Datasheet 1N5817, 1N5818, 1N5819 (ON Semiconductor) - 4
| 制造商 | ON Semiconductor |
| 描述 | Axial Lead Rectifiers |
| 页数 / 页 | 7 / 4 — 1N5817, 1N5818, 1N5819. Figure 4. Steady−State Thermal Resistance. Figure … |
| 文件格式/大小 | PDF / 77 Kb |
| 文件语言 | 英语 |
1N5817, 1N5818, 1N5819. Figure 4. Steady−State Thermal Resistance. Figure 5. Forward Power Dissipation. 1N5817−19
文件文字版本
1N5817, 1N5818, 1N5819
(C/W) ° 90 5.0 ATTS) Sine Wave BOTH LEADS TO HEATSINK, 80 (W 3.0 I(FM) = π (Resistive Load) EQUAL LENGTH O−LEAD 2.0 I(AV) 70 ATION 5 Capacitive 10 { 60 1.0 Loads dc MAXIMUM 0.7 20 JUNCTION−T 50 0.5 SQUARE WAVE TYPICAL ANCE, 40 0.3 TJ ≈ 125°C 0.2 30 RESIST 20 , AVERAGE POWER DISSIP 0.1 V) 0.07 10 P F(A 0.05 1 1/8 1/4 3/8 1/2 5/8 3/4 7/8 1.0 , THERMAL 0.2 0.4 0.6 0.8 1.0 2.0 4.0 JL θ L, LEAD LENGTH (INCHES) I R F(AV), AVERAGE FORWARD CURRENT (AMP)
Figure 4. Steady−State Thermal Resistance Figure 5. Forward Power Dissipation 1N5817−19
1.0 0.7 0.5 (NORMALIZED) 0.3 ANCE ZqJL(t) = ZqJL • r(t) 0.2 Ppk Ppk
DUTY CYCLE, D = tp/t1
0.1 RESIST tp
PEAK POWER, Ppk, is peak of an
0.07 TIME
equivalent square power pulse.
0.05 t1 DTJL = Ppk • RqJL [D + (1 − D) • r(t1 + tp) + r(tp) − r(t1)] where THERMAL 0.03 DTJL = the increase in junction temperature above the lead temperature r(t) = normalized value of transient thermal resistance at time, t, from Figure 6, 0.02 i.e.: r(t) = r(t1 + tp) = normalized value of transient thermal resistance at time, t1 + tp. 0.01 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500 1.0k 2.0k 5.0k 10k r(t), TRANSIENT t, TIME (ms)
Figure 6. Thermal Response Mounting Method 1 Mounting Method 3 NOTE 4. — MOUNTING DATA
P.C. Board with P.C. Board with Data shown for thermal resistance, junction−to−ambient 1−1/2″ x 1−1/2″ 1−1/2″ x 1−1/2″ (RqJA) for the mountings shown is to be used as typical guide- copper surface. copper surface. line values for preliminary engineering, or in case the tie point temperature cannot be measured. L = 3/8″ L L
TYPICAL VALUES FOR R
q
JA IN STILL AIR Lead Length, L (in) Mounting Method 1/8 1/4 1/2 3/4 R
q
JA BOARD GROUND PLANE Mounting Method 2 1
52 65 72 85 °C/W 2 67 80 87 100 °C/W 3 50 °C/W L L VECTOR PIN MOUNTING
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(C/W) ° 90 5.0 ATTS) Sine Wave BOTH LEADS TO HEATSINK, 80 (W 3.0 I(FM) = π (Resistive Load) EQUAL LENGTH O−LEAD 2.0 I(AV) 70 ATION 5 Capacitive 10 { 60 1.0 Loads dc MAXIMUM 0.7 20 JUNCTION−T 50 0.5 SQUARE WAVE TYPICAL ANCE, 40 0.3 TJ ≈ 125°C 0.2 30 RESIST 20 , AVERAGE POWER DISSIP 0.1 V) 0.07 10 P F(A 0.05 1 1/8 1/4 3/8 1/2 5/8 3/4 7/8 1.0 , THERMAL 0.2 0.4 0.6 0.8 1.0 2.0 4.0 JL θ L, LEAD LENGTH (INCHES) I R F(AV), AVERAGE FORWARD CURRENT (AMP)
Figure 4. Steady−State Thermal Resistance Figure 5. Forward Power Dissipation 1N5817−19
1.0 0.7 0.5 (NORMALIZED) 0.3 ANCE ZqJL(t) = ZqJL • r(t) 0.2 Ppk Ppk
DUTY CYCLE, D = tp/t1
0.1 RESIST tp
PEAK POWER, Ppk, is peak of an
0.07 TIME
equivalent square power pulse.
0.05 t1 DTJL = Ppk • RqJL [D + (1 − D) • r(t1 + tp) + r(tp) − r(t1)] where THERMAL 0.03 DTJL = the increase in junction temperature above the lead temperature r(t) = normalized value of transient thermal resistance at time, t, from Figure 6, 0.02 i.e.: r(t) = r(t1 + tp) = normalized value of transient thermal resistance at time, t1 + tp. 0.01 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500 1.0k 2.0k 5.0k 10k r(t), TRANSIENT t, TIME (ms)
Figure 6. Thermal Response Mounting Method 1 Mounting Method 3 NOTE 4. — MOUNTING DATA
P.C. Board with P.C. Board with Data shown for thermal resistance, junction−to−ambient 1−1/2″ x 1−1/2″ 1−1/2″ x 1−1/2″ (RqJA) for the mountings shown is to be used as typical guide- copper surface. copper surface. line values for preliminary engineering, or in case the tie point temperature cannot be measured. L = 3/8″ L L
TYPICAL VALUES FOR R
q
JA IN STILL AIR Lead Length, L (in) Mounting Method 1/8 1/4 1/2 3/4 R
q
JA BOARD GROUND PLANE Mounting Method 2 1
52 65 72 85 °C/W 2 67 80 87 100 °C/W 3 50 °C/W L L VECTOR PIN MOUNTING
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