AD8634-KGDKnown Good DiePAD CONFIGURATION AND FUNCTION DESCRIPTIONSV+81726–++–354V– 002 1524- 1 Figure 2. Pad Configuration and Functional Block Diagram Table 4. Pad Function Descriptions1 Pad No.X-Axis (µm )Y-Axis (µm )MnemonicDescription 1 −566 330 OUT A Output Pad of Amplifier A. 2 −566 227 −IN A Inverting Input Pad of Amplifier A. 3 −566 −97 +IN A Non-Inverting Input Pad of Amplifier A. 4 −566 −377 V− Pad Negative Power Supply Pad. Substrate is connected to V−. 5 566 −98 +IN B Non-Inverting Input Pad of Amplifier B. 6 566 227 −IN B Inverting Input Pad of Amplifier B. 7 566 330 OUT B Output Pad of Amplifier B. 8 544 456 V+ Positive Power Supply Pad. 1 Die center is the reference location at 0.0 µm × 0.0 µm. Pad coordinates are to the center of each pad. Rev. 0 | Page 6 of 7 Document Outline Features Applications Metal Mask Die Image General Description Table of Contents Revision History Specifications Electrical Characteristics, VSY = ±15.0 V Electrical Characteristics, VSY = 5.0 V Absolute Maximum Ratings ESD Caution Pad Configuration And Function Descriptions Outline Dimensions Die Specifications and Assembly Recommendations Ordering Guide