Datasheet AD9432 (Analog Devices) - 8

AD9432 PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS T U O IN T F F U D D E E D D N N O IN CC CC CC CC V GN AI AI GN V VR VR V GN V DNC GN D D EF EF D D CC N N CC CC CC 52 51 50 49 48 47 46 45 44 43 42 41 40 V GN AI AI GN V VR VR V GN V DNC GN 52 51 50 49 48 47 46 45 44 43 42 41 40 GND 1 39 GND PIN 1 GND 1 39 GND V 2 CC 38 GND V PIN 1 2 38 GND GND 3 37 V CC CC GND 3 GND 4 37 V 36 V CC CC GND 4 36 V V 5 35 GND CC CC AD9432 V 5 35 GND V 6 CC 34 GND CC AD9432 TOP VIEW (Not to Scale) V 6 34 GND ENCODE 7 33 GND CC TOP VIEW ENCODE ENCODE 8 7 (Not to Scale) 33 GND 32 VDD ENCODE GND 9 8 32 V 31 DGND DD GND 9 31 DGND V 10 CC 30 D0 (LSB) V GND 11 10 30 D0 (LSB) 29 D1 CC GND 11 DGND 12 29 D1 28 D2 DGND 12 28 D2 V 13 DD 27 D3 V 13 27 D3 DD 14 15 16 17 18 19 20 21 22 23 24 25 26 ) 0 14 15 16 17 18 19 20 21 22 23 24 25 26 OR B DD DD S D9 D8 D7 D6 D5 D4 D1 ND V V ND ) 0 M DG DG OR DD DD ( SB D9 D8 D7 D6 D5 D4 D1 ND V V ND 1 (M DG DG D1 1 NOTES
02
D1
0
1. ALTHOUGH NOT REQUIRED IN ALL APPLICATIONS, THE EXPOSED PADDLE NOTES
7- 58
ON THE UNDERSIDE OF THE PACKAGE SHOULD BE SOLDERED TO THE 1. DNC = DO NOT CONNECT.
00 44
GROUND PLANE. SOLDERING THE EXPOSED PADDLE TO THE PCB
0 7-
INCREASES THE RELIABILITY OF THE SOLDER JOINTS, MAXIMIZING
58
THE THERMAL CAPABILITY OF THE PACKAGE.
00 Figure 3. Pin Configuration, LQFP Figure 4. Pin Configuration, TQFP_EP
Table 4. Pin Function Descriptions Pin No. Mnemonic Description
1, 3, 4, 9, 11, 33, GND Analog Ground. 34, 35, 38, 39, 40, 43, 48, 51 2, 5, 6, 10, 36, 37, VCC Analog Supply (5 V). 42, 44, 47, 52 7 ENCODE Encode Clock for ADC, Complementary. 8 ENCODE Encode Clock for ADC, True. ADC samples on rising edge of ENCODE. 12, 21, 24, 31 DGND Digital Output Ground. 13, 22, 23, 32 VDD Digital Output Power Supply (2.7 V to 3.6 V). 14 OR Out-of-Range Output. 15 to 20, 25 to 30 D11 to D6, D5 to D0 Digital Output. 41 DNC Do Not Connect. 45 VREFIN Reference Input for ADC (2.5 V Typical). Bypass with 0.1 μF capacitor to ground. 46 VREFOUT Internal Reference Output (2.5 V Typical). 49 AIN Analog Input, True. 50 AIN Analog Input, Complementary. Exposed Pad Although not required in all applications, the exposed paddle on the underside of the TQFP_EP (TQFP_EP) package should be soldered to the ground plane. Soldering the exposed paddle to the PCB increases the reliability of the solder joints, maximizing the thermal capability of the package. Rev. F | Page 7 of 16 Document Outline FEATURES APPLICATIONS GENERAL INTRODUCTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS TIMING DIAGRAM ABSOLUTE MAXIMUM RATINGS EXPLANATION OF TEST LEVELS THERMAL CHARACTERISTICS ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS TERMINOLOGY EQUIVALENT CIRCUITS THEORY OF OPERATION ANALOG INPUT ENCODE INPUT ENCODE VOLTAGE LEVEL DEFINITION DIGITAL OUTPUTS VOLTAGE REFERENCE TIMING APPLICATIONS INFORMATION USING THE AD8138 TO DRIVE THE AD9432 OUTLINE DIMENSIONS ORDERING GUIDE