Datasheet ADR225-KGD-CHIPS (Analog Devices) - 6
| 制造商 | Analog Devices |
| 描述 | High Temperature, Low Drift, Micropower, 2.5V Reference |
| 页数 / 页 | 6 / 6 — ADR225-KGD-CHIPS. Known Good Die. OUTLINE DIMENSIONS. 0.995. 0.483. … |
| 文件格式/大小 | PDF / 158 Kb |
| 文件语言 | 英语 |
ADR225-KGD-CHIPS. Known Good Die. OUTLINE DIMENSIONS. 0.995. 0.483. 1.425. TOP VIEW. SIDE VIEW. (CIRCUIT SIDE). 0.092 × 0.086. 2016-
该数据表的模型线
文件文字版本
ADR225-KGD-CHIPS Known Good Die OUTLINE DIMENSIONS 0.995 0.483 1 8 7b 2a 7a 1.425 2b 6 3 4 5 TOP VIEW SIDE VIEW A (CIRCUIT SIDE) 0.092 × 0.086 2016- 0.092 × 0.172 12- 02-
Figure 3. 8-Pad Bare Die [CHIP] (C-8-7) Dimensions shown in millimeters
Table 4. Die Specifications Parameter Value Unit
Chip Size 920 × 1350 μm Scribe Line Width 75 × 75 μm Die Size 995 × 1425 μm Thickness 483 μm Bond Pad 92 × 86 μm Bond Pad Composition AlCu (0.5) % Passivation Oxynitride Not applicable Polyimide None Not applicable Die Marker 225 Not applicable Backside GND Not applicable
Table 5. Assembly Recommendations Assembly Component Recommendation
Die Attach Epoxy adhesive Bonding Method Gold ball or aluminum wedge Bonding Sequence GND pad first
ORDERING GUIDE Model Temperature Range Package Description Package Option
ADR225-KGD-CHIP −40°C to +210°C 8-Pad Bare Die [CHIP] C-8-7
©2016 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D14153-0-2/16(0)
Rev. 0 | Page 6 of 6 Document Outline FEATURES APPLICATIONS METAL MASK DIE IMAGE GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS OUTLINE DIMENSIONS ORDERING GUIDE
Figure 3. 8-Pad Bare Die [CHIP] (C-8-7) Dimensions shown in millimeters
Table 4. Die Specifications Parameter Value Unit
Chip Size 920 × 1350 μm Scribe Line Width 75 × 75 μm Die Size 995 × 1425 μm Thickness 483 μm Bond Pad 92 × 86 μm Bond Pad Composition AlCu (0.5) % Passivation Oxynitride Not applicable Polyimide None Not applicable Die Marker 225 Not applicable Backside GND Not applicable
Table 5. Assembly Recommendations Assembly Component Recommendation
Die Attach Epoxy adhesive Bonding Method Gold ball or aluminum wedge Bonding Sequence GND pad first
ORDERING GUIDE Model Temperature Range Package Description Package Option
ADR225-KGD-CHIP −40°C to +210°C 8-Pad Bare Die [CHIP] C-8-7
©2016 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D14153-0-2/16(0)
Rev. 0 | Page 6 of 6 Document Outline FEATURES APPLICATIONS METAL MASK DIE IMAGE GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS OUTLINE DIMENSIONS ORDERING GUIDE