Datasheet ADR1001 (Analog Devices)

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ADR1001
Oven-Controlled, Buried Zener, Precision Voltage Reference
FEATURES
The on-chip heater, combined with Analog Devices buried Zener technology, allows the ADR1001 to achieve sub-ppm temperature ► LTZ1000-class, ultrastable, 6.6 V, buried Zener reference coefficient performance and single-digit ppm long-term drift per- ► On-chip, thermally regulated, matched resistor-dividers formance. Besides providing best-in-class precision in all vectors, ► Precision 5 V output ±0.25% (R the ADR1001 incorporates ease-of-use features to reduce cost and ISET = 102 Ω, TJ = 70°C) ► 5 V output noise (0.1 Hz to 10 Hz): 0.13 ppm p-p design-in effort. These features include a pin-programmable internal thermostat, resistor-programmable heater current limit, open-collec- ► Zener, thermal loop op amps, and buffer provided on chip tor power-good flag pin, hermetic surface-mount package, and an ► Input voltage range: 9 V to 36 V extra matched resistor pair. By default, the temperature setpoint is ► Hermetic, surface-mount package, 20-terminal LCC 70°C when no external resistor is connected to the TSET pin, and ► Ovenization ensures ultra-low temperature drift the internal heater current limit is 100 mA with HTR_ILIM shorted to HTR_GND.
APPLICATIONS
The integrated thin-film resistors and on-chip buffer can be used ► Calibration equipment to provide standard output voltage reference values that are com- ► Benchtop digital multimeters patible with modern precision converters. The ADR1001 divider ► Automated test equipment (ATE) network and output buffer combination is trimmed to within ±0.25% initial accuracy. In addition, a pair of matched resistors is also ► Precision data acquisition systems (DAS) included on-chip, allowing customers to easily generate a negative ► Stationary high-precision measurement devices voltage reference or a gain of 2 with minimal impact to the output
GENERAL DESCRIPTION
accuracy or drift. The ADR1001 is packaged in a hermetic, ceramic, 20-terminal The ADR1001 is a fully integrated, ultra-low drift, buried Zener pre- leadless chip carrier (LCC). The surface-mount ceramic package al- cision voltage reference solution in a single chip. By integrating the lows customers to eliminate the through-hole component soldering entire signal conditioning circuitry required by the LTZ1000 into a step while still retaining the hermetic seal of a classic through-hole single chip, the ADR1001 provides a significant reduction in overall metal can package. solution area, while simplifying the design process by eliminating the many challenges of building a discrete circuit solution.
FUNCTIONAL BLOCK DIAGRAM Figure 1. Functional Block Diagram, Including Surrounding Schematic, Showing Split Supply Heater Operation and 10 V Reference Output Rev. 0 DOCUMENT FEEDBACK
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TECHNICAL SUPPORT
registered trademarks are the property of their respective owners. Document Outline Features Applications General Description Functional Block Diagram Specifications 6.6 V Reference Characteristics Heater Amplifier Electrical Characteristics 5 V Output and Buffer Electrical Characteristics Voltage Divider Characteristics Absolute Maximum Ratings Thermal Resistance Electrostatic Discharge (ESD) Ratings ESD Ratings for the ADR1001 ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Theory of Operation Buried Zener Reference Loop Thermal Regulator Heater Current Limiting Setting the ADR1001 Operating Temperature Precision Voltage Divider and Output Buffer Power Good External Resistor Sensitivity Capacitors Noise Performance Electromechanical Stability Solder Heat Resistance (SHR) Shift Applications Information Basic Connections Outline Dimensions Ordering Guide Evaluation Boards