Datasheet MCP6561, MCP6561R, MCP6561U, MCP6562, MCP6564 (Microchip) - 7
制造商 | Microchip |
描述 | 1.8V Low-Power Push-Pull Output Comparator |
页数 / 页 | 46 / 7 — MCP6561/1R/1U/2/4. Note:. 3.0. 5.0. TA= +125°C. 2.0. 4.0. A= +85°C. 1.0. … |
文件格式/大小 | PDF / 1.2 Mb |
文件语言 | 英语 |
MCP6561/1R/1U/2/4. Note:. 3.0. 5.0. TA= +125°C. 2.0. 4.0. A= +85°C. 1.0. A= -40°C. A= +25°C. 0.0. (m 3.0. YST. -1.0. -2.0. -3.0. 1.5. 2.5. 3.5. 4.5. 5.5. VDD (V)
该数据表的模型线
文件文字版本
MCP6561/1R/1U/2/4 Note:
Unless otherwise indicated, VDD = +1.8V to +5.5V, VSS = GND, TA = +25°C, VIN+ = VDD/2, VIN– = GND, RL = 10 k to VDD/2, and CL = 25 pF.
3.0 5.0 TA= +125°C 2.0 T 4.0 A= +85°C T ) 1.0 A= -40°C V T V) T A= +25°C A= +25°C T (m 0.0 A= +85°C (m 3.0 TA= +125°C T OS YST A= -40°C V H -1.0 V 2.0 -2.0 -3.0 1.0 1.5 2.5 3.5 4.5 5.5 1.5 2.5 3.5 4.5 5.5 VDD (V) VDD (V) FIGURE 2-13:
Input Offset Voltage vs.
FIGURE 2-16:
Input Hysteresis Voltage vs. Supply Voltage vs. Temperature. Supply Voltage vs. Temperature.
50% 140.0 VDD = 5.5V V 120.0 ) 40% DD = 1.8V Avg. = 97 µA % Avg. = 88 µA StDev= 4 µA StDev= 4 µA 100.0 30% 1794 units 1794 units ) ces ( A 80.0 n (µ rre 20% 60.0 I Q TA= -40°C ccu 40.0 TA= +25°C O 10% TA= +85°C 20.0 TA= +125°C 0% 0.0 60 70 80 90 100 110 120 130 0.0 1.0 2.0 3.0 4.0 5.0 6.0 IQ (µA) VDD (V) FIGURE 2-14:
Quiescent Current.
FIGURE 2-17:
Quiescent Current vs. Supply Voltage vs Temperature.
130 130 VDD = 1.8V VDD = 5.5V 120 120 110 110 Sweep VIN+ ,VIN- = VDD/2 ) ) A 100 Swe Sw ep eep V - = V /2 IN+ ,V IN- = VDD A 100 (µ 90 (µ I Q 90 I Q Sweep VIN- ,VIN+ = VDD/2 80 Swee e p V p IN- ,V IN- , IN V + = IN+ = VDD/2 80 / 70 70 60 60 -0.5 0.0 0.5 1.0 1.5 2.0 2.5 -1.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 VCM (V) VCM (V) FIGURE 2-15:
Quiescent Current vs.
FIGURE 2-18:
Quiescent Current vs. Common-mode Input Voltage. Common-mode Input Voltage. 2009-2013 Microchip Technology Inc. DS22139C-page 7 Document Outline MCP6561/1R/1U/2/4 1.0 Electrical Characteristics 1.1 Maximum Ratings 1.2 Test Circuit Configuration FIGURE 1-1: AC and DC Test Circuit for the Push-Pull Output Comparators. 2.0 Typical Performance Curves FIGURE 2-1: Input Offset Voltage. FIGURE 2-2: Input Offset Voltage Drift. FIGURE 2-3: Input vs. Output Signal, No Phase Reversal. FIGURE 2-4: Input Hysteresis Voltage. FIGURE 2-5: Input Hysteresis Voltage Drift - Linear Temp. Co. (TC1). FIGURE 2-6: Input Hysteresis Voltage Drift - Quadratic Temp. Co. (TC2). FIGURE 2-7: Input Offset Voltage vs. Temperature. FIGURE 2-8: Input Offset Voltage vs. Common-mode Input Voltage. FIGURE 2-9: Input Offset Voltage vs. Common-mode Input Voltage. FIGURE 2-10: Input Hysteresis Voltage vs. Temperature. FIGURE 2-11: Input Hysteresis Voltage vs. Common-mode Input Voltage. FIGURE 2-12: Input Hysteresis Voltage vs. Common-mode Input Voltage. FIGURE 2-13: Input Offset Voltage vs. Supply Voltage vs. Temperature. FIGURE 2-14: Quiescent Current. FIGURE 2-15: Quiescent Current vs. Common-mode Input Voltage. FIGURE 2-16: Input Hysteresis Voltage vs. Supply Voltage vs. Temperature. FIGURE 2-17: Quiescent Current vs. Supply Voltage vs Temperature. FIGURE 2-18: Quiescent Current vs. Common-mode Input Voltage. FIGURE 2-19: Quiescent Current vs. Toggle Frequency. FIGURE 2-20: Output Headroom vs. Output Current. FIGURE 2-21: Low-to-High and High-to- Low Propagation Delays. FIGURE 2-22: Short Circuit Current vs. Supply Voltage vs. Temperature. FIGURE 2-23: Output Headroom vs.Output Current. FIGURE 2-24: Low-to-High and High-to- Low Propagation Delays . FIGURE 2-25: Propagation Delay Skew. FIGURE 2-26: Propagation Delay vs. Supply Voltage. FIGURE 2-27: Propagation Delay vs. Common-mode Input Voltage. FIGURE 2-28: Propagation Delay vs. Temperature. FIGURE 2-29: Propagation Delay vs. Input Over-Drive. FIGURE 2-30: Propagation Delay vs. Common-mode Input Voltage. FIGURE 2-31: Propagation Delay vs. Capacitive Load. FIGURE 2-32: Input Bias Current vs. Input Voltage vs Temperature. FIGURE 2-33: Common-mode Rejection Ratio and Power Supply Rejection Ratio vs. Temperature. FIGURE 2-34: Power Supply Rejection Ratio (PSRR). FIGURE 2-35: Common-mode Rejection Ratio (CMRR). FIGURE 2-36: Common-mode Rejection Ratio (CMRR). FIGURE 2-37: Output Jitter vs. Input Frequency. FIGURE 2-38: Input Offset Current and Input Bias Current vs. Temperature. FIGURE 2-39: Input Offset Current and Input Bias Current vs. Common-mode Input Voltage vs. Temperature. 3.0 Pin Descriptions TABLE 3-1: Pin Function Table 3.1 Analog Inputs 3.2 Digital Outputs 3.3 Power Supply (VSS and VDD) 4.0 Applications Information 4.1 Comparator Inputs 4.1.1 Normal Operation FIGURE 4-1: The MCP6561/1R/1U/2/4 Comparators’ Internal Hysteresis Eliminates Output Chatter Caused by Input Noise Voltage. 4.1.2 Input Voltage and Current Limits FIGURE 4-2: Simplified Analog Input ESD Structures. FIGURE 4-3: Protecting the Analog Inputs. 4.1.3 Phase Reversal 4.2 Push-Pull Output 4.3 Externally Set Hysteresis 4.3.1 Non-Inverting Circuit FIGURE 4-4: Non-inverting Circuit with Hysteresis for Single-Supply. FIGURE 4-5: Hysteresis Diagram for the Non-inverting Circuit. 4.3.2 Inverting Circuit FIGURE 4-6: Inverting Circuit With Hysteresis. FIGURE 4-7: Hysteresis Diagram for the Inverting Circuit. FIGURE 4-8: Thevenin Equivalent Circuit. 4.4 Bypass Capacitors 4.5 Capacitive Loads 4.6 PCB Surface Leakage FIGURE 4-9: Example Guard Ring Layout for Inverting Circuit. 4.7 PCB Layout Technique FIGURE 4-10: Recommended Layout. 4.8 Unused Comparators FIGURE 4-11: Unused Comparators. 4.9 Typical Applications 4.9.1 Precise Comparator FIGURE 4-12: Precise Inverting Comparator. 4.9.2 Windowed Comparator FIGURE 4-13: Windowed Comparator. 4.9.3 Bistable Multivibrator FIGURE 4-14: Bistable Multivibrator. 5.0 Design Aids 5.1 Microchip Advanced Part Selector (MAPS) 5.2 Analog Demonstration and Evaluation Boards 5.3 Application Notes 6.0 Packaging Information 6.1 Package Marking Information Appendix A: Revision History Product Identification System Trademarks Worldwide Sales and Service