Datasheet Summary SAM D21EL, SAM D21GL (Microchip) - 8
制造商 | Microchip |
描述 | 32-bit ARM-Based Microcontrollers |
页数 / 页 | 38 / 8 — 32-bit ARM-Based Microcontrollers. Table 3-1. SAM D21L Device … |
修订版 | 02-01-2017 |
文件格式/大小 | PDF / 851 Kb |
文件语言 | 英语 |
32-bit ARM-Based Microcontrollers. Table 3-1. SAM D21L Device Identification Values. Device Variant. DID.DEVSEL
该数据表的模型线
文件文字版本
32-bit ARM-Based Microcontrollers Table 3-1. SAM D21L Device Identification Values Device Variant DID.DEVSEL Device ID (DID)
Reserved 0x00 - 0x61 SAMD21E16L 0x62 0x1001143E SAMD21E15L 0x63 0x1001143F Reserved 0x64 - 0x86 SAMD21G16L 0x87 0x10011457 Reserved 0x88 - 0xFF
Note:
The device variant (last letter of the ordering number) is independent of the die revision (DSU.DID.REVISION): The device variant denotes functional differences, whereas the die revision marks evolution of the die. The device variant denotes functional differences, whereas the die revision marks evolution of the die. © 2017 Microchip Technology Inc.
Datasheet Summary
40001885A-page 8 Document Outline Introduction Features Table of Contents 1. Description 2. Configuration Summary 3. Ordering Information 3.1. SAM D21ExL 3.2. SAM D21GxL 3.3. Device Identification 4. Block Diagram 5. Pinout 5.1. SAM D21GxL 5.1.1. QFN48 5.2. SAM D21ExL 5.2.1. QFN32 / TQFP32 6. Product Mapping 7. Processor And Architecture 7.1. Cortex M0+ Processor 7.1.1. Cortex M0+ Configuration 7.1.2. Cortex-M0+ Peripherals 7.1.3. Cortex-M0+ Address Map 7.1.4. I/O Interface 7.1.4.1. Overview 7.1.4.2. Description 7.2. Nested Vector Interrupt Controller 7.2.1. Overview 7.2.2. Interrupt Line Mapping 7.3. Micro Trace Buffer 7.3.1. Features 7.3.2. Overview 7.4. High-Speed Bus System 7.4.1. Features 7.4.2. Configuration 7.4.3. SRAM Quality of Service 7.5. AHB-APB Bridge 7.6. PAC - Peripheral Access Controller 7.6.1. Overview 7.6.2. Register Description 7.6.2.1. PAC0 Register Description 7.6.2.1.1. Write Protect Clear 7.6.2.1.2. Write Protect Set 7.6.2.2. PAC1 Register Description 7.6.2.2.1. Write Protect Clear 7.6.2.2.2. Write Protect Set 7.6.2.3. PAC2 Register Description 7.6.2.3.1. Write Protect Clear 7.6.2.3.2. Write Protect Set 8. Packaging Information 8.1. Thermal Considerations 8.1.1. Thermal Resistance Data 8.1.2. Junction Temperature 8.2. Package Drawings 8.2.1. 48 pin QFN 8.2.2. 32 pin TQFP 8.2.3. 32 pin QFN 8.3. Soldering Profile The Microchip Web Site Customer Change Notification Service Customer Support Product Identification System Microchip Devices Code Protection Feature Legal Notice Trademarks Quality Management System Certified by DNV Worldwide Sales and Service