Datasheet ADuM6400, ADuM6401, ADuM6402, ADuM6403, ADuM6404 (Analog Devices) - 8
| 制造商 | Analog Devices |
| 描述 | Quad-Channel, 5 kV Isolators with Integrated DC-to-DC Converter |
| 页数 / 页 | 28 / 8 — ADuM6400/ADuM6401/ADuM6402/ADuM6403/ADuM6404. Data Sheet. Table 13. Input … |
| 修订版 | A |
| 文件格式/大小 | PDF / 554 Kb |
| 文件语言 | 英语 |
ADuM6400/ADuM6401/ADuM6402/ADuM6403/ADuM6404. Data Sheet. Table 13. Input and Output Characteristics Parameter Symbol. Min. Typ
该数据表的模型线
- ADUM6400ARIZ ADUM6400ARIZ-RL ADUM6400ARWZ ADUM6400ARWZ-RL ADUM6400CRIZ ADUM6400CRIZ-RL ADUM6400CRWZ ADUM6400CRWZ-RL
- ADUM6401ARIZ ADUM6401ARIZ-RL ADUM6401ARWZ ADUM6401ARWZ-RL ADUM6401CRIZ ADUM6401CRIZ-RL ADUM6401CRWZ ADUM6401CRWZ-RL
- ADUM6402ARIZ ADUM6402ARIZ-RL ADUM6402ARWZ ADUM6402ARWZ-RL ADUM6402CRIZ ADUM6402CRIZ-RL ADUM6402CRWZ ADUM6402CRWZ-RL
文件文字版本
link to page 28 link to page 8 link to page 25 link to page 8 link to page 8
ADuM6400/ADuM6401/ADuM6402/ADuM6403/ADuM6404 Data Sheet Table 13. Input and Output Characteristics Parameter Symbol Min Typ Max Unit Test Conditions/Comments
DC SPECIFICATIONS Logic High Input Threshold VIH 0.7 × VISO or V 0.7 × VDD1 Logic Low Input Threshold VIL 0.3 × VISO or V 0.3 × VDD1 Logic High Output Voltages VOH VDD1 − 0.2 or VDD1 or VISO V IOx = −20 μA, VIx = VIxH VISO − 0.2 VDD1 − 0.5 or VDD1 − 0.2 or V IOx = −4 mA, VIx = VIxH VISO − 0.5 VISO − 0.2 Logic Low Output Voltages VOL 0.0 0.1 V IOx = 20 μA, VIx = VIxL 0.0 0.4 V IOx = 4 mA, VIx = VIxL Undervoltage Lockout UVLO VDD1, VDDL, VISO supplies Positive-Going Threshold VUV+ 2.7 V Negative-Going Threshold VUV− 2.4 V Hysteresis VUVH 0.3 V Input Currents per Channel II −10 +0.01 +10 μA 0 V ≤ VIx ≤ VDDx AC SPECIFICATIONS Output Rise/Fall Time tR/tF 2.5 ns 10% to 90% Common-Mode Transient |CM| 25 35 kV/μs VIx = VDD1 or VISO, VCM = 1000 V, Immunity1 transient magnitude = 800 V Refresh Rate fr 1.0 Mbps 1 |CM| is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.7 × VDD1 or 0.7 × VISO for a high input or VO < 0.3 × VDD1 or 0.3 × VISO for a low input. The common-mode voltage slew rates apply to both rising and falling common-mode voltage edges.
PACKAGE CHARACTERISTICS Table 14. Parameter Symbol Min Typ Max Unit Test Conditions/Comments
RESISTANCE AND CAPACITANCE Resistance (Input-to-Output)1 RI-O 1012 Ω Capacitance (Input-to-Output)1 CI-O 2.2 pF f = 1 MHz Input Capacitance2 CI 4.0 pF IC Junction-to-Ambient Thermal θJA 45 °C/W Thermocouple is located at the center of Resistance the package underside; test conducted on a 4-layer board with thin traces3 THERMAL SHUTDOWN Thermal Shutdown Threshold TSSD 150 °C TJ rising Thermal Shutdown Hysteresis TSSD-HYS 20 °C 1 This device is considered a 2-terminal device; Pin 1 through Pin 8 are shorted together, and Pin 9 through Pin 16 are shorted together. 2 Input capacitance is from any input data pin to ground. 3 Refer to the Thermal Analysi sect s ion for thermal model definitions. Rev. A | Page 8 of 28 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAMS TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL CHARACTERISTICS—5 V PRIMARY INPUT SUPPLY/5 V SECONDARY ISOLATED SUPPLY ELECTRICAL CHARACTERISTICS—3.3 V PRIMARY INPUT SUPPLY/3.3 V SECONDARY ISOLATED SUPPLY ELECTRICAL CHARACTERISTICS—5 V PRIMARY INPUT SUPPLY/3.3 V SECONDARY ISOLATED SUPPLY PACKAGE CHARACTERISTICS REGULATORY INFORMATION INSULATION AND SAFETY-RELATED SPECIFICATIONS INSULATION CHARACTERISTICS IEC 60747-5-2 (VDE 0884 Part 2):2003-01 and DIN V VDE V 0884-10 (VDE V 0884-10):2006-12 Thermal Derating Curve RECOMMENDED OPERATING CONDITIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TRUTH TABLE TYPICAL PERFORMANCE CHARACTERISTICS TERMINOLOGY APPLICATIONS INFORMATION PCB LAYOUT START-UP BEHAVIOR EMI CONSIDERATIONS PROPAGATION DELAY PARAMETERS DC CORRECTNESS AND MAGNETIC FIELD IMMUNITY POWER CONSUMPTION CURRENT LIMIT AND THERMAL OVERLOAD PROTECTION POWER CONSIDERATIONS THERMAL ANALYSIS INSULATION LIFETIME OUTLINE DIMENSIONS ORDERING GUIDE
ADuM6400/ADuM6401/ADuM6402/ADuM6403/ADuM6404 Data Sheet Table 13. Input and Output Characteristics Parameter Symbol Min Typ Max Unit Test Conditions/Comments
DC SPECIFICATIONS Logic High Input Threshold VIH 0.7 × VISO or V 0.7 × VDD1 Logic Low Input Threshold VIL 0.3 × VISO or V 0.3 × VDD1 Logic High Output Voltages VOH VDD1 − 0.2 or VDD1 or VISO V IOx = −20 μA, VIx = VIxH VISO − 0.2 VDD1 − 0.5 or VDD1 − 0.2 or V IOx = −4 mA, VIx = VIxH VISO − 0.5 VISO − 0.2 Logic Low Output Voltages VOL 0.0 0.1 V IOx = 20 μA, VIx = VIxL 0.0 0.4 V IOx = 4 mA, VIx = VIxL Undervoltage Lockout UVLO VDD1, VDDL, VISO supplies Positive-Going Threshold VUV+ 2.7 V Negative-Going Threshold VUV− 2.4 V Hysteresis VUVH 0.3 V Input Currents per Channel II −10 +0.01 +10 μA 0 V ≤ VIx ≤ VDDx AC SPECIFICATIONS Output Rise/Fall Time tR/tF 2.5 ns 10% to 90% Common-Mode Transient |CM| 25 35 kV/μs VIx = VDD1 or VISO, VCM = 1000 V, Immunity1 transient magnitude = 800 V Refresh Rate fr 1.0 Mbps 1 |CM| is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.7 × VDD1 or 0.7 × VISO for a high input or VO < 0.3 × VDD1 or 0.3 × VISO for a low input. The common-mode voltage slew rates apply to both rising and falling common-mode voltage edges.
PACKAGE CHARACTERISTICS Table 14. Parameter Symbol Min Typ Max Unit Test Conditions/Comments
RESISTANCE AND CAPACITANCE Resistance (Input-to-Output)1 RI-O 1012 Ω Capacitance (Input-to-Output)1 CI-O 2.2 pF f = 1 MHz Input Capacitance2 CI 4.0 pF IC Junction-to-Ambient Thermal θJA 45 °C/W Thermocouple is located at the center of Resistance the package underside; test conducted on a 4-layer board with thin traces3 THERMAL SHUTDOWN Thermal Shutdown Threshold TSSD 150 °C TJ rising Thermal Shutdown Hysteresis TSSD-HYS 20 °C 1 This device is considered a 2-terminal device; Pin 1 through Pin 8 are shorted together, and Pin 9 through Pin 16 are shorted together. 2 Input capacitance is from any input data pin to ground. 3 Refer to the Thermal Analysi sect s ion for thermal model definitions. Rev. A | Page 8 of 28 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAMS TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL CHARACTERISTICS—5 V PRIMARY INPUT SUPPLY/5 V SECONDARY ISOLATED SUPPLY ELECTRICAL CHARACTERISTICS—3.3 V PRIMARY INPUT SUPPLY/3.3 V SECONDARY ISOLATED SUPPLY ELECTRICAL CHARACTERISTICS—5 V PRIMARY INPUT SUPPLY/3.3 V SECONDARY ISOLATED SUPPLY PACKAGE CHARACTERISTICS REGULATORY INFORMATION INSULATION AND SAFETY-RELATED SPECIFICATIONS INSULATION CHARACTERISTICS IEC 60747-5-2 (VDE 0884 Part 2):2003-01 and DIN V VDE V 0884-10 (VDE V 0884-10):2006-12 Thermal Derating Curve RECOMMENDED OPERATING CONDITIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TRUTH TABLE TYPICAL PERFORMANCE CHARACTERISTICS TERMINOLOGY APPLICATIONS INFORMATION PCB LAYOUT START-UP BEHAVIOR EMI CONSIDERATIONS PROPAGATION DELAY PARAMETERS DC CORRECTNESS AND MAGNETIC FIELD IMMUNITY POWER CONSUMPTION CURRENT LIMIT AND THERMAL OVERLOAD PROTECTION POWER CONSIDERATIONS THERMAL ANALYSIS INSULATION LIFETIME OUTLINE DIMENSIONS ORDERING GUIDE