Datasheet CRCW0603 (Vishay) - 8
| 制造商 | Vishay |
| 描述 | Lead (Pb)-Bearing Thick Film Chip Resistors |
| 页数 / 页 | 10 / 8 — D/CRCW. TEST PROCEDURES AND REQUIREMENTS. REQUIREMENTS PERMISSIBLE. … |
| 文件格式/大小 | PDF / 135 Kb |
| 文件语言 | 英语 |
D/CRCW. TEST PROCEDURES AND REQUIREMENTS. REQUIREMENTS PERMISSIBLE. CHANGE (. IEC. PROCEDURE. 60068-2
该数据表的模型线
文件文字版本
D/CRCW
www.vishay.com Vishay
TEST PROCEDURES AND REQUIREMENTS REQUIREMENTS PERMISSIBLE CHANGE (
Δ
R ) IEC EN PROCEDURE 60068-2 STABILITY CLASS 1 STABILITY CLASS 2 60115-1 (1) TEST TEST OR BETTER OR BETTER CLAUSE METHOD
Stability for product types: 1 Ω to 10 MΩ
D/CRCW
U = 15 x P x R 70 or ≤ 2 x U ± (1 % R + 0.05 Ω) 8.4 - Periodic electric overload max.; whichever is the less severe; no visible damage 0.1 s on; 2.5 s off; 1000 cycles IEC 61340-3-1 (1); Electrostatic discharge 8.5 - 3 positive + 3 negative discharges; ± (1 % R + 0.05 Ω) (human body model) ESD voltage acc. to size Endurance by sweeping; 10 Hz to 2000 Hz; ± (0.25 % R + 0.05 Ω) ± (0.5 % R + 0.05 Ω) 9.11 6 (Fc) Vibration no resonance; no visible damage no visible damage amplitude ≤ 1.5 mm or ≤ 200 m/s2; 7.5 h Solder bath method, Sn60Pb40; non-activated flux (235 ± 5) °C; (2 ± 0.2) s Good tinning (≥ 95 % covered); 11.1 58 (Td) Solderability Solder bath method, no visible damage Sn96.5Ag3Cu0.5 or Sn99.3Cu0.7 non-activated flux (245 ± 5) °C; (3 ± 0.3) s Resistance to Soldering bath method; 11.2 58 (Td) ± (0.25 % R + 0.05 Ω) ± (0.5 % R + 0.05 Ω) soldering heat (260 ± 5) °C; (10 ± 1) s Component solvent 11.3 45 (XA) Isopropyl alcohol; +50 °C; method 2 No visible damage resistance D11/CRCW0603 and smaller: 9 N 9.7 21 (Ue3) Shear (adhesion) No visible damage D12/CRCW0805 to CRCW2512: 45 N ± (0.25 % R + 0.05 Ω) 9.8 21 (Uu1) Substrate bending Depth 2 mm; 3 times no visible damage, no open circuit in bent position 12.2 - Voltage proof U = 1.4 x Uins; 60 s No flashover or breakdown Flammability, IEC 60695-11-5 (1); 12.4 - No burning after 30 s needle flame test 10 s
Note
(1) The quoted IEC standards are also released as EN standards with the same number and identical contents Revision: 09-Jul-2024
8
Document Number: 20008 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
www.vishay.com Vishay
TEST PROCEDURES AND REQUIREMENTS REQUIREMENTS PERMISSIBLE CHANGE (
Δ
R ) IEC EN PROCEDURE 60068-2 STABILITY CLASS 1 STABILITY CLASS 2 60115-1 (1) TEST TEST OR BETTER OR BETTER CLAUSE METHOD
Stability for product types: 1 Ω to 10 MΩ
D/CRCW
U = 15 x P x R 70 or ≤ 2 x U ± (1 % R + 0.05 Ω) 8.4 - Periodic electric overload max.; whichever is the less severe; no visible damage 0.1 s on; 2.5 s off; 1000 cycles IEC 61340-3-1 (1); Electrostatic discharge 8.5 - 3 positive + 3 negative discharges; ± (1 % R + 0.05 Ω) (human body model) ESD voltage acc. to size Endurance by sweeping; 10 Hz to 2000 Hz; ± (0.25 % R + 0.05 Ω) ± (0.5 % R + 0.05 Ω) 9.11 6 (Fc) Vibration no resonance; no visible damage no visible damage amplitude ≤ 1.5 mm or ≤ 200 m/s2; 7.5 h Solder bath method, Sn60Pb40; non-activated flux (235 ± 5) °C; (2 ± 0.2) s Good tinning (≥ 95 % covered); 11.1 58 (Td) Solderability Solder bath method, no visible damage Sn96.5Ag3Cu0.5 or Sn99.3Cu0.7 non-activated flux (245 ± 5) °C; (3 ± 0.3) s Resistance to Soldering bath method; 11.2 58 (Td) ± (0.25 % R + 0.05 Ω) ± (0.5 % R + 0.05 Ω) soldering heat (260 ± 5) °C; (10 ± 1) s Component solvent 11.3 45 (XA) Isopropyl alcohol; +50 °C; method 2 No visible damage resistance D11/CRCW0603 and smaller: 9 N 9.7 21 (Ue3) Shear (adhesion) No visible damage D12/CRCW0805 to CRCW2512: 45 N ± (0.25 % R + 0.05 Ω) 9.8 21 (Uu1) Substrate bending Depth 2 mm; 3 times no visible damage, no open circuit in bent position 12.2 - Voltage proof U = 1.4 x Uins; 60 s No flashover or breakdown Flammability, IEC 60695-11-5 (1); 12.4 - No burning after 30 s needle flame test 10 s
Note
(1) The quoted IEC standards are also released as EN standards with the same number and identical contents Revision: 09-Jul-2024
8
Document Number: 20008 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000