Datasheet TLV9152 (Texas Instruments) - 6
| 制造商 | Texas Instruments |
| 描述 | Dual, 16-v, 4.5-mhz, Low-power Operational Amplifier |
| 页数 / 页 | 82 / 6 — TLV9151, TL. V9152,. TLV9154. www.ti.com. Figure 5-4. TLV9152 D, DDF, … |
| 文件格式/大小 | PDF / 6.5 Mb |
| 文件语言 | 英语 |
TLV9151, TL. V9152,. TLV9154. www.ti.com. Figure 5-4. TLV9152 D, DDF, DGK, and PW Package. 8-Pin SOIC, SOT-23, TSSOP, and VSSOP
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TLV9151, TL V9152, TLV9154
SBOS986E – OCTOBER 2019 – REVISED JANUARY 2022
www.ti.com
OUT1 1 8 V+ OUT1 1 8 V+ IN1 2 ± 7 OUT2 IN1 2 ± 7 OUT2 Thermal IN1+ 3 6 IN2± Pad IN1+ 3 6 IN2± V 4 ± 5 IN2+ V 4 ± 5 IN2+ Not to scale
Figure 5-4. TLV9152 D, DDF, DGK, and PW Package
Not to scale
8-Pin SOIC, SOT-23, TSSOP, and VSSOP
A. Connect thermal pad to V–. See Packages with and Exposed
(Top View)
Thermal Pad for more information.
Figure 5-5. TLV9152 DSG Package(A) 8-Pin WSON With Exposed Thermal Pad (Top View) Table 5-3. Pin Functions: TLV9152 PIN I/O DESCRIPTION NAME NO.
+IN A 3 I Noninverting input, channel A +IN B 5 I Noninverting input, channel B –IN A 2 I Inverting input, channel A –IN B 6 I Inverting input, channel B OUT A 1 O Output, channel A OUT B 7 O Output, channel B V+ 8 — Positive (highest) power supply V– 4 — Negative (lowest) power supply 6 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: TLV9151 TLV9152 TLV9154 Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Revision History 5 Pin Configuration and Functions 6 Specifications 6.1 Absolute Maximum Ratings 6.2 ESD Ratings 6.3 Recommended Operating Conditions 6.4 Thermal Information for Single Channel 6.5 Thermal Information for Dual Channel 6.6 Thermal Information for Quad Channel 6.7 Electrical Characteristics 6.8 Typical Characteristics 7 Detailed Description 7.1 Overview 7.2 Functional Block Diagram 7.3 Feature Description 7.3.1 EMI Rejection 7.3.2 Thermal Protection 7.3.3 Capacitive Load and Stability 7.3.4 Common-Mode Voltage Range 7.3.5 Phase Reversal Protection 7.3.6 Electrical Overstress 7.3.7 Overload Recovery 7.3.8 Typical Specifications and Distributions 7.3.9 Packages With an Exposed Thermal Pad 7.3.10 Shutdown 7.4 Device Functional Modes 8 Application and Implementation 8.1 Application Information 8.2 Typical Applications 8.2.1 Low-Side Current Measurement 8.2.1.1 Design Requirements 8.2.1.2 Detailed Design Procedure 8.2.1.3 Application Curves 9 Power Supply Recommendations 10 Layout 10.1 Layout Guidelines 10.2 Layout Example 11 Device and Documentation Support 11.1 Device Support 11.1.1 Development Support 11.1.1.1 TINA-TI™ (Free Software Download) 11.1.1.2 TI Precision Designs 11.2 Documentation Support 11.2.1 Related Documentation 11.3 Receiving Notification of Documentation Updates 11.4 Support Resources 11.5 Trademarks 11.6 Electrostatic Discharge Caution 11.7 Glossary 12 Mechanical, Packaging, and Orderable Information
SBOS986E – OCTOBER 2019 – REVISED JANUARY 2022
www.ti.com
OUT1 1 8 V+ OUT1 1 8 V+ IN1 2 ± 7 OUT2 IN1 2 ± 7 OUT2 Thermal IN1+ 3 6 IN2± Pad IN1+ 3 6 IN2± V 4 ± 5 IN2+ V 4 ± 5 IN2+ Not to scale
Figure 5-4. TLV9152 D, DDF, DGK, and PW Package
Not to scale
8-Pin SOIC, SOT-23, TSSOP, and VSSOP
A. Connect thermal pad to V–. See Packages with and Exposed
(Top View)
Thermal Pad for more information.
Figure 5-5. TLV9152 DSG Package(A) 8-Pin WSON With Exposed Thermal Pad (Top View) Table 5-3. Pin Functions: TLV9152 PIN I/O DESCRIPTION NAME NO.
+IN A 3 I Noninverting input, channel A +IN B 5 I Noninverting input, channel B –IN A 2 I Inverting input, channel A –IN B 6 I Inverting input, channel B OUT A 1 O Output, channel A OUT B 7 O Output, channel B V+ 8 — Positive (highest) power supply V– 4 — Negative (lowest) power supply 6 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: TLV9151 TLV9152 TLV9154 Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Revision History 5 Pin Configuration and Functions 6 Specifications 6.1 Absolute Maximum Ratings 6.2 ESD Ratings 6.3 Recommended Operating Conditions 6.4 Thermal Information for Single Channel 6.5 Thermal Information for Dual Channel 6.6 Thermal Information for Quad Channel 6.7 Electrical Characteristics 6.8 Typical Characteristics 7 Detailed Description 7.1 Overview 7.2 Functional Block Diagram 7.3 Feature Description 7.3.1 EMI Rejection 7.3.2 Thermal Protection 7.3.3 Capacitive Load and Stability 7.3.4 Common-Mode Voltage Range 7.3.5 Phase Reversal Protection 7.3.6 Electrical Overstress 7.3.7 Overload Recovery 7.3.8 Typical Specifications and Distributions 7.3.9 Packages With an Exposed Thermal Pad 7.3.10 Shutdown 7.4 Device Functional Modes 8 Application and Implementation 8.1 Application Information 8.2 Typical Applications 8.2.1 Low-Side Current Measurement 8.2.1.1 Design Requirements 8.2.1.2 Detailed Design Procedure 8.2.1.3 Application Curves 9 Power Supply Recommendations 10 Layout 10.1 Layout Guidelines 10.2 Layout Example 11 Device and Documentation Support 11.1 Device Support 11.1.1 Development Support 11.1.1.1 TINA-TI™ (Free Software Download) 11.1.1.2 TI Precision Designs 11.2 Documentation Support 11.2.1 Related Documentation 11.3 Receiving Notification of Documentation Updates 11.4 Support Resources 11.5 Trademarks 11.6 Electrostatic Discharge Caution 11.7 Glossary 12 Mechanical, Packaging, and Orderable Information