Datasheet AD8675 (Analog Devices) - 5

Data Sheet AD8675 ABSOLUTE MAXIMUM RATINGS Table 4. THERMAL RESISTANCE Parameter Rating
θJA is specified for the worst-case conditions, that is, a device Supply Voltage ±18 V soldered in a circuit board for surface-mount packages and Input Voltage ±V supply measured using a standard 4-layer board, unless otherwise Input Current ±5 mA specified. Differential Input Voltage ±0.7 V Output Short-Circuit Duration to GND Indefinite
Table 5. Thermal Resistance
Storage Temperature Range
Package Type θ θ Unit JA JC
RM-8, R-8 Packages −65°C to +150°C 8-Lead MSOP (RM-8) 142 45 °C/W Operating Temperature Range −40°C to +125°C 8-Lead SOIC_N (R-8) 120 45 °C/W Junction Temperature Range
POWER SEQUENCING
RM-8, R-8 Packages −65°C to +150°C Lead Temperature Range (Soldering, 10 sec) 300°C Establish the op amp supplies simultaneously with, or before, any input signals are applied. If this is not possible, the input NULL Pins (Pin 1, Pin 8), Input Current Maximum <50 µA, V < V+ S current must be limited to 10 mA. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any
ESD CAUTION
other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rev. E | Page 5 of 12 Document Outline Features Applications General Description Pin Configurations Table of Contents Revision History Specifications Electrical Specifications Absolute Maximum Ratings Thermal Resistance Power Sequencing ESD Caution Typical Performance Characteristics Test Circuit Outline Dimensions Ordering Guide