Datasheet TB67S559FTG (Toshiba) - 4

TB67S559FTG Note: All the grounding wires should be solid patterns and be externally terminated at only one point. Also, a grounding method should be considered for efficient heat dissipation. Careful attention should be paid to the layout of the output, VM and GND traces, to avoid short circuits across output pins or to the power supply or ground. If such a short circuit occurs, the device may be permanently damaged. Also, the utmost care should be taken for pattern designing and implementation of the device since it has power supply pins (VM, OUTA1, OUTA2, OUTB1, OUTB2, AGND, PGND, RSGND_A and RSGND_B) through which a particularly large current may run. If these pins are wired incorrectly, an operation error may occur or the device may be destroyed. The logic input pins must also be wired correctly. Otherwise, the device may be damaged owing to a current running through the IC that is larger than the specified current. Careful attention should be paid to design patterns and mounting. © 2 024 4 2024-10-09 Toshiba Electronic Devices & Storage Corporation Rev.2.0 Document Outline BiCD constant-current 2-phase bipolar stepping motor driver IC 1. Description 2. Features 3. Pin assignment 4. Block diagram 5. Pin Description 6. Input / Output Equivalent Circuit 7. Functional Description 7.1. Function of SLEEP_X 7.2. Function of CLK 7.3. Function of ENABLE 7.4. Function of CW/CCW 7.5. Function of DMODE0, DMODE1,DMODE2 7.6. Sequence by drive mode in clock input control mode 7.7. Excitation method and set current value 7.8. Selectable Mixed Decay Function 7.9. Mixed Decay current waveform 1 7.10. For each time of constant-current PWM operation 7.11. Mixed Decay current waveform 2 7.12. ADMD (Advanced Dynamic Mixed Decay) Constant current control 7.13. ADMD (Advanced Dynamic Mixed Decay) current waveform 1 7.14. ADMD (Advanced Dynamic Mixed Decay) current waveform 2 7.15. Function of RESET 7.16. Torque Function 7.17. Function of MO 7.18. LO (error detection flag output) Function 8. Output stage transistor operation mode (Advanced Dynamic Mixed Decay) 8.1. Functions of output stage transistor operation 9. About the set current value (IOUT) 10. About chopping frequency (fCHOP) 11. Power Consumption of IC 11.1. Power consumption of power transistor section 11.2. Power consumption of logic and IM systems 11.3. Power consumption 12. About the detection function 13. Overheat detection (This function is a latch type that maintains operation at the time of detection.) 14. Overcurrent detection (This function is a latch type that maintains operation at the time of detection.) 15. Absolute Maximum Ratings (Ta = 25 C) 16. PD-Ta graph (for reference) 17. Operating range (Ta = -40 to 85 C) 18. Electrical Specifications 18.1. Electrical Specifications 1(Ta = 25 C, VM = 24 V unless otherwise specified) 18.2. Electrical Specifications 2 (Ta = 25 C, VM = 24 V unless otherwise specified) 18.2.1. With respect to back EMF 18.2.2. Overcurrent and overheat detection 18.2.3. Handling of ICs 19. AC electrical characteristics (Ta = 25 C, VM = 24V) 20. AC Characteristics Timing Chart 21. Application Circuit Example 22. Package Information 23. Notes on Contents 24. IC Usage Considerations 24.1. Notes on Handling of ICs 24.2. Points to Remember on Handling of ICs RESTRICTIONS ON PRODUCT USE