Datasheet AD9222 (Analog Devices) - 10
| 制造商 | Analog Devices |
| 描述 | Octal, 12-Bit, 40/50/65 MSPS Serial LVDS 1.8 V A/D Converter |
| 页数 / 页 | 61 / 10 — Data Sheet. AD9222. ABSOLUTE MAXIMUM RATINGS. Table 5. With. Parameter. … |
| 修订版 | F |
| 文件格式/大小 | PDF / 2.6 Mb |
| 文件语言 | 英语 |
Data Sheet. AD9222. ABSOLUTE MAXIMUM RATINGS. Table 5. With. Parameter. Respect To. Rating. THERMAL IMPEDANCE. Table 6. Air Flow
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Data Sheet AD9222 ABSOLUTE MAXIMUM RATINGS Table 5. With
Stresses above those listed under Absolute Maximum Ratings
Parameter Respect To Rating
may cause permanent damage to the device. This is a stress ELECTRICAL rating only; functional operation of the device at these or any AVDD AGND −0.3 V to +2.0 V other conditions above those indicated in the operational DRVDD DRGND −0.3 V to +2.0 V section of this specification is not implied. Exposure to absolute AGND DRGND −0.3 V to +0.3 V maximum rating conditions for extended periods may affect AVDD DRVDD −2.0 V to +2.0 V device reliability. Digital Outputs DRGND −0.3 V to +2.0 V
THERMAL IMPEDANCE
(D + x, D − x, DCO+, DCO−, FCO+, FCO−)
Table 6.
CLK+, CLK− AGND −0.3 V to +3.9 V
Air Flow
VIN + x, VIN − x AGND −0.3 V to +2.0 V
Velocity (m/s) θ 1 JA θJB θJC
SDIO/ODM AGND −0.3 V to +2.0 V 0.0 17.7°C/W PDWN, SCLK/DTP, CSB AGND −0.3 V to +3.9 V 1.0 15.5°C/W 8.7°C/W 0.6°C/W REFT, REFB, RBIAS AGND −0.3 V to +2.0 V 2.5 13.9°C/W VREF, SENSE AGND −0.3 V to +2.0 V 1 θ ENVIRONMENTAL JA for a 4-layer PCB with solid ground plane (simulated). Exposed pad soldered to PCB. Operating Temperature −40°C to +85°C Range (Ambient)
ESD CAUTION
Maximum Junction 150°C Temperature Lead Temperature 300°C (Soldering, 10 sec) Storage Temperature −65°C to +150°C Range (Ambient) Rev. F | Page 9 of 60 Document Outline Features Applications General Description Functional Block Diagram Product Highlights Table of Contents Revision History Specifications AC Specifications Digital Specifications Switching Specifications Timing Diagrams Absolute Maximum Ratings Thermal Impedance ESD Caution Pin Configuration and Function Descriptions Equivalent Circuits Typical Performance Characteristics Theory of Operation Analog Input Considerations Differential Input Configurations Single-Ended Input Configuration Clock Input Considerations Clock Duty Cycle Considerations Clock Jitter Considerations Power Dissipation and Power-Down Mode Digital Outputs and Timing SDIO/ODM Pin SCLK/DTP Pin CSB Pin RBIAS Pin Voltage Reference Internal Reference Operation External Reference Operation Serial Port Interface (SPI) Hardware Interface Memory Map Reading the Memory Map Table Reserved Locations Default Values Logic Levels Power and Ground Recommendations Exposed Paddle Thermal Heat Slug Recommendations Evaluation Board Power Supplies Input Signals Output Signals Default Operation and Jumper Selection Settings Alternative Analog Input Drive Configuration Outline Dimensions Ordering Guide
Data Sheet AD9222 ABSOLUTE MAXIMUM RATINGS Table 5. With
Stresses above those listed under Absolute Maximum Ratings
Parameter Respect To Rating
may cause permanent damage to the device. This is a stress ELECTRICAL rating only; functional operation of the device at these or any AVDD AGND −0.3 V to +2.0 V other conditions above those indicated in the operational DRVDD DRGND −0.3 V to +2.0 V section of this specification is not implied. Exposure to absolute AGND DRGND −0.3 V to +0.3 V maximum rating conditions for extended periods may affect AVDD DRVDD −2.0 V to +2.0 V device reliability. Digital Outputs DRGND −0.3 V to +2.0 V
THERMAL IMPEDANCE
(D + x, D − x, DCO+, DCO−, FCO+, FCO−)
Table 6.
CLK+, CLK− AGND −0.3 V to +3.9 V
Air Flow
VIN + x, VIN − x AGND −0.3 V to +2.0 V
Velocity (m/s) θ 1 JA θJB θJC
SDIO/ODM AGND −0.3 V to +2.0 V 0.0 17.7°C/W PDWN, SCLK/DTP, CSB AGND −0.3 V to +3.9 V 1.0 15.5°C/W 8.7°C/W 0.6°C/W REFT, REFB, RBIAS AGND −0.3 V to +2.0 V 2.5 13.9°C/W VREF, SENSE AGND −0.3 V to +2.0 V 1 θ ENVIRONMENTAL JA for a 4-layer PCB with solid ground plane (simulated). Exposed pad soldered to PCB. Operating Temperature −40°C to +85°C Range (Ambient)
ESD CAUTION
Maximum Junction 150°C Temperature Lead Temperature 300°C (Soldering, 10 sec) Storage Temperature −65°C to +150°C Range (Ambient) Rev. F | Page 9 of 60 Document Outline Features Applications General Description Functional Block Diagram Product Highlights Table of Contents Revision History Specifications AC Specifications Digital Specifications Switching Specifications Timing Diagrams Absolute Maximum Ratings Thermal Impedance ESD Caution Pin Configuration and Function Descriptions Equivalent Circuits Typical Performance Characteristics Theory of Operation Analog Input Considerations Differential Input Configurations Single-Ended Input Configuration Clock Input Considerations Clock Duty Cycle Considerations Clock Jitter Considerations Power Dissipation and Power-Down Mode Digital Outputs and Timing SDIO/ODM Pin SCLK/DTP Pin CSB Pin RBIAS Pin Voltage Reference Internal Reference Operation External Reference Operation Serial Port Interface (SPI) Hardware Interface Memory Map Reading the Memory Map Table Reserved Locations Default Values Logic Levels Power and Ground Recommendations Exposed Paddle Thermal Heat Slug Recommendations Evaluation Board Power Supplies Input Signals Output Signals Default Operation and Jumper Selection Settings Alternative Analog Input Drive Configuration Outline Dimensions Ordering Guide