Datasheet AD9252 (Analog Devices) - 10
| 制造商 | Analog Devices |
| 描述 | Octal, 14-Bit, 50 MSPS, Serial LVDS, 1.8 V ADC |
| 页数 / 页 | 53 / 10 — Data Sheet. AD9252. ABSOLUTE MAXIMUM RATINGS. THERMAL IMPEDANCE. Table 5. … |
| 修订版 | E |
| 文件格式/大小 | PDF / 1.8 Mb |
| 文件语言 | 英语 |
Data Sheet. AD9252. ABSOLUTE MAXIMUM RATINGS. THERMAL IMPEDANCE. Table 5. With. Table 6. Parameter. Respect To. Rating
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Data Sheet AD9252 ABSOLUTE MAXIMUM RATINGS THERMAL IMPEDANCE Table 5. With Table 6. Parameter Respect To Rating Air Flow Velocity (m/s) θ 1 JA θJB θJC Unit
ELECTRICAL 0.0 17.7 °C/W AVDD AGND −0.3 V to +2.0 V 1.0 15.5 8.7 0.6 °C/W DRVDD DRGND −0.3 V to +2.0 V 2.5 13.9 °C/W AGND DRGND −0.3 V to +0.3 V AVDD DRVDD −2.0 V to +2.0 V 1 θJA for a 4-layer PCB with solid ground plane (simulated). Exposed pad soldered to PCB. Digital Outputs DRGND −0.3 V to +2.0 V (D + x, D − x, DCO+, DCO−, FCO+, FCO−)
ESD CAUTION
CLK+, CLK− AGND −0.3 V to +3.9 V VIN + x, VIN − x AGND −0.3 V to +2.0 V SDIO/ODM AGND −0.3 V to +2.0 V PDWN, SCLK/DTP, CSB AGND −0.3 V to +3.9 V REFT, REFB, RBIAS AGND −0.3 V to +2.0 V VREF, SENSE AGND −0.3 V to +2.0 V ENVIRONMENTAL Operating Temperature −40°C to +85°C Range (Ambient) Storage Temperature −65°C to +150°C Range (Ambient) Maximum Junction 150°C Temperature Lead Temperature 300°C (Soldering, 10 sec) Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rev. E | Page 9 of 52 Document Outline Features Applications General Description Functional Block Diagram Product Highlights Revision History Specifications AC Specifications Digital Specifications Switching Specifications Timing Diagrams Absolute Maximum Ratings Thermal Impedance ESD Caution Pin Configuration and Function Descriptions Equivalent Circuits Typical Performance Characteristics Theory of Operation Analog Input Considerations Differential Input Configurations Single-Ended Input Configuration Clock Input Considerations Clock Duty Cycle Considerations Clock Jitter Considerations Power Dissipation and Power-Down Mode Digital Outputs and Timing SDIO/ODM Pin SCLK/DTP Pin CSB Pin RBIAS Pin Voltage Reference Internal Reference Operation External Reference Operation Serial Port Interface (SPI) Hardware Interface Memory Map Reading the Memory Map Table Reserved Locations Default Values Logic Levels Applications Information Design Guidelines Power and Ground Recommendations Exposed Paddle Thermal Heat Slug Recommendations Evaluation Board Power Supplies Input Signals Output Signals Default Operation and Jumper Selection Settings Alternative Analog Input Drive Configuration Outline Dimensions Ordering Guide
Data Sheet AD9252 ABSOLUTE MAXIMUM RATINGS THERMAL IMPEDANCE Table 5. With Table 6. Parameter Respect To Rating Air Flow Velocity (m/s) θ 1 JA θJB θJC Unit
ELECTRICAL 0.0 17.7 °C/W AVDD AGND −0.3 V to +2.0 V 1.0 15.5 8.7 0.6 °C/W DRVDD DRGND −0.3 V to +2.0 V 2.5 13.9 °C/W AGND DRGND −0.3 V to +0.3 V AVDD DRVDD −2.0 V to +2.0 V 1 θJA for a 4-layer PCB with solid ground plane (simulated). Exposed pad soldered to PCB. Digital Outputs DRGND −0.3 V to +2.0 V (D + x, D − x, DCO+, DCO−, FCO+, FCO−)
ESD CAUTION
CLK+, CLK− AGND −0.3 V to +3.9 V VIN + x, VIN − x AGND −0.3 V to +2.0 V SDIO/ODM AGND −0.3 V to +2.0 V PDWN, SCLK/DTP, CSB AGND −0.3 V to +3.9 V REFT, REFB, RBIAS AGND −0.3 V to +2.0 V VREF, SENSE AGND −0.3 V to +2.0 V ENVIRONMENTAL Operating Temperature −40°C to +85°C Range (Ambient) Storage Temperature −65°C to +150°C Range (Ambient) Maximum Junction 150°C Temperature Lead Temperature 300°C (Soldering, 10 sec) Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rev. E | Page 9 of 52 Document Outline Features Applications General Description Functional Block Diagram Product Highlights Revision History Specifications AC Specifications Digital Specifications Switching Specifications Timing Diagrams Absolute Maximum Ratings Thermal Impedance ESD Caution Pin Configuration and Function Descriptions Equivalent Circuits Typical Performance Characteristics Theory of Operation Analog Input Considerations Differential Input Configurations Single-Ended Input Configuration Clock Input Considerations Clock Duty Cycle Considerations Clock Jitter Considerations Power Dissipation and Power-Down Mode Digital Outputs and Timing SDIO/ODM Pin SCLK/DTP Pin CSB Pin RBIAS Pin Voltage Reference Internal Reference Operation External Reference Operation Serial Port Interface (SPI) Hardware Interface Memory Map Reading the Memory Map Table Reserved Locations Default Values Logic Levels Applications Information Design Guidelines Power and Ground Recommendations Exposed Paddle Thermal Heat Slug Recommendations Evaluation Board Power Supplies Input Signals Output Signals Default Operation and Jumper Selection Settings Alternative Analog Input Drive Configuration Outline Dimensions Ordering Guide