Datasheet AD8634-KGD (Analog Devices) - 7
| 制造商 | Analog Devices |
| 描述 | High Temperature, Low Noise, RRO Dual Operational Amplifier |
| 页数 / 页 | 7 / 7 — Known Good Die. AD8634-KGD. OUTLINE DIMENSIONS. 0.493. 1.33. 0.483 0.473. … |
| 文件格式/大小 | PDF / 189 Kb |
| 文件语言 | 英语 |
Known Good Die. AD8634-KGD. OUTLINE DIMENSIONS. 0.493. 1.33. 0.483 0.473. 1.10. TOP VIEW. SIDE VIEW. (CIRCUIT SIDE). 2014-. 0.07 × 0.07. 27-. 06-
该数据表的模型线
文件文字版本
Known Good Die AD8634-KGD OUTLINE DIMENSIONS 0.493 1.33 0.483 0.473 8 1 7 2 6 1.10 3 5 4 A TOP VIEW SIDE VIEW (CIRCUIT SIDE) 2014- 0.07 × 0.07 27- 06-
Figure 3. 8-Pad Bare Die [CHIP] (C-8-3) Dimensions shown in millimeters
DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS Table 5. Die Specifications Parameter Value Unit1
Chip Size 1240 × 1020 µm Scribe Line Width 90 × 90 µm Die Size 1330 × 1100 µm Thickness 483 µm Bond Pad 70 × 70 µm Bond Pad Composition 1.0 AlSi, 0.5AlCu % Backside V- biased N/A Passivation Oxynitride N/A 1 N/A means not applicable.
Table 6. Assembly Recommendations Assembly Component Recommendation
Die Attach Epoxy Adhesive Bonding Method Gold Ball or Aluminum Wedge Bonding Sequence Bond Pin 1 First
ORDERING GUIDE Model Temperature Range Package Description Package Option
AD8634-KGD-CHIP −40°C to +210°C 8-Pad Bare Die [CHIP] C-8-3
©2014 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D12314-0-7/14(0)
Rev. 0 | Page 7 of 7 Document Outline Features Applications Metal Mask Die Image General Description Table of Contents Revision History Specifications Electrical Characteristics, VSY = ±15.0 V Electrical Characteristics, VSY = 5.0 V Absolute Maximum Ratings ESD Caution Pad Configuration And Function Descriptions Outline Dimensions Die Specifications and Assembly Recommendations Ordering Guide
Figure 3. 8-Pad Bare Die [CHIP] (C-8-3) Dimensions shown in millimeters
DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS Table 5. Die Specifications Parameter Value Unit1
Chip Size 1240 × 1020 µm Scribe Line Width 90 × 90 µm Die Size 1330 × 1100 µm Thickness 483 µm Bond Pad 70 × 70 µm Bond Pad Composition 1.0 AlSi, 0.5AlCu % Backside V- biased N/A Passivation Oxynitride N/A 1 N/A means not applicable.
Table 6. Assembly Recommendations Assembly Component Recommendation
Die Attach Epoxy Adhesive Bonding Method Gold Ball or Aluminum Wedge Bonding Sequence Bond Pin 1 First
ORDERING GUIDE Model Temperature Range Package Description Package Option
AD8634-KGD-CHIP −40°C to +210°C 8-Pad Bare Die [CHIP] C-8-3
©2014 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D12314-0-7/14(0)
Rev. 0 | Page 7 of 7 Document Outline Features Applications Metal Mask Die Image General Description Table of Contents Revision History Specifications Electrical Characteristics, VSY = ±15.0 V Electrical Characteristics, VSY = 5.0 V Absolute Maximum Ratings ESD Caution Pad Configuration And Function Descriptions Outline Dimensions Die Specifications and Assembly Recommendations Ordering Guide