Datasheet MCP6L01, MCP6L01R, MCP6L01U, MCP6L012, MCP6L014 (Microchip) - 4

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MCP6L01/1R/1U/2/4 TABLE 1-2: AC ELECTRICAL SPECIFICATIONS Electrical Characteristics:
Unless otherwise indicated, TA = 25°C, VDD = +5.0V, VSS = GND, VCM = VSS, VOUT  VDD/2, VL = VDD/2, RL = 10 k to VL and CL = 60 pF (refer to Figure 1-1).
Parameters Sym Min Typ Max Units Conditions AC Response
Gain Bandwidth Product GBWP — 1.0 — MHz Phase Margin PM — 90 — ° G = +1 Slew Rate SR — 0.6 — V/µs
Noise
Input Noise Voltage Eni — 6 — µVP-P f = 0.1 Hz to 10 Hz Input Noise Voltage Density eni — 24 — nV/Hz f = 10 kHz Input Noise Current Density ini — 4 — fA/Hz f = 1 kHz
TABLE 1-3: TEMPERATURE SPECIFICATIONS Electrical Characteristics:
Unless otherwise indicated, all limits are specified for: VDD = +1.8V to +6.0V, VSS = GND.
Parameters Sym Min Typ Max Units Conditions Temperature Ranges
Specified Temperature Range TA -40 — +125 °C Operating Temperature Range TA -40 — +125 °C (
Note 1
) Storage Temperature Range TA -65 — +150 °C
Thermal Package Resistances
Thermal Resistance, 5L-SC70 JA — 331 — °C/W Thermal Resistance, 5L-SOT-23 JA — 256 — °C/W Thermal Resistance, 8L-SOIC (150 mil) JA — 163 — °C/W Thermal Resistance, 8L-MSOP JA — 206 — °C/W Thermal Resistance, 14L-SOIC JA — 120 — °C/W Thermal Resistance, 14L-TSSOP JA — 100 — °C/W
Note 1:
Operation must not cause TJ to exceed Maximum Junction Temperature specification (150°C).
1.3 Test Circuit
C The circuit used for most DC and AC tests is shown in F Figure 1-1. This circuit can independently set V 6.8 pF CM and VOUT; see Equation 1-1. Note that VCM is not the circuit’s common mode voltage ((V R P + VM)/2), and that G RF VOST includes VOS plus the effects (on the input offset 100 k 100 k error, V V V OST) of temperature, CMRR, PSRR and AOL. P DD/2 VDD V
EQUATION 1-1:
IN+ C C B1 B2 G =  DM RF RG
MCP6L0X
100 nF 1 µF V =  +    CM VP VDD 2 2 V V OST = VIN– – VIN+ IN– V =    +   +   OUT VDD 2 VP – VM VOST 1 + GDM V V M OUT Where: RG R R C F L L 10 k 60 pF G 100 k 100 k DM = Differential Mode Gain (V/V) VCM = Op Amp’s Common Mode (V) Input Voltage CF V 6.8 pF L VOST = Op Amp’s Total Input Offset (mV) Voltage
FIGURE 1-1:
AC and DC Test Circuit for Most Specifications. DS22140B-page 4  2009-2011 Microchip Technology Inc. Document Outline 1.0 Electrical Characteristics 1.1 Absolute Maximum Ratings † 1.2 Specifications TABLE 1-1: DC Electrical Specifications TABLE 1-2: AC Electrical Specifications TABLE 1-3: Temperature Specifications 1.3 Test Circuit FIGURE 1-1: AC and DC Test Circuit for Most Specifications. 2.0 Typical Performance Curves FIGURE 2-1: Input Offset Voltage vs. Common Mode Input Voltage at VDD = 1.8V. FIGURE 2-2: Input Offset Voltage vs. Common Mode Input Voltage at VDD = 5.5V. FIGURE 2-3: Input Offset Voltage vs. Output Voltage. FIGURE 2-4: Input Common Mode Range Voltage vs. Ambient Temperature. FIGURE 2-5: CMRR, PSRR vs. Ambient Temperature. FIGURE 2-6: CMRR, PSRR vs. Frequency. FIGURE 2-7: Measured Input Current vs. Input Voltage (below VSS). FIGURE 2-8: Open-Loop Gain, Phase vs. Frequency. FIGURE 2-9: Input Noise Voltage Density vs. Frequency. FIGURE 2-10: The MCP6L01/1R/1U/2/4 Show No Phase Reversal. FIGURE 2-11: Quiescent Current vs. Power Supply Voltage. FIGURE 2-12: Output Short Circuit Current vs. Power Supply Voltage. FIGURE 2-13: Ratio of Output Voltage Headroom to Output Current vs. Output Current. FIGURE 2-14: Small Signal, Noninverting Pulse Response. FIGURE 2-15: Large Signal, Noninverting Pulse Response. FIGURE 2-16: Slew Rate vs. Ambient Temperature. FIGURE 2-17: Output Voltage Swing vs. Frequency. 3.0 Pin Descriptions TABLE 3-1: Pin Function Table 3.1 Analog Outputs 3.2 Analog Inputs 3.3 Power Supply Pins 4.0 Application Information 4.1 Rail-to-Rail Inputs FIGURE 4-1: Protecting the Analog Inputs. 4.2 Rail-to-Rail Output 4.3 Capacitive Loads FIGURE 4-2: Output Resistor, RISO stabilizes large capacitive loads. 4.4 Supply Bypass 4.5 Unused Op Amps FIGURE 4-3: Unused Op Amps. 4.6 PCB Surface Leakage FIGURE 4-4: Example Guard Ring Layout. 4.7 Application Circuit FIGURE 4-5: Bessel Filter. 5.0 Design Aids 5.1 SPICE Macro Model 5.2 FilterLab® Software 5.3 Microchip Advanced Part Selector (MAPS) 5.4 Analog Demonstration and Evaluation Boards 5.5 Application Notes 6.0 Packaging Information 6.1 Package Marking Information Appendix A: Revision History Product ID System Trademarks Worldwide Sales