EPC2103 – Enhancement-Mode GaN Power Transistor Half BridgePreliminary Specification SheetRECOMMENDED LAND PATTERN (Units in µm)RECOMMENDED STENCIL DESIGN (Units in µm)Recommended stencil should be 4mil (100µm) thick, must be laser cut, openings per drawing. Intended for use with SAC305 Type 4 solder, reference 88.5% metals content Additional assembly resources available at http://epc-co.com/epc/DesignSupport/AssemblyBasics.aspx Subject to Change without Notice www.epc-co.com COPYRIGHT 2015 Page 9