Datasheet OP1177, OP2177, OP4177 (Analog Devices) - 5
| 制造商 | Analog Devices |
| 描述 | Precision Low Noise, Low Input Bias Current Quad Operational Amplifier |
| 页数 / 页 | 24 / 5 — OP1177/OP2177/OP4177. ABSOLUTE MAXIMUM RATINGS. Table 3. THERMAL … |
| 修订版 | H |
| 文件格式/大小 | PDF / 484 Kb |
| 文件语言 | 英语 |
OP1177/OP2177/OP4177. ABSOLUTE MAXIMUM RATINGS. Table 3. THERMAL RESISTANCE. Parameter Rating. Table 4. Thermal Resistance
该数据表的模型线
OP1177
文件文字版本
link to page 5
OP1177/OP2177/OP4177 ABSOLUTE MAXIMUM RATINGS Table 3. THERMAL RESISTANCE Parameter Rating
θJA is specified for the worst-case conditions, that is, a device Supply Voltage 36 V soldered in a circuit board for surface-mount packages. Input Voltage VS− to VS+ Differential Input Voltage ±Supply Voltage
Table 4. Thermal Resistance
Storage Temperature Range
Package Type θJA θJC Unit
R, RM, and RU Packages −65°C to +150°C 8-Lead MSOP (RM-8)1 190 44 °C/W Operating Temperature Range 8-Lead SOIC_N (R-8) 158 43 °C/W OP1177/OP2177/OP4177 −40°C to +125°C 14-Lead SOIC_N (R-14) 120 36 °C/W Junction Temperature Range 14-Lead TSSOP (RU-14) 240 43 °C/W R, RM, and RU Packages −65°C to +150°C 1 MSOP is available in tape and reel only. Lead Temperature, Soldering (10 sec) 300°C Stresses above those listed under Absolute Maximum Ratings
ESD CAUTION
may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rev. G | Page 5 of 24 Document Outline FEATURES APPLICATIONS PIN CONFIGURATIONS GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL CHARACTERISTICS ELECTRICAL CHARACTERISTICS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION TYPICAL PERFORMANCE CHARACTERISTICS FUNCTIONAL DESCRIPTION TOTAL NOISE-INCLUDING SOURCE RESISTORS GAIN LINEARITY INPUT OVERVOLTAGE PROTECTION OUTPUT PHASE REVERSAL SETTLING TIME OVERLOAD RECOVERY TIME THD + NOISE CAPACITIVE LOAD DRIVE STRAY INPUT CAPACITANCE COMPENSATION REDUCING ELECTROMAGNETIC INTERFERENCE PROPER BOARD LAYOUT DIFFERENCE AMPLIFIERS A HIGH ACCURACY THERMOCOUPLE AMPLIFIER LOW POWER LINEARIZED RTD SINGLE OPERATIONAL AMPLIFIER BRIDGE REALIZATION OF ACTIVE FILTERS BAND-PASS KRC OR SALLEN-KEY FILTER CHANNEL SEPARATION REFERENCES ON NOISE DYNAMICS AND FLICKER NOISE OUTLINE DIMENSIONS ORDERING GUIDE
OP1177/OP2177/OP4177 ABSOLUTE MAXIMUM RATINGS Table 3. THERMAL RESISTANCE Parameter Rating
θJA is specified for the worst-case conditions, that is, a device Supply Voltage 36 V soldered in a circuit board for surface-mount packages. Input Voltage VS− to VS+ Differential Input Voltage ±Supply Voltage
Table 4. Thermal Resistance
Storage Temperature Range
Package Type θJA θJC Unit
R, RM, and RU Packages −65°C to +150°C 8-Lead MSOP (RM-8)1 190 44 °C/W Operating Temperature Range 8-Lead SOIC_N (R-8) 158 43 °C/W OP1177/OP2177/OP4177 −40°C to +125°C 14-Lead SOIC_N (R-14) 120 36 °C/W Junction Temperature Range 14-Lead TSSOP (RU-14) 240 43 °C/W R, RM, and RU Packages −65°C to +150°C 1 MSOP is available in tape and reel only. Lead Temperature, Soldering (10 sec) 300°C Stresses above those listed under Absolute Maximum Ratings
ESD CAUTION
may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rev. G | Page 5 of 24 Document Outline FEATURES APPLICATIONS PIN CONFIGURATIONS GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL CHARACTERISTICS ELECTRICAL CHARACTERISTICS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION TYPICAL PERFORMANCE CHARACTERISTICS FUNCTIONAL DESCRIPTION TOTAL NOISE-INCLUDING SOURCE RESISTORS GAIN LINEARITY INPUT OVERVOLTAGE PROTECTION OUTPUT PHASE REVERSAL SETTLING TIME OVERLOAD RECOVERY TIME THD + NOISE CAPACITIVE LOAD DRIVE STRAY INPUT CAPACITANCE COMPENSATION REDUCING ELECTROMAGNETIC INTERFERENCE PROPER BOARD LAYOUT DIFFERENCE AMPLIFIERS A HIGH ACCURACY THERMOCOUPLE AMPLIFIER LOW POWER LINEARIZED RTD SINGLE OPERATIONAL AMPLIFIER BRIDGE REALIZATION OF ACTIVE FILTERS BAND-PASS KRC OR SALLEN-KEY FILTER CHANNEL SEPARATION REFERENCES ON NOISE DYNAMICS AND FLICKER NOISE OUTLINE DIMENSIONS ORDERING GUIDE