Datasheet ADA4312-1 (Analog Devices) - 5
| 制造商 | Analog Devices |
| 描述 | Wideband, Differential, High Output Current Line Driver with Shutdown |
| 页数 / 页 | 13 / 5 — ADA4312-1. Data Sheet. ABSOLUTE MAXIMUM RATINGS Table 2. MAXIMUM POWER … |
| 修订版 | A |
| 文件格式/大小 | PDF / 479 Kb |
| 文件语言 | 英语 |
ADA4312-1. Data Sheet. ABSOLUTE MAXIMUM RATINGS Table 2. MAXIMUM POWER DISSIPATION. Parameter. Rating. ESD CAUTION
文件文字版本
link to page 11
ADA4312-1 Data Sheet ABSOLUTE MAXIMUM RATINGS Table 2. MAXIMUM POWER DISSIPATION Parameter Rating
Exceeding a junction temperature of 150°C can result in changes Supply Voltage, V 13.2 V CC to silicon devices, potentially causing degradation or loss of SD Voltage V CC functionality. Power Dissipation 1.25 W Storage Temperature Range −65°C to +125°C The power dissipation of the ADA4312-1 is 750 mW for a typical Operating Temperature Range −40°C to +85°C G.hn application delivering 16 dBm into a 40 Ω differential load. Lead Temperature (Soldering, 10 sec) 300°C The maximum internal power dissipation should not exceed Junction Temperature 150°C 1.25 W over the extended industrial temperature range of −40°C Stresses above those listed under Absolute Maximum Ratings to +85°C on a PCB designed according to the guidelines in the may cause permanent damage to the device. This is a stress Thermal Management section. rating only; functional operation of the device at these or any
ESD CAUTION
other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
THERMAL RESISTANCE
The thermal resistance (θJA) was specified using the ADA4312-1 evaluation board (EVAL-ADA4312-1ACPZ).
Table 3. Package Type θ Unit JA
16-Lead LFCSP 31.8 °C/W Rev. A | Page 4 of 12 Document Outline Features Applications General Description Functional Block Diagram Typical Application Circuit Revision History Specifications Absolute Maximum Ratings Thermal Resistance Maximum Power Dissipation ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Test Circuit Applications Information Feedback Resistor Selection General Operation Half-Duplex Operation Establishing VMID Bias Control and Linearity PCB Layout Thermal Management Power Supply Bypassing Evaluation Board Outline Dimensions Ordering Guide
ADA4312-1 Data Sheet ABSOLUTE MAXIMUM RATINGS Table 2. MAXIMUM POWER DISSIPATION Parameter Rating
Exceeding a junction temperature of 150°C can result in changes Supply Voltage, V 13.2 V CC to silicon devices, potentially causing degradation or loss of SD Voltage V CC functionality. Power Dissipation 1.25 W Storage Temperature Range −65°C to +125°C The power dissipation of the ADA4312-1 is 750 mW for a typical Operating Temperature Range −40°C to +85°C G.hn application delivering 16 dBm into a 40 Ω differential load. Lead Temperature (Soldering, 10 sec) 300°C The maximum internal power dissipation should not exceed Junction Temperature 150°C 1.25 W over the extended industrial temperature range of −40°C Stresses above those listed under Absolute Maximum Ratings to +85°C on a PCB designed according to the guidelines in the may cause permanent damage to the device. This is a stress Thermal Management section. rating only; functional operation of the device at these or any
ESD CAUTION
other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
THERMAL RESISTANCE
The thermal resistance (θJA) was specified using the ADA4312-1 evaluation board (EVAL-ADA4312-1ACPZ).
Table 3. Package Type θ Unit JA
16-Lead LFCSP 31.8 °C/W Rev. A | Page 4 of 12 Document Outline Features Applications General Description Functional Block Diagram Typical Application Circuit Revision History Specifications Absolute Maximum Ratings Thermal Resistance Maximum Power Dissipation ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Test Circuit Applications Information Feedback Resistor Selection General Operation Half-Duplex Operation Establishing VMID Bias Control and Linearity PCB Layout Thermal Management Power Supply Bypassing Evaluation Board Outline Dimensions Ordering Guide