Datasheet LM1117 (Texas Instruments) - 4

LM1117
SNOS412N – FEBRUARY 2000 – REVISED JANUARY 2016
www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Maximum Input Voltage (VIN to GND) 20 V Power Dissipation(2) Internally Limited Junction Temperature (TJ)(2) 150 °C TO-220 (T) Package, 10 s 260 Lead Temperature °C SOT-223 (MP) Package, 4 s 260 Storage Temperature, Tstg –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) The maximum power dissipation is a function of TJ(max) , RθJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(max)–TA)/RθJA. All numbers apply for packages soldered directly into a PCB.
6.2 ESD Ratings VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Pins listed as ±2000 V may actually have higher performance.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Input Voltage (VIN to GND) 15 V LM1117 0 125 °C Junction Temperature (TJ)(1) LM1117I −40 125 (1) The maximum power dissipation is a function of TJ(max) , RθJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(max)–TA)/RθJA. All numbers apply for packages soldered directly into a PCB.
6.4 Thermal Information LM1117, LM1117I DCY NDE NDP NGN KTT THERMAL METRIC(1) UNIT (SOT-223) (TO-220) (TO-252) (WSON) (TO-263) 4 PINS 3 PINS 3 PINS 8 PINS 3 PINS
RθJA Junction-to-ambient thermal resistance 61.6 23.8 45.1 39.3 41.3 °C/W RθJC(top) Junction-to-case (top) thermal resistance 42.5 16.6 52.1 31.4 44.1 °C/W RθJB Junction-to-board thermal resistance 10.4 5.3 29.8 16.5 24.2 °C/W ψJT Junction-to-top characterization parameter 2.9 3.1 4.5 0.3 10.9 °C/W ψJB Junction-to-board characterization parameter 10.3 5.3 29.4 16.7 23.2 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance — 1.5 1.3 5.6 1.3 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2000–2016, Texas Instruments Incorporated Product Folder Links: LM1117 Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Revision History 5 Pin Configuration and Functions 6 Specifications 6.1 Absolute Maximum Ratings 6.2 ESD Ratings 6.3 Recommended Operating Conditions 6.4 Thermal Information 6.5 LM1117 Electrical Characteristics 6.6 LM1117I Electrical Characteristics 6.7 Typical Characteristics 7 Detailed Description 7.1 Overview 7.2 Functional Block Diagram 7.3 Feature Description 7.3.1 Load Regulation 7.4 Device Functional Modes 7.4.1 Protection Diodes 8 Application and Implementation 8.1 Application Information 8.2 Typical Application 8.2.1 Design Requirements 8.2.2 Detailed Design Procedure 8.2.2.1 External Capacitors 8.2.3 Application Curve 8.3 System Examples 9 Power Supply Recommendations 10 Layout 10.1 Layout Guidelines 10.1.1 Heatsink Requirements 10.2 Layout Example 11 Device and Documentation Support 11.1 Community Resources 11.2 Trademarks 11.3 Electrostatic Discharge Caution 11.4 Glossary 12 Mechanical, Packaging, and Orderable Information Page 1 Page 1