Datasheet TDA6107AJF (Philips) - 2
| 制造商 | Philips |
| 描述 | Triple Video Output Amplifier |
| 页数 / 页 | 16 / 2 — Philips Semiconductors. TDA6107AJF. Triple video output amplifier. Block … |
| 文件格式/大小 | PDF / 97 Kb |
| 文件语言 | 英语 |
Philips Semiconductors. TDA6107AJF. Triple video output amplifier. Block diagram. Fig 1. Block diagram (one amplifier shown)
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文件文字版本
Philips Semiconductors TDA6107AJF Triple video output amplifier 4. Block diagram
VDD 6 MIRROR 1 MIRROR 5
TDA6107AJF
CASCODE 1 3× MIRROR 4 Voc(1), 9, 8, 7 CURRENT 1× Voc(2), SOURCE Voc(3) 1× Rf THERMAL PROTECTION VIP DIFFERENTIAL CIRCUIT REFERENCE STAGE Vi(1), 1, 2, 3 5 Vi(2), MIRROR 3 Iom V R i(3) i Ra 3× CASCODE 2 MIRROR 2 4 mce457
Fig 1. Block diagram (one amplifier shown)
9397 750 14728 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 02 — 28 April 2005 2 of 16
Document Outline 1. General description 2. Features 3. Ordering information 4. Block diagram 5. Pinning information 5.1 Pinning 5.2 Pin description 6. Internal circuitry 7. Limiting values 8. Thermal characteristics 8.1 Thermal protection 9. Characteristics 10. Application information 10.1 Cathode output 10.2 Flashover protection 10.3 Switch-off behavior 10.4 Bandwidth 10.5 Dissipation 11. Test information 11.1 Quality information 12. Package outline 13. Handling information 14. Soldering 14.1 Introduction to soldering through-hole mount packages 14.2 Soldering by dipping or by solder wave 14.3 Manual soldering 14.4 Package related soldering information 15. Revision history 16. Data sheet status 17. Definitions 18. Disclaimers 19. Contact information 20. Contents
VDD 6 MIRROR 1 MIRROR 5
TDA6107AJF
CASCODE 1 3× MIRROR 4 Voc(1), 9, 8, 7 CURRENT 1× Voc(2), SOURCE Voc(3) 1× Rf THERMAL PROTECTION VIP DIFFERENTIAL CIRCUIT REFERENCE STAGE Vi(1), 1, 2, 3 5 Vi(2), MIRROR 3 Iom V R i(3) i Ra 3× CASCODE 2 MIRROR 2 4 mce457
Fig 1. Block diagram (one amplifier shown)
9397 750 14728 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 02 — 28 April 2005 2 of 16
Document Outline 1. General description 2. Features 3. Ordering information 4. Block diagram 5. Pinning information 5.1 Pinning 5.2 Pin description 6. Internal circuitry 7. Limiting values 8. Thermal characteristics 8.1 Thermal protection 9. Characteristics 10. Application information 10.1 Cathode output 10.2 Flashover protection 10.3 Switch-off behavior 10.4 Bandwidth 10.5 Dissipation 11. Test information 11.1 Quality information 12. Package outline 13. Handling information 14. Soldering 14.1 Introduction to soldering through-hole mount packages 14.2 Soldering by dipping or by solder wave 14.3 Manual soldering 14.4 Package related soldering information 15. Revision history 16. Data sheet status 17. Definitions 18. Disclaimers 19. Contact information 20. Contents