Datasheet MCP6421, MCP6422, MCP6424 (Microchip) - 10

MCP6421/2/4 Note:
Unless otherwise indicated, TA= +25°C, VDD = +1.8V to +5.5V, VSS= GND, VCM = VDD/2, VOUT = VDD/2, VL = VDD/2, RL = 100 k to VL and CL = 30 pF.
150 40 Isc+@ T = +125°C 140 30 A T = +85°C A 130 T = +25°C 20 A T = -40°C A 120 10 110 Circuit Current 0 (mA) 100 V = 5.5V DD V = 1.8V -10 DD 90 Isc-@ T = +125°C -Open Loop Gain (dB) t Short A -20 T = +85° 85 C 20 ° A DC 80 T = +25°C A -30 T = -40°C 70 Outpu A 0.00 0.05 0.10 0.15 0.20 0.25 0.30 -40 Output Voltage Headroom (V) 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 V - V or V - V Power Supply Voltage (V) DD OH OL SS FIGURE 2-19:
DC Open-Loop Gain vs.
FIGURE 2-22:
Output Short Circuit Current Output Voltage Headroom. vs. Power Supply Voltage.
100.0 180 10 ) 160 V = 5.5V DD 90.0 P-P 140 80.0 120 ing (V V = 1.8V DD gin (°) 70.0 idth Product Gain Bandwidth Product 100 Sw (MHz) 1 80 60.0 andw ltage ase Mar B o 60 h 50.0 P t V 40 Gain Phase Margin 40.0 V = 12V = 5.5V DD 20 Outpu 30.0 0 0.1 -50 -25 0 25 50 75 100 125 1000 10000 100000 1k 10k 100k Ambient Temperature (°C) Frequency (Hz) FIGURE 2-20:
Gain Bandwidth Product,
FIGURE 2-23:
Output Voltage Swing vs. Phase Margin vs. Ambient Temperature. Frequency.
100.0 180 1000 160 V = 1.8V 90.0 DD 140 80.0 100 120 70.0 gin (°) V - V idth Product Gain Bandwidth Product 100 DD OH (MHz) 10 80 60.0 andw B 60 ase Mar 60 oltage Headroom (mV) 50.0 V - V Ph V OL SS V 40 1 Phase Margin Gain 40.0 20 V = 1.8V DD Output 30.0 0 0.1 -50 -25 0 25 50 75 100 125 0.001 0.01 0.1 1 10 100 Ambient Temperature (°C) Output Current (mA) FIGURE 2-21:
Gain Bandwidth Product,
FIGURE 2-24:
Output Voltage Headroom Phase Margin vs. Ambient Temperature. vs. Output Current. DS20005165B-page 10  2013 Microchip Technology Inc. Document Outline Typical Application Package Types 1.0 Electrical Characteristics 1.1 Absolute Maximum Ratings † 1.2 Specifications TABLE 1-1: DC electrical specifications TABLE 1-2: AC Electrical Specifications TABLE 1-3: Temperature Specifications 1.3 Test Circuits FIGURE 1-1: AC and DC Test Circuit for Most Specifications. 2.0 Typical Performance Curves FIGURE 2-1: Input Offset Voltage. FIGURE 2-2: Input Offset Voltage Drift. FIGURE 2-3: Input Offset Voltage vs. Common Mode Input Voltage. FIGURE 2-4: Input Offset Voltage vs. Common Mode Input Voltage. FIGURE 2-5: Input Offset Voltage vs. Output Voltage. FIGURE 2-6: Input Offset Voltage vs. Power Supply Voltage. FIGURE 2-7: Input Noise Voltage Density vs. Common Mode Input Voltage. FIGURE 2-8: Input Noise Voltage Density vs. Frequency. FIGURE 2-9: CMRR, PSRR vs. Frequency. FIGURE 2-10: CMRR, PSRR vs. Ambient Temperature. FIGURE 2-11: Input Bias, Offset Current vs. Ambient Temperature. FIGURE 2-12: Input Bias Current vs. Common Mode Input Voltage. FIGURE 2-13: Quiescent Current vs. Ambient Temperature. FIGURE 2-14: Quiescent Current vs. Power Supply Voltage. FIGURE 2-15: Quiescent Current vs. Common Mode Input Voltage. FIGURE 2-16: Quiescent Current vs. Common Mode Input Voltage. FIGURE 2-17: Open-Loop Gain, Phase vs. Frequency. FIGURE 2-18: DC Open-Loop Gain vs. Ambient Temperature. FIGURE 2-19: DC Open-Loop Gain vs. Output Voltage Headroom. FIGURE 2-20: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature. FIGURE 2-21: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature. FIGURE 2-22: Output Short Circuit Current vs. Power Supply Voltage. FIGURE 2-23: Output Voltage Swing vs. Frequency. FIGURE 2-24: Output Voltage Headroom vs. Output Current. FIGURE 2-25: Output Voltage Headroom vs. Output Current. FIGURE 2-26: Output Voltage Headroom vs. Ambient Temperature. FIGURE 2-27: Output Voltage Headroom vs. Ambient Temperature. FIGURE 2-28: Slew Rate vs. Ambient Temperature. FIGURE 2-29: Small Signal Non-Inverting Pulse Response. FIGURE 2-30: Small Signal Inverting Pulse Response. FIGURE 2-31: Large Signal Non-Inverting Pulse Response. FIGURE 2-32: Large Signal Inverting Pulse Response. FIGURE 2-33: The MCP6421/2/4 Device Shows No Phase Reversal. FIGURE 2-34: Closed Loop Output Impedance vs. Frequency. FIGURE 2-35: Measured Input Current vs. Input Voltage (below VSS). FIGURE 2-36: EMIRR vs. Frequency. FIGURE 2-37: EMIRR vs. RF Input Peak- to-Peak Voltage. FIGURE 2-38: Channel-to-Channel Separation vs. Frequency. 3.0 Pin Descriptions TABLE 3-1: Pin Function Table 3.1 Analog Outputs 3.2 Analog Inputs 3.3 Power Supply Pins (VSS, VDD) 4.0 Application Information 4.1 Rail-to-Rail Input FIGURE 4-1: Simplified Analog Input ESD Structures. FIGURE 4-2: Protecting the Analog Inputs. FIGURE 4-3: Protecting the Analog Inputs. 4.2 Rail-to-Rail Output 4.3 Capacitive Loads FIGURE 4-4: Output Resistor, RISO Stabilizes Large Capacitive Loads. FIGURE 4-5: Recommended RISO Values for Capacitive Loads. 4.4 Supply Bypass 4.5 Unused Op Amps FIGURE 4-6: Unused Op Amps. 4.6 PCB Surface Leakage FIGURE 4-7: Example Guard Ring Layout for Inverting Gain. 4.7 Electromagnetic Interference Rejection Ratio (EMIRR) Definitions 4.8 Application Circuits FIGURE 4-8: CO Gas Sensor Circuit. FIGURE 4-9: Pressure Sensor Amplifier. FIGURE 4-10: Battery Current Sensing. 5.0 Design Aids 5.1 SPICE Macro Model 5.2 FilterLab® Software 5.3 Microchip Advanced Part Selector (MAPS) 5.4 Analog Demonstration and Evaluation Boards 5.5 Application Notes 6.0 Packaging Information 6.1 Package Marking Information Appendix A: Revision History Product Identification System Trademarks Worldwide Sales and Service