Datasheet FFB2222A, FMB2222A, MMPQ2222A (ON Semiconductor) - 9
| 制造商 | ON Semiconductor |
| 描述 | NPN Multi-Chip General-Purpose Amplifier |
| 页数 / 页 | 11 / 9 — SYMM. 0.95 C. 3.00. 2.80 A. 4 6 0.95 1.00 MIN B 3.00. 2.60. 1.70. 1.50 1 … |
| 文件格式/大小 | PDF / 672 Kb |
| 文件语言 | 英语 |
SYMM. 0.95 C. 3.00. 2.80 A. 4 6 0.95 1.00 MIN B 3.00. 2.60. 1.70. 1.50 1 2.60 C 3. 0.50
该数据表的模型线
文件文字版本
SYMM
C
L
0.95 C
3.00
2.80 A
4 6 0.95 1.00 MIN B 3.00
2.60
1.70
1.50 1 2.60 C 3
0.50
0.30 0.95 0.20 1.90 M 0.70 MIN A B LAND PATTERN RECOMMENDATION (0.30) SEE DETAIL A 1.10 MAX
H 1.00
0.70
C
0.10
0.00 0.10 C GAGE PLANE
0.25
8°
0°
0.55
0.35 SEATING PLANE
0.60 REF DETAIL A
SCALE: 50X 0.20
0.08
NOTES: UNLESS OTHERWISE SPECIFIED
A) THIS PACKAGE CONFORMS TO JEDEC MO-193.
VAR. AA, ISSUE E.
B) ALL DIMENSIONS ARE IN MILLIMETERS.
C PACKAGE LENGTH DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS. MOLD
FLASH, PROTRUSIONS OR GATE BURRS SHALL
NOT EXCEED 0.25mm PER END. PACKAGE WIDTH
DOES NOT INCLUDE INTERLEAD FLASH OR
PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25mm PER
SIDE. PACKAGE LENGTH AND WIDTH DIMENSIONS
ARE DETERMINED AT DATUM H.
D) DRAWING FILE NAME: MKT-MA06AREVF
C
L
0.95 C
3.00
2.80 A
4 6 0.95 1.00 MIN B 3.00
2.60
1.70
1.50 1 2.60 C 3
0.50
0.30 0.95 0.20 1.90 M 0.70 MIN A B LAND PATTERN RECOMMENDATION (0.30) SEE DETAIL A 1.10 MAX
H 1.00
0.70
C
0.10
0.00 0.10 C GAGE PLANE
0.25
8°
0°
0.55
0.35 SEATING PLANE
0.60 REF DETAIL A
SCALE: 50X 0.20
0.08
NOTES: UNLESS OTHERWISE SPECIFIED
A) THIS PACKAGE CONFORMS TO JEDEC MO-193.
VAR. AA, ISSUE E.
B) ALL DIMENSIONS ARE IN MILLIMETERS.
C PACKAGE LENGTH DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS. MOLD
FLASH, PROTRUSIONS OR GATE BURRS SHALL
NOT EXCEED 0.25mm PER END. PACKAGE WIDTH
DOES NOT INCLUDE INTERLEAD FLASH OR
PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25mm PER
SIDE. PACKAGE LENGTH AND WIDTH DIMENSIONS
ARE DETERMINED AT DATUM H.
D) DRAWING FILE NAME: MKT-MA06AREVF