Datasheet SY58608U (Microchip) - 5
| 制造商 | Microchip |
| 描述 | 3.2 Gbps Precision, 1:2 LVDS Fanout Buffer with Internal Termination and Fail Safe Input |
| 页数 / 页 | 24 / 5 — SY58608U. TEMPERATURE SPECIFICATIONS. Parameters. Sym. Min. Typ. Max. … |
| 文件格式/大小 | PDF / 2.7 Mb |
| 文件语言 | 英语 |
SY58608U. TEMPERATURE SPECIFICATIONS. Parameters. Sym. Min. Typ. Max. Units. Conditions. Temperature Ranges
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SY58608U TEMPERATURE SPECIFICATIONS Parameters Sym. Min. Typ. Max. Units Conditions Temperature Ranges
Operating Ambient Temperature Range TA –40 — +85 °C — Maximum Junction Operating T Temperature J — — +125 °C — Storage Temperature Range TA –65 — +150 °C —
Package Thermal Resistances (Note 1)
Thermal Resistance, 3 x 3 QFN-16Ld JA — 60 — °C/W Still-air JB — 33 — °C/W Junction-to-board
Note 1:
Package thermal resistance assumes exposed pad is soldered (or equivalent) to the device's most negative potential on the PCB. JB and JA values are determined for a 4-layer board in still-air number, unless otherwise stated. 2018 Microchip Technology Inc. DS20005605A-page 5 Document Outline 1.0 Electrical Characteristics 2.0 Functional Description 2.1 Fail-Safe Input (FSI) 2.2 Input Clock Failure Case 3.0 Timing Diagrams 4.0 Typical Performance Curves 5.0 Additive Phase Noise Plot 6.0 Input Stage 7.0 Input Interface Applications 8.0 Pin Descriptions 9.0 Packaging Information 9.1 Package Marking Information Appendix A: Revision History Product Identification System Worldwide Sales and Service
SY58608U TEMPERATURE SPECIFICATIONS Parameters Sym. Min. Typ. Max. Units Conditions Temperature Ranges
Operating Ambient Temperature Range TA –40 — +85 °C — Maximum Junction Operating T Temperature J — — +125 °C — Storage Temperature Range TA –65 — +150 °C —
Package Thermal Resistances (Note 1)
Thermal Resistance, 3 x 3 QFN-16Ld JA — 60 — °C/W Still-air JB — 33 — °C/W Junction-to-board
Note 1:
Package thermal resistance assumes exposed pad is soldered (or equivalent) to the device's most negative potential on the PCB. JB and JA values are determined for a 4-layer board in still-air number, unless otherwise stated. 2018 Microchip Technology Inc. DS20005605A-page 5 Document Outline 1.0 Electrical Characteristics 2.0 Functional Description 2.1 Fail-Safe Input (FSI) 2.2 Input Clock Failure Case 3.0 Timing Diagrams 4.0 Typical Performance Curves 5.0 Additive Phase Noise Plot 6.0 Input Stage 7.0 Input Interface Applications 8.0 Pin Descriptions 9.0 Packaging Information 9.1 Package Marking Information Appendix A: Revision History Product Identification System Worldwide Sales and Service