Datasheet ADL5531 (Analog Devices) - 8
| 制造商 | Analog Devices |
| 描述 | 20 MHz TO 500 MHz IF Gain Block |
| 页数 / 页 | 12 / 8 — ADL5531. Data Sheet. 5.0. 4.5. 4.0. 3.5. E G. 3.0. F E. RCE E. 2.5. 2.0. … |
| 修订版 | C |
| 文件格式/大小 | PDF / 511 Kb |
| 文件语言 | 英语 |
ADL5531. Data Sheet. 5.0. 4.5. 4.0. 3.5. E G. 3.0. F E. RCE E. 2.5. 2.0. 1.5. 1.0. 37.5. 37.9. 38.3. 38.7. 39.1. 39.5. 39.9. 40.3. 100. 150. 200. 250. 300. 350. 400. 450. 500
该数据表的模型线
文件文字版本
ADL5531 Data Sheet 45 5.0 40 4.5 35 4.0 ) 30 B) % d ( 3.5 ( E G 25 RE A U 3.0 NT IG 20 F E RCE E IS 2.5 P 15 NO 2.0 10 5 1.5 0 1.0 37.5 37.9 38.3 38.7 39.1 39.5 39.9 40.3
09
0 50 100 150 200 250 300 350 400 450 500
12 0 0 3- 3-
OIP3 (dBm)
83 683
FREQUENCY (MHz)
0 06 Figure 9. OIP3 Distribution at 190 MHz Figure 12. Noise Figure vs. Frequency at 25°C, Multiple Devices Shown
60 150 140 50 130 5.25V ) 40 A) 120 % ( m ( E 110 NT AG T 30 RE N 100 5V RCE CUR E Y 90 P 20 L P UP 80 S 4.75V 10 70 60 020.0 20.2 20.4 20.6 20.8 21.0 21.2 21.4
10
50
0 3-
–40 –30 –20 –10 0 10 20 30 40 50 60 70 80 90
13 -0
P1dB (dBm)
83 06
TEMPERATURE (°C)
33 68 0 Figure 10. P1dB Distribution at 190 MHz Figure 13. Supply Current vs. Supply Voltage and Temperature
50 115 110 +85°C 45 105 40 100 A) 35 +25°C ) 95 (m % T 30 N E ( 90 G RE A 85 T 25 EN CUR Y 80 C –40°C 20 L P 75 PER 15 UP S 70 10 65 5 60 55 019.7 19.9 20.1 20.3 20.5 20.7 20.9 –6 –4 –2 0 2 4 6 8 10 12 14 16 18 20 22
00 1 11
19.8 20.0 20.2 20.4 20.6 20.8 21.0
0 33- 3-
POUT (dBm)
68 83 0
GAIN (dB)
06 Figure 11. Gain Distribution at 190 MHz Figure 14. Supply Current vs. POUT and Temperature Rev. C | Page 8 of 12 Document Outline FEATURES FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION REVISION HISTORY SPECIFICATIONS TYPICAL SCATTERING PARAMETERS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS BASIC CONNECTIONS SOLDERING INFORMATION AND RECOMMENDED PCB LAND PATTERN EVALUATION BOARD OUTLINE DIMENSIONS ORDERING GUIDE
09
0 50 100 150 200 250 300 350 400 450 500
12 0 0 3- 3-
OIP3 (dBm)
83 683
FREQUENCY (MHz)
0 06 Figure 9. OIP3 Distribution at 190 MHz Figure 12. Noise Figure vs. Frequency at 25°C, Multiple Devices Shown
60 150 140 50 130 5.25V ) 40 A) 120 % ( m ( E 110 NT AG T 30 RE N 100 5V RCE CUR E Y 90 P 20 L P UP 80 S 4.75V 10 70 60 020.0 20.2 20.4 20.6 20.8 21.0 21.2 21.4
10
50
0 3-
–40 –30 –20 –10 0 10 20 30 40 50 60 70 80 90
13 -0
P1dB (dBm)
83 06
TEMPERATURE (°C)
33 68 0 Figure 10. P1dB Distribution at 190 MHz Figure 13. Supply Current vs. Supply Voltage and Temperature
50 115 110 +85°C 45 105 40 100 A) 35 +25°C ) 95 (m % T 30 N E ( 90 G RE A 85 T 25 EN CUR Y 80 C –40°C 20 L P 75 PER 15 UP S 70 10 65 5 60 55 019.7 19.9 20.1 20.3 20.5 20.7 20.9 –6 –4 –2 0 2 4 6 8 10 12 14 16 18 20 22
00 1 11
19.8 20.0 20.2 20.4 20.6 20.8 21.0
0 33- 3-
POUT (dBm)
68 83 0
GAIN (dB)
06 Figure 11. Gain Distribution at 190 MHz Figure 14. Supply Current vs. POUT and Temperature Rev. C | Page 8 of 12 Document Outline FEATURES FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION REVISION HISTORY SPECIFICATIONS TYPICAL SCATTERING PARAMETERS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS BASIC CONNECTIONS SOLDERING INFORMATION AND RECOMMENDED PCB LAND PATTERN EVALUATION BOARD OUTLINE DIMENSIONS ORDERING GUIDE