infrared Scan Method. †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
See specific marking information in the device marking column of the Electrical Characteristics table on page 2 of *For additional information on our Pb−Free strategy and soldering details, please this data sheet. download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2012
1
Publication Order Number:
August, 2019 − Rev. 12 MMSZ2V4T1/D
500 mW SOD−123 Surface Mount
Three complete series of Zener diodes are offered in the convenient,
www.onsemi.com
surface mount plastic SOD−123 package. These devices provide a convenient alternative to the leadless 34−package style.
Features
• 500 mW Rating on FR−4 or FR−5 Board • Wide Zener Reverse Voltage Range − 2.4 V to 56 V • Package Designed for Optimal Automated Board Assembly
SOD−123 CASE 425
• Small Package Size for High Density Applications
STYLE 1
• ESD Rating of Class 3 (> 16 kV) per Human Body Model • AEC−Q101 Qualified and PPAP Capable • SZ Prefix for Automotive and Other Applications Requiring Unique 1 2 Site and Control Change Requirements Cathode Anode • Pb−Free Packages are Available*
MARKING DIAGRAM Mechanical Characteristics CASE:
Void-free, transfer-molded, thermosetting plastic case
FINISH:
Corrosion resistant finish, easily Solderable 1 xx M G
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
G 260°C for 10 Seconds
POLARITY:
Cathode indicated by polarity band
FLAMMABILITY RATING:
UL 94 V−0 xx = Device Code M = Date Code G = Pb−Free Package
MAXIMUM RATINGS
(Note: Microdot may be in either location)
Rating Symbol Max Unit
Total Power Dissipation on FR−5 Board, PD
ORDERING INFORMATION
(Note 1) @ TL = 75°C 500 mW Derated above 75°C 6.7 mW/°C
Device Package Shipping
† Thermal Resistance, Junction−to−Ambient RqJA 340 °C/W MMSZxxxT1G SOD−123 3,000 / (Note 2) (Pb−Free) Tape & Reel Thermal Resistance, Junction−to−Lead R SZMMSZxxxT1G SOD−123 3,000 / qJL 150 °C/W (Note 2) (Pb−Free) Tape & Reel Junction and Storage Temperature Range T MMSZxxxT3G SOD−123 10,000 / J, Tstg −55 to +150 °C (Pb−Free) Tape & Reel Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be SZMMSZxxxT3G SOD−123 10,000 / assumed, damage may occur and reliability may be affected. (Pb−Free) Tape & Reel 1. FR−5 = 3.5 X 1.5 inches. 2. Thermal Resistance measurement obtained via infrared Scan Method. †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
See specific marking information in the device marking column of the Electrical Characteristics table on page 2 of *For additional information on our Pb−Free strategy and soldering details, please this data sheet. download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2012
1
Publication Order Number:
August, 2019 − Rev. 12 MMSZ2V4T1/D