Datasheet BC817 (Nexperia) - 4
| 制造商 | Nexperia |
| 描述 | 45 V, 500 mA NPN General-Purpose Transistors |
| 页数 / 页 | 13 / 4 — Nexperia. BC817 series. 45 V, 500 mA NPN general-purpose transistors |
| 修订版 | 30062022 |
| 文件格式/大小 | PDF / 316 Kb |
| 文件语言 | 英语 |
Nexperia. BC817 series. 45 V, 500 mA NPN general-purpose transistors
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Nexperia BC817 series 45 V, 500 mA NPN general-purpose transistors 9. Thermal characteristics Table 7. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit
Rth(j-a) thermal resistance from junction to ambient in free air [1] - - 500 K/W [2] [3] - - 362 K/W [2] [1] Device mounted on an FR4 Printed-Circuit-Board (PCB); single-sided copper; tin-plated and standard footprint. [2] Valid for al available selection groups. [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated; monting pad for col ector 1 cm2. aaa-028112 103 duty cycle = 1 Zth(j-a) (K/W) 0.75 0.50 0.33 102 0.20 0.10 0.05 10 0.02 0.01 0 110-5 10-3 10-2 10-4 10 102 10-1 103 1 tp (s) FR4 PCB, single-sided, tin-plated and standard footprint
Fig. 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
aaa-028113 103 Zth(j-a) duty cycle = 1 (K/W) 0.75 0.50 102 0.33 0.20 0.10 0.05 10 0.02 0.01 0 110-5 10-3 10-2 10-4 10 102 10-1 103 1 tp (s) FR4 PCB, single-sided copper, tin-plated; mounting pad for col ector 1 cm2.
Fig. 3. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
BC817_SER All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2022. Al rights reserved
Product data sheet Rev. 8 — 1 July 2022 4 / 13
Document Outline 1. General description 2. Features and benefits 3. Applications 4. Quick reference data 5. Pinning information 6. Ordering information 7. Marking 8. Limiting values 9. Thermal characteristics 10. Characteristics 11. Package outline 12. Soldering 13. Revision history 14. Legal information Contents
Nexperia BC817 series 45 V, 500 mA NPN general-purpose transistors 9. Thermal characteristics Table 7. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit
Rth(j-a) thermal resistance from junction to ambient in free air [1] - - 500 K/W [2] [3] - - 362 K/W [2] [1] Device mounted on an FR4 Printed-Circuit-Board (PCB); single-sided copper; tin-plated and standard footprint. [2] Valid for al available selection groups. [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated; monting pad for col ector 1 cm2. aaa-028112 103 duty cycle = 1 Zth(j-a) (K/W) 0.75 0.50 0.33 102 0.20 0.10 0.05 10 0.02 0.01 0 110-5 10-3 10-2 10-4 10 102 10-1 103 1 tp (s) FR4 PCB, single-sided, tin-plated and standard footprint
Fig. 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
aaa-028113 103 Zth(j-a) duty cycle = 1 (K/W) 0.75 0.50 102 0.33 0.20 0.10 0.05 10 0.02 0.01 0 110-5 10-3 10-2 10-4 10 102 10-1 103 1 tp (s) FR4 PCB, single-sided copper, tin-plated; mounting pad for col ector 1 cm2.
Fig. 3. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
BC817_SER All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2022. Al rights reserved
Product data sheet Rev. 8 — 1 July 2022 4 / 13
Document Outline 1. General description 2. Features and benefits 3. Applications 4. Quick reference data 5. Pinning information 6. Ordering information 7. Marking 8. Limiting values 9. Thermal characteristics 10. Characteristics 11. Package outline 12. Soldering 13. Revision history 14. Legal information Contents