Datasheet AD7091 (Analog Devices) - 6

制造商Analog Devices
描述1 MSPS, Ultralow Power 12-Bit ADC in 8-Lead LFCSP
页数 / 页20 / 6 — AD7091. Data Sheet. PIN CONFIGURATION AND FUNCTION DESCRIPTIONS. 8 SDO. 7 …
修订版B
文件格式/大小PDF / 469 Kb
文件语言英语

AD7091. Data Sheet. PIN CONFIGURATION AND FUNCTION DESCRIPTIONS. 8 SDO. 7 SCLK. TOP VIEW. REGCAP 3. 6 CS. (Not to Scale). GND 4. 5 CONVST

AD7091 Data Sheet PIN CONFIGURATION AND FUNCTION DESCRIPTIONS 8 SDO 7 SCLK TOP VIEW REGCAP 3 6 CS (Not to Scale) GND 4 5 CONVST

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AD7091 Data Sheet PIN CONFIGURATION AND FUNCTION DESCRIPTIONS V 1 DD 8 SDO V 2 AD7091 7 SCLK IN TOP VIEW REGCAP 3 6 CS (Not to Scale) GND 4 5 CONVST NOTES 1. THE EXPOSED PAD IS NOT CONNECTED INTERNALLY. FOR INCREASED RELIABILITY OF THE SOLDER JOINTS AND FOR MAXIMUM THERMAL CAPABILITY,
3
SOLDER THE EXPOSED PAD TO THE
00 4-
SUBSTRATE, GND.
49 10 Figure 3.
Table 5. Pin Function Descriptions Pin No. Mnemonic Description
1 VDD Power Supply Input. The VDD range is from 2.09 V to 5.25 V. Decouple this supply pin to GND. Typical recom- mended capacitor values are 10 μF and 0.1 μF. 2 VIN Analog Input. The single-ended analog input range is from 0 V to VDD. 3 REGCAP Decoupling Capacitor Pin for Voltage Output from Internal Low Dropout (LDO) Regulator. Decouple this output pin separately to GND using a 1 μF capacitor. The voltage at this pin is 1.8 V typical. 4 GND Ground. This pin is the ground reference point for all circuitry on the AD7091. The analog input signal should be referred to this GND voltage. 5 CONVST Conversion Start. Active low, edge triggered logic input. The falling edge of CONVST places the track-and-hold into hold mode and initiates a conversion. 6 CS Chip Select. Active low logic input. The serial bus is enabled when CS is held low; in this mode CS is used to frame the output data on the SPI bus. 7 SCLK Serial Clock. This pin acts as the serial clock input. 8 SDO Serial Data Output. The conversion output data is supplied to this pin as a serial data stream. The bits are clocked out on the falling edge of the SCLK input. The data is provided MSB first. 9 EPAD Exposed Pad. The exposed pad is not connected internally. For increased reliability of the solder joints and for maximum thermal capability, solder the exposed pad to the substrate, GND. Rev. B | Page 6 of 20 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION PRODUCT HIGHLIGHTS TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS TIMING SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS TERMINOLOGY THEORY OF OPERATION CIRCUIT INFORMATION CONVERTER OPERATION ADC TRANSFER FUNCTION TYPICAL CONNECTION DIAGRAM ANALOG INPUT MODES OF OPERATION Normal Mode Power-Down Mode POWER CONSUMPTION Power Consumption in Normal Mode Power Consumption Using a Combination of Normal Mode and Power-Down Mode MULTIPLEXER APPLICATIONS SERIAL INTERFACE BUSY INDICATOR ENABLED BUSY INDICATOR DISABLED SOFTWARE RESET INTERFACING WITH AN 8-/16-BIT SPI BUS OUTLINE DIMENSIONS ORDERING GUIDE