Datasheet AD8229-KGD (Analog Devices) - 7
| 制造商 | Analog Devices |
| 描述 | 1 nV/√Hz Low Noise 210°C Instrumentation Amplifier |
| 页数 / 页 | 8 / 7 — Known Good Die. AD8229-KGD. PAD CONFIGURATION AND FUNCTION DESCRIPTIONS. … |
| 文件格式/大小 | PDF / 148 Kb |
| 文件语言 | 英语 |
Known Good Die. AD8229-KGD. PAD CONFIGURATION AND FUNCTION DESCRIPTIONS. ADI Logo. 5 6. Table 3. Pad Function Descriptions1. Pad No
该数据表的模型线
文件文字版本
link to page 7
Known Good Die AD8229-KGD PAD CONFIGURATION AND FUNCTION DESCRIPTIONS ADI Logo 10 1 2 3 9 4 5 6 8 7
002 10107- Figure 3. Pad Configuration
Table 3. Pad Function Descriptions1 Pad No. X-Axis (μm) Y-Axis (μm) Mnemonic Pad Type Description
1 −661 +665 −IN Single Negative Input Pad. 2 −661 +525 R Single Gain Setting Pad. G 3 −661 +331 R Double Gain Setting Pad. G 4 −661 +83 R Double Gain Setting Pad. G 5 −661 −111 R Single Gain Setting Pad. G 6 −661 −251 +IN Single Positive Input Pad. 7 +682 −1231 −V Single Negative Power Supply Pad. S 8 +538 −839 REF Double Reference Voltage Pad. 9 +626 +337 V Single Output Pad. OUT 10 +717 +979 +V Single Positive Power Supply Pad. S 1 To minimize gain errors introduced by the bond wires, use Kelvin connections between the chip and the gain resistor, RG, by connecting Pad 2 and Pad 3 in parallel to one end of RG, and connecting Pad 4 and Pad 5 in parallel to the other end of RG. For unity-gain applications where RG is not required, Pad 2 and Pad 3 must be bonded together as do Pad 4 and Pad 5. Rev. 0 | Page 7 of 8 Document Outline Features Applications General Description Functional Block Diagram Revision History Specifications Absolute Maximum Ratings ESD Caution Pad Configuration and Function Descriptions Outline Dimensions Die Specifications and Assembly Recommendations Ordering Guide
Known Good Die AD8229-KGD PAD CONFIGURATION AND FUNCTION DESCRIPTIONS ADI Logo 10 1 2 3 9 4 5 6 8 7
002 10107- Figure 3. Pad Configuration
Table 3. Pad Function Descriptions1 Pad No. X-Axis (μm) Y-Axis (μm) Mnemonic Pad Type Description
1 −661 +665 −IN Single Negative Input Pad. 2 −661 +525 R Single Gain Setting Pad. G 3 −661 +331 R Double Gain Setting Pad. G 4 −661 +83 R Double Gain Setting Pad. G 5 −661 −111 R Single Gain Setting Pad. G 6 −661 −251 +IN Single Positive Input Pad. 7 +682 −1231 −V Single Negative Power Supply Pad. S 8 +538 −839 REF Double Reference Voltage Pad. 9 +626 +337 V Single Output Pad. OUT 10 +717 +979 +V Single Positive Power Supply Pad. S 1 To minimize gain errors introduced by the bond wires, use Kelvin connections between the chip and the gain resistor, RG, by connecting Pad 2 and Pad 3 in parallel to one end of RG, and connecting Pad 4 and Pad 5 in parallel to the other end of RG. For unity-gain applications where RG is not required, Pad 2 and Pad 3 must be bonded together as do Pad 4 and Pad 5. Rev. 0 | Page 7 of 8 Document Outline Features Applications General Description Functional Block Diagram Revision History Specifications Absolute Maximum Ratings ESD Caution Pad Configuration and Function Descriptions Outline Dimensions Die Specifications and Assembly Recommendations Ordering Guide