LT8625S ELECTRICAL CHARACTERISTICSThe l denotes the specifications which apply over the full operatingtemperature range, otherwise specifications are at TA = 25°C.PARAMETERCONDITIONSMINTYPMAXUNITS Power MOSFET On-Resistance Main Switch (Top) 35 mΩ Synchronous Switch (Bottom) 15 mΩ EN/UVLO Threshold EN/UVLO Rising l 1.27 1.32 1.37 V EN/UVLO Hysteresis 50 mV EN/UVLO Input Current VEN/UVLO = 2V –40 40 nA EN Delay Time (Note 5, 12) SVIN = 12V, CVCC = 1µF (internal) +1µF (external), RC = 500R, CC = 10nF, 150 µs CSET = 2.2µF PHMODE Thresholds Between 180 and 120 0.7 1.5 V Between 120 and 90 2.0 2.7 V Note 1: Stresses beyond those listed under Absolute Maximum Ratings Note 5: Not subject to production test. may cause permanent damage to the device. Exposure to any Absolute Note 6: OUTS ties directly to VOUT. Maximum Rating condition for extended periods may affect device Note 7: Adding a capacitor across the SET pin resistor decreases output reliability and lifetime. voltage noise. Adding this capacitor bypasses the SET pin resistor’s Note 2: The LT8625SI is guaranteed over the full –40°C to 125°C thermal noise as well as the reference current’s noise. Use of a SET pin operating junction temperature range. High junction temperatures degrade bypass capacitor also increases start-up time. operating lifetimes. Operating lifetime is derated at junction temperatures Note 8: Minimum SVIN can increase with OUTS once OUTS is above a greater than 125°C. The junction temperature (TJ, in °C) is calculated from certain value. Refer to the Typical Characteristics curves for how this the ambient temperature (TA in °C) and power dissipation (PD, in Watts) parameter changes with OUTS. according to the formula: Note 9: The PNP-based input pair is active for the error amplifier as long as TJ = TA + (PD • θJA) SVIN is at least 1V above VSET. As SVIN drops to less than 1V above VSET, the where θJA (in °C/W) is the package thermal impedance. part gradually transitions to operating with the NPN-based input pair active. Note 3: θ values determined per JEDEC 51-7, 51-12. See the Applications Note 10: The LT8625S is tested in a feedback loop that servos VC to a Information for information on improving the thermal resistance and specified voltage and measures the resultant VOUTS. for actual temperature measurements of a demo board in typical Note 11: The start-up time is defined as the time it takes from the EN/UVLO operating conditions. pin rising above the EN/UVLO threshold to when VOUT has reached 90% of Note 4: This IC includes overtemperature protection that is intended to final value. protect the device during overload conditions. Junction temperature will Note 12: EN Delay Time is the time from EN/UVLO high to first switching exceed 150°C temperature when overtemperature protection is active. cycle. Continuous operation above the specified maximum operating junction temperature will reduce lifetime. TYPICAL PERFORMANCE CHARACTERISTICS TA = 25°C, unless otherwise noted.Integrated RMS Output NoiseIntegrated RMS Output NoiseIntegrated RMS Output Noise vsvs Load (10Hz to 100kHz)vs CSET (10Hz to 100kHz)VIN (10Hz to 100kHz) 16 12 16 f V SW = 2MHz fSW = 2MHz OUT = 1V 11 14 f V SW = 4MHz fSW = 4MHz OUT = 3.3V 14 ) 10 ) fSW = 2MHz, ILOAD = 2A 12 9 12 V V RMS V RMS IN = SVIN = PVIN V RMS 8 10 10 7 8 6 8 5 6 6 4 WHEN VIN – VOUT < 1V 4 3 SWAPS TO NPN ERROR AMPLIFIER 4 RMS OUTPUT NOISE (µ RMS OUTPUT NOISE (µ RMS OUTPUT NOISE (µ 2 2 2 SV 1 IN = PVIN = 12V SVIN = PVIN = 12V 0 0 0 1 2 3 4 5 6 7 8 0.1 1 10 2 3 4 5 6 7 8 9 10 11 12 LOAD CURRENT (A) SET PIN CAPACITANCE (µF) VIN (V) 8625s G01 8625s G02 8625s G03 REFER TO TYPICAL APPLICATION REFER TO TYPICAL APPLICATION REFER TO TYPICAL APPLICATION CIRCUITS TA03 (2MHz) AND TA02 (4MHz) CIRCUITS TA03 (2MHz) AND TA02 (4MHz) CIRCUITS TA03 (1V) AND TA07 (3.3V) Rev. B 4 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Pin Configuration Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Applications Package Description Typical Application Related Parts