数据表Datasheet ESP32-H2-WROOM-07 (Espressif)
Datasheet ESP32-H2-WROOM-07 (Espressif)
制造商 | Espressif |
描述 | Bluetooth Low Energy and IEEE 802.15.4 module |
页数 / 页 | 39 / 1 — ESP32-H2-WROOM-07. Datasheet. Version. 1.0. Bluetooth®. Low. Energy. and. … |
文件格式/大小 | PDF / 594 Kb |
文件语言 | 英语 |
ESP32-H2-WROOM-07. Datasheet. Version. 1.0. Bluetooth®. Low. Energy. and. IEEE. 802.15.4. module. Built. around. ESP32-H2. series. of. SoCs,. RISC-V
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ESP32-H2-WROOM-07 Datasheet Version 1.0 Bluetooth® Low Energy and IEEE 802.15.4 module Built around ESP32-H2 series of SoCs, RISC-V single-core 32-bit microprocessor 2 MB or 4 MB flash in chip package 3 GPIOs Monopole antenna ESP32-H2-WROOM-07 www.espressif.com Document Outline 1 Module Overview 1.1 Features 1.2 Series Comparison 1.3 Applications 2 Block Diagram 3 Pin Definitions 3.1 Pin Layout 3.2 Pin Description 4 Boot Configurations 4.1 Chip Boot Mode Control 4.2 ROM Messages Printing Control 4.3 JTAG Signal Source Control 5 Peripherals 5.1 Peripheral Overview 5.2 Peripheral Description 5.2.1 Connectivity Interfaces 5.2.1.1 UART Controller 5.2.1.2 SPI Controller 5.2.1.3 I2C Controller 5.2.1.4 I2S Controller 5.2.1.5 Pulse Count Controller 5.2.1.6 USB Serial/JTAG Controller 5.2.1.7 Two-wire Automotive Interface 5.2.1.8 LED PWM Controller 5.2.1.9 Motor Control PWM 5.2.1.10 Remote Control Peripheral 5.2.1.11 Parallel IO Controller 5.2.2 Analog Signal Processing 5.2.2.1 SAR ADC 5.2.2.2 Temperature Sensor 5.2.2.3 Analog PAD Voltage Comparator 6 Electrical Characteristics 6.1 Absolute Maximum Ratings 6.2 Recommended Operating Conditions 6.3 DC Characteristics (3.3 V, 25 °C) 6.4 Current Consumption Characteristics 6.4.1 Current Consumption in Active Mode 6.4.2 Current Consumption in Other Modes 7 RF Characteristics 7.1 Bluetooth LE Radio 7.1.1 Bluetooth LE RF Transmitter (TX) Characteristics 7.1.2 Bluetooth LE RF Receiver (RX) Characteristics 7.2 802.15.4 Radio 7.2.1 802.15.4 RF Transmitter (TX) Characteristics 7.2.2 802.15.4 RF Receiver (RX) Characteristics 8 Module Schematics 9 Peripheral Schematics 10 Module Dimensions 11 PCB Layout Recommendations 11.1 PCB Land Pattern 11.2 Module Placement for PCB Design 12 Product Handling 12.1 Storage Conditions 12.2 Electrostatic Discharge (ESD) 12.3 Soldering Profile 12.3.1 Wave Profile 12.4 Ultrasonic Vibration Related Documentation and Resources Revision History