Datasheet BC817 (Nexperia) - 10
| 制造商 | Nexperia |
| 描述 | 45 V, 500 mA NPN General-Purpose Transistors |
| 页数 / 页 | 13 / 10 — Nexperia. BC817 series. 45 V, 500 mA NPN general-purpose transistors. 12. … |
| 修订版 | 30062022 |
| 文件格式/大小 | PDF / 316 Kb |
| 文件语言 | 英语 |
Nexperia. BC817 series. 45 V, 500 mA NPN general-purpose transistors. 12. Soldering
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文件文字版本
Nexperia BC817 series 45 V, 500 mA NPN general-purpose transistors 12. Soldering
3.3 2.9 1.9 solder lands solder resist 3 1.7 2 solder paste occupied area 0.7 0.6 (3×) (3×) Dimensions in mm 0.5 (3×) 0.6 (3×) 1 sot23_fr
Fig. 17. Reflow soldering footprint for SOT23 (TO-236AB)
2.2 1.2 (2×) 1.4 (2×) solder lands 4.6 2.6 solder resist occupied area Dimensions in mm 1.4 preferred transport direction during soldering 2.8 4.5 sot23_fw
Fig. 18. Wave soldering footprint for SOT23 (TO-236AB)
BC817_SER All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2022. Al rights reserved
Product data sheet Rev. 8 — 1 July 2022 10 / 13
Document Outline 1. General description 2. Features and benefits 3. Applications 4. Quick reference data 5. Pinning information 6. Ordering information 7. Marking 8. Limiting values 9. Thermal characteristics 10. Characteristics 11. Package outline 12. Soldering 13. Revision history 14. Legal information Contents
3.3 2.9 1.9 solder lands solder resist 3 1.7 2 solder paste occupied area 0.7 0.6 (3×) (3×) Dimensions in mm 0.5 (3×) 0.6 (3×) 1 sot23_fr
Fig. 17. Reflow soldering footprint for SOT23 (TO-236AB)
2.2 1.2 (2×) 1.4 (2×) solder lands 4.6 2.6 solder resist occupied area Dimensions in mm 1.4 preferred transport direction during soldering 2.8 4.5 sot23_fw
Fig. 18. Wave soldering footprint for SOT23 (TO-236AB)
BC817_SER All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2022. Al rights reserved
Product data sheet Rev. 8 — 1 July 2022 10 / 13
Document Outline 1. General description 2. Features and benefits 3. Applications 4. Quick reference data 5. Pinning information 6. Ordering information 7. Marking 8. Limiting values 9. Thermal characteristics 10. Characteristics 11. Package outline 12. Soldering 13. Revision history 14. Legal information Contents