Datasheet ADA4091-2, ADA4091-4 (Analog Devices) - 6
| 制造商 | Analog Devices |
| 描述 | Precision Micropower, OVP, RRIO Operational Amplifier |
| 页数 / 页 | 20 / 6 — ADA4091-2/ADA4091-4. Data Sheet. ABSOLUTE MAXIMUM RATINGS. THERMAL … |
| 修订版 | H |
| 文件格式/大小 | PDF / 556 Kb |
| 文件语言 | 英语 |
ADA4091-2/ADA4091-4. Data Sheet. ABSOLUTE MAXIMUM RATINGS. THERMAL RESISTANCE. Table 5. Parameter. Rating
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ADA4091-2/ADA4091-4 Data Sheet ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Table 5. Parameter Rating
θJA is specified for the device soldered on a 4-layer JEDEC Supply Voltage 36 V standard PCB with zero airflow. The exposed pad is soldered to Input Voltage Refer to the Input the application board. Overvoltage Protection section
Table 6. Thermal Resistance
Differential Input Voltage1 ±V
Package Type θJA θJC Unit
SY Input Current ±5 mA 8-Lead SOIC (R-8) 155 45 °C/W Output Short-Circuit Duration to GND Indefinite 14-Lead TSSOP (RU-14) 112 35 °C/W Storage Temperature Range −65°C to +150°C 8-Lead LFCSP (CP-8-21) 75 12 °C/W Operating Temperature Range −40°C to +125°C 16-Lead LFCSP (CP-16-17) 55 14 °C/W Junction Temperature Range −65°C to +150°C Lead Temperature (Soldering, 60 sec) 300°C
ESD CAUTION
1 Input current must be limited to ±5 mA. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. H | Page 6 of 20 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION PIN CONFIGURATIONS REVISION HISTORY SPECIFICATIONS ELECTRICAL SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION INPUT STAGE OUTPUT STAGE INPUT OVERVOLTAGE PROTECTION OUTLINE DIMENSIONS ORDERING GUIDE
ADA4091-2/ADA4091-4 Data Sheet ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Table 5. Parameter Rating
θJA is specified for the device soldered on a 4-layer JEDEC Supply Voltage 36 V standard PCB with zero airflow. The exposed pad is soldered to Input Voltage Refer to the Input the application board. Overvoltage Protection section
Table 6. Thermal Resistance
Differential Input Voltage1 ±V
Package Type θJA θJC Unit
SY Input Current ±5 mA 8-Lead SOIC (R-8) 155 45 °C/W Output Short-Circuit Duration to GND Indefinite 14-Lead TSSOP (RU-14) 112 35 °C/W Storage Temperature Range −65°C to +150°C 8-Lead LFCSP (CP-8-21) 75 12 °C/W Operating Temperature Range −40°C to +125°C 16-Lead LFCSP (CP-16-17) 55 14 °C/W Junction Temperature Range −65°C to +150°C Lead Temperature (Soldering, 60 sec) 300°C
ESD CAUTION
1 Input current must be limited to ±5 mA. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. H | Page 6 of 20 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION PIN CONFIGURATIONS REVISION HISTORY SPECIFICATIONS ELECTRICAL SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION INPUT STAGE OUTPUT STAGE INPUT OVERVOLTAGE PROTECTION OUTLINE DIMENSIONS ORDERING GUIDE