Datasheet BAV99 (NXP) - 7
| 制造商 | NXP |
| 描述 | High-speed switching diodes |
| 页数 / 页 | 14 / 7 — NXP Semiconductors. BAV99 series. High-speed switching diodes. 9. … |
| 文件格式/大小 | PDF / 341 Kb |
| 文件语言 | 英语 |
NXP Semiconductors. BAV99 series. High-speed switching diodes. 9. Package. outline. Fig 7. Package outline BAV99 (SOT23/TO-236AB)
该数据表的模型线
文件文字版本
link to page 7 link to page 7 link to page 7 link to page 13
NXP Semiconductors BAV99 series High-speed switching diodes 9. Package outline
2.2 1.1 3.0 1.1 1.8 0.8 2.8 0.9
6 5 4
0.45
3
0.15 0.45 0.15 2.5 1.4 2.2 1.35 2.1 1.2 2.0 1.15 pin 1 index
1 2 1 2 3
0.48 0.15 0.3 0.25 0.65 0.38 0.09 0.2 0.10 1.9 1.3 Dimensions in mm 04-11-04 Dimensions in mm 06-03-16
Fig 7. Package outline BAV99 (SOT23/TO-236AB) Fig 8. Package outline BAV99S (SOT363/SC-88)
2.2 1.1 1.8 0.8 0.45
3
0.15 2.2 1.35 2.0 1.15
1 2
0.4 0.25 0.3 0.10 1.3 Dimensions in mm 04-11-04
Fig 9. Package outline BAV99W (SOT323/SC-70) 10. Packing information Table 9. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number Package Description Packing quantity 3000 10000
BAV99 SOT23 4 mm pitch, 8 mm tape and reel -215 -235 BAV99S SOT363 4 mm pitch, 8 mm tape and reel; T1 [2] -115 -135 4 mm pitch, 8 mm tape and reel; T2 [3] -125 -165 BAV99W SOT323 4 mm pitch, 8 mm tape and reel -115 -135 [1] For further information and the availability of packing methods, see Section 14. [2] T1: normal taping [3] T2: reverse taping BAV99_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 8 — 18 November 2010 7 of 14
Document Outline 1. Product profile 1.1 General description 1.2 Features and benefits 1.3 Applications 1.4 Quick reference data 2. Pinning information 3. Ordering information 4. Marking 5. Limiting values 6. Thermal characteristics 7. Characteristics 8. Test information 8.1 Quality information 9. Package outline 10. Packing information 11. Soldering 12. Revision history 13. Legal information 13.1 Data sheet status 13.2 Definitions 13.3 Disclaimers 13.4 Trademarks 14. Contact information 15. Contents
NXP Semiconductors BAV99 series High-speed switching diodes 9. Package outline
2.2 1.1 3.0 1.1 1.8 0.8 2.8 0.9
6 5 4
0.45
3
0.15 0.45 0.15 2.5 1.4 2.2 1.35 2.1 1.2 2.0 1.15 pin 1 index
1 2 1 2 3
0.48 0.15 0.3 0.25 0.65 0.38 0.09 0.2 0.10 1.9 1.3 Dimensions in mm 04-11-04 Dimensions in mm 06-03-16
Fig 7. Package outline BAV99 (SOT23/TO-236AB) Fig 8. Package outline BAV99S (SOT363/SC-88)
2.2 1.1 1.8 0.8 0.45
3
0.15 2.2 1.35 2.0 1.15
1 2
0.4 0.25 0.3 0.10 1.3 Dimensions in mm 04-11-04
Fig 9. Package outline BAV99W (SOT323/SC-70) 10. Packing information Table 9. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number Package Description Packing quantity 3000 10000
BAV99 SOT23 4 mm pitch, 8 mm tape and reel -215 -235 BAV99S SOT363 4 mm pitch, 8 mm tape and reel; T1 [2] -115 -135 4 mm pitch, 8 mm tape and reel; T2 [3] -125 -165 BAV99W SOT323 4 mm pitch, 8 mm tape and reel -115 -135 [1] For further information and the availability of packing methods, see Section 14. [2] T1: normal taping [3] T2: reverse taping BAV99_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 8 — 18 November 2010 7 of 14
Document Outline 1. Product profile 1.1 General description 1.2 Features and benefits 1.3 Applications 1.4 Quick reference data 2. Pinning information 3. Ordering information 4. Marking 5. Limiting values 6. Thermal characteristics 7. Characteristics 8. Test information 8.1 Quality information 9. Package outline 10. Packing information 11. Soldering 12. Revision history 13. Legal information 13.1 Data sheet status 13.2 Definitions 13.3 Disclaimers 13.4 Trademarks 14. Contact information 15. Contents