Datasheet LM119, LM219, LM319 (LMx19) (National Semiconductor) - 4

LM119, LM219, LM319
SNOSBJ2B – AUGUST 2000 – REVISED JANUARY 2016
www.ti.com 5 Specifications 5.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)(2)(3)
MIN MAX UNIT
Total supply voltage 36 V Output to negative supply voltage 36 V Ground to negative supply voltage 25 V Ground to positive supply voltage 18 V Differential input voltage –5 +5 V Input voltage(4) –15 +15 V Power dissipation(5) 500 mW Output short circuit duration 10 sec Lead temperature (soldering, 10 sec.) 260 °C Dual-In-Line Package Soldering (10 seconds) 260 Small Outline Package Vapor Phase (60 Soldering information(6) 215 °C seconds) Small Outline Package Infrared (15 seconds) 220 LM119 –55 125 Operating temperature LM219 –25 85 °C LM319A, LM319 0 70 Storage temperature, Tstg –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. (3) Refer to RETS119X for LM119H/883 and LM119J/883 specifications. (4) For supply voltages less than ±15 V the absolute maximum input voltage is equal to the supply voltage. (5) The maximum junction temperature of the LM119 is 150°C, while that of the LM219 is 110°C. For operating at elevated temperatures, devices in the H10 package must be derated based on a thermal resistance of 160°C/W, junction to ambient, or 19°C/W, junction to case. The thermal resistance of the J14 and N14 packages is 100°C/W, junction to ambient. (6) See AN-450 “Surface Mounting Methods and Their Effect on Product Reliability” for other methods of soldering surface mount devices.
5.2 ESD Ratings VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±800 V (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
5.3 Thermal Information LM119, LM219, LM319 TO-100 PDIP CDIP THERMAL METRIC(1) UNIT (LME) (NFF) (J) 10 PINS 14 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance 160 100 100 °C/W RθJC(top) Junction-to-case (top) thermal resistance 19 NA NA °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2000–2016, Texas Instruments Incorporated Product Folder Links: LM119 LM219 LM319 Document Outline 1 Features 2 Description Table of Contents 3 Revision History 4 Pin Configuration and Functions 5 Specifications 5.1 Absolute Maximum Ratings 5.2 ESD Ratings 5.3 Thermal Information 5.4 Electrical Characteristics LM119, LM219 5.5 Electrical Characteristics LM319, LM319A 5.6 Typical Characteristics 5.6.1 Typical Characteristics – LM119, LM119A, LM219 5.6.2 Typical Characteristics – LM319, LM319A 6 Detailed Description 6.1 Functional Block Diagram 7 Application and Implementation 7.1 Typical Applications 7.1.1 Relay Driver 7.1.2 Window Detector 8 Device and Documentation Support 8.1 Related Links 8.2 Community Resources 8.3 Trademarks 8.4 Electrostatic Discharge Caution 8.5 Glossary 9 Mechanical, Packaging, and Orderable Information