Datasheet KMA210 (NXP) - 5
制造商 | NXP |
描述 | Programmable Angle Sensor |
页数 / 页 | 37 / 5 — NXP Semiconductors. KMA210. Programmable angle sensor. Fig 2. Angular … |
文件格式/大小 | PDF / 586 Kb |
文件语言 | 英语 |
NXP Semiconductors. KMA210. Programmable angle sensor. Fig 2. Angular measurement directions. 6. Analog. output. Table 3
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NXP Semiconductors KMA210 Programmable angle sensor
α Hext 001aan665
Fig 2. Angular measurement directions
Since the Anisotropic MR (AMR) effect is periodic over 180, the sensor output is also 180-periodic, where the angle is calculated relative to a freely programmable zero angle. The dashed line indicates the mechanical zero degree position.
6. Analog output
The KMA210 provides one analog output signal on pin OUT/DATA. The measured angle is converted linearly into a value, which is ratiometric to the supply voltage VDD. Either a positive or a negative slope is provided for this purpose. Table 3 describes the analog output behavior for a positive slope. If for example, a magnetic field angle, above the programmed maximum angle max, but below the clamp switch angle sw(CL) is applied to the sensor, then analog output is set to the upper clamping voltage. If the magnetic field angle is larger than the clamp switch angle, the analog output switches from upper to lower clamping voltage. In the case of a negative slope, the clamping voltages are changed.
Table 3. Analog output behavior for a positive slope Magnetic field angle Analog output
max < < sw(CL) V(CL)u sw(CL) < < ref + 180 V(CL)l The analog output voltage range encodes both angular and diagnostic information. A valid angle value is between the upper and lower clamping voltage. If the analog output is in the diagnostic range, that is below 4 %VDD or above 96 %VDD, an error condition has been detected. The analog output repeats every 180. KMA210 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 7 December 2011 5 of 37
Document Outline 1. Product profile 1.1 General description 1.2 Features and benefits 2. Pinning information 3. Ordering information 4. Functional diagram 5. Functional description 5.1 Angular measurement directions 6. Analog output 7. Diagnostic features 7.1 CRC and EDC supervision 7.2 Magnet-loss detection 7.3 Power-loss detection 7.4 Broken bond wire detection 7.5 Low supply voltage detection and overvoltage protection 8. Limiting values 9. Recommended operating conditions 10. Thermal characteristics 11. Characteristics 12. Definition of errors 12.1 General 12.2 Hysteresis error 12.3 Linearity error 12.4 Microlinearity error 12.5 Temperature drift error 12.6 Angular error 13. Programming 13.1 General description 13.2 Timing characteristics 13.3 Sending and receiving data 13.3.1 Write access 13.3.2 Read access 13.3.3 Entering the command mode 13.4 Cyclic redundancy check 13.4.1 Software example in C 13.5 Registers 13.5.1 Command registers 13.5.2 Non-volatile memory registers 14. Electromagnetic compatibility 14.1 Emission (CISPR 25) 14.1.1 Conducted radio disturbance 14.1.2 Radiated radio disturbance 14.2 Radiated disturbances (ISO 11452-1 third edition (2005-02), ISO 11452-2, ISO 11452-4 and ISO 11452-5) 14.2.1 Absorber lined shielded enclosure 14.2.2 Bulk-current injection 14.2.3 Strip line 14.2.4 Immunity against mobile phones 14.3 Electrical transient transmission by capacitive coupling [ISO 7637-3, second edition (2007-07)] 15. ElectroStatic Discharge (ESD) 15.1 Human body model (AEC-Q100-002) 15.2 Human metal model (ANSI/ESD SP5.6-2009) 15.3 Machine model (AEC-Q100-003) 15.4 Charged-device model (AEC-Q100-011) 16. Application information 17. Test information 17.1 Quality information 18. Marking 19. Terminals 20. Package outline 21. Handling information 22. Solderability information 23. Revision history 24. Legal information 24.1 Data sheet status 24.2 Definitions 24.3 Disclaimers 24.4 Trademarks 25. Contact information 26. Contents