MCP6421/2/4Note: Unless otherwise indicated, TA= +25°C, VDD = +1.8V to +5.5V, VSS= GND, VCM = VDD/2, VOUT = VDD/2, VL = VDD/2, RL = 100 k to VL and CL = 30 pF. 9014080130PSRR7012060(dB) 110ltage DensityHz) 50o¥10040(nV/90ise V o30RR, PSRR80M C20CMRR @ V= 5.5V70DD@ V= 1.8VDDInput N10f = 10 kHz60V= 5.5 VDD050-0.5 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6-50-250255075100125Common Mode Input Voltage (V)Ambient Temperature (°C)FIGURE 2-7: Input Noise Voltage Density FIGURE 2-10: CMRR, PSRR vs. Ambient vs. Common Mode Input Voltage. Temperature. 10,00010001n V = 5.5VDD100100pCurrents1,00010Input Bias Current10pltage DensityHz)o¥(A)(nV/11pise V o100as and Offset0.10.1pInput Offset CurrentInput NInput Bi100.010.01p1.E-11.E+01.E+11.E+21.E+31.E+41.E+50.1 1 10 100 1k10k 100k5253545556575859510511125Frequency (Hz)Ambient Temperature (°C)FIGURE 2-8: Input Noise Voltage Density FIGURE 2-11: Input Bias, Offset Current vs. Frequency. vs. Ambient Temperature. 1001000Representative Part90090CMRRT = +125°CA80080700(dB)7060050060PSRR-400T = +85°CR, PSRRA50ias Current (pA)RPSRR+R300B200T = +25°CCM40A100InputV= 5.5 VDD30020-1001010010001000010000010 100 1k 10k 100k00.511.522.533.544.555.5Frequency (Hz)Common Mode Input Voltage (V)FIGURE 2-9: CMRR, PSRR vs. FIGURE 2-12: Input Bias Current vs. Frequency. Common Mode Input Voltage. DS20005165B-page 8 2013 Microchip Technology Inc. Document Outline Typical Application Package Types 1.0 Electrical Characteristics 1.1 Absolute Maximum Ratings † 1.2 Specifications TABLE 1-1: DC electrical specifications TABLE 1-2: AC Electrical Specifications TABLE 1-3: Temperature Specifications 1.3 Test Circuits FIGURE 1-1: AC and DC Test Circuit for Most Specifications. 2.0 Typical Performance Curves FIGURE 2-1: Input Offset Voltage. FIGURE 2-2: Input Offset Voltage Drift. FIGURE 2-3: Input Offset Voltage vs. Common Mode Input Voltage. FIGURE 2-4: Input Offset Voltage vs. Common Mode Input Voltage. FIGURE 2-5: Input Offset Voltage vs. Output Voltage. FIGURE 2-6: Input Offset Voltage vs. Power Supply Voltage. FIGURE 2-7: Input Noise Voltage Density vs. Common Mode Input Voltage. FIGURE 2-8: Input Noise Voltage Density vs. Frequency. FIGURE 2-9: CMRR, PSRR vs. Frequency. FIGURE 2-10: CMRR, PSRR vs. Ambient Temperature. FIGURE 2-11: Input Bias, Offset Current vs. Ambient Temperature. FIGURE 2-12: Input Bias Current vs. Common Mode Input Voltage. FIGURE 2-13: Quiescent Current vs. Ambient Temperature. FIGURE 2-14: Quiescent Current vs. Power Supply Voltage. FIGURE 2-15: Quiescent Current vs. Common Mode Input Voltage. FIGURE 2-16: Quiescent Current vs. Common Mode Input Voltage. FIGURE 2-17: Open-Loop Gain, Phase vs. Frequency. FIGURE 2-18: DC Open-Loop Gain vs. Ambient Temperature. FIGURE 2-19: DC Open-Loop Gain vs. Output Voltage Headroom. FIGURE 2-20: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature. FIGURE 2-21: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature. FIGURE 2-22: Output Short Circuit Current vs. Power Supply Voltage. FIGURE 2-23: Output Voltage Swing vs. Frequency. FIGURE 2-24: Output Voltage Headroom vs. Output Current. FIGURE 2-25: Output Voltage Headroom vs. Output Current. FIGURE 2-26: Output Voltage Headroom vs. Ambient Temperature. FIGURE 2-27: Output Voltage Headroom vs. Ambient Temperature. FIGURE 2-28: Slew Rate vs. Ambient Temperature. FIGURE 2-29: Small Signal Non-Inverting Pulse Response. FIGURE 2-30: Small Signal Inverting Pulse Response. FIGURE 2-31: Large Signal Non-Inverting Pulse Response. FIGURE 2-32: Large Signal Inverting Pulse Response. FIGURE 2-33: The MCP6421/2/4 Device Shows No Phase Reversal. FIGURE 2-34: Closed Loop Output Impedance vs. Frequency. FIGURE 2-35: Measured Input Current vs. Input Voltage (below VSS). FIGURE 2-36: EMIRR vs. Frequency. FIGURE 2-37: EMIRR vs. RF Input Peak- to-Peak Voltage. FIGURE 2-38: Channel-to-Channel Separation vs. Frequency. 3.0 Pin Descriptions TABLE 3-1: Pin Function Table 3.1 Analog Outputs 3.2 Analog Inputs 3.3 Power Supply Pins (VSS, VDD) 4.0 Application Information 4.1 Rail-to-Rail Input FIGURE 4-1: Simplified Analog Input ESD Structures. FIGURE 4-2: Protecting the Analog Inputs. FIGURE 4-3: Protecting the Analog Inputs. 4.2 Rail-to-Rail Output 4.3 Capacitive Loads FIGURE 4-4: Output Resistor, RISO Stabilizes Large Capacitive Loads. FIGURE 4-5: Recommended RISO Values for Capacitive Loads. 4.4 Supply Bypass 4.5 Unused Op Amps FIGURE 4-6: Unused Op Amps. 4.6 PCB Surface Leakage FIGURE 4-7: Example Guard Ring Layout for Inverting Gain. 4.7 Electromagnetic Interference Rejection Ratio (EMIRR) Definitions 4.8 Application Circuits FIGURE 4-8: CO Gas Sensor Circuit. FIGURE 4-9: Pressure Sensor Amplifier. FIGURE 4-10: Battery Current Sensing. 5.0 Design Aids 5.1 SPICE Macro Model 5.2 FilterLab® Software 5.3 Microchip Advanced Part Selector (MAPS) 5.4 Analog Demonstration and Evaluation Boards 5.5 Application Notes 6.0 Packaging Information 6.1 Package Marking Information Appendix A: Revision History Product Identification System Trademarks Worldwide Sales and Service