Datasheet TMPM4G Group(1) (Toshiba) - 8
制造商 | Toshiba |
描述 | TXZ4 |
页数 / 页 | 132 / 8 — TMPM4G Group(1). Datasheet. Table 6 TMPM4G6. Built-in Functions |
文件格式/大小 | PDF / 1.7 Mb |
文件语言 | 英语 |
TMPM4G Group(1). Datasheet. Table 6 TMPM4G6. Built-in Functions
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TMPM4G Group(1) Datasheet Table 6 TMPM4G6 Built-in Functions
TMPM4G6F10FG TMPM4G6FEFG TMPM4G6FDFG Code Flash (KB) 1024 768 512 Data Flash (KB) 32 32 32 Memory RAM (KB) 192 128 128 Backup RAM (KB) 2 2 2 I/O port PORT (pin) 91 91 91 External interrupt INT 12 12 12 External bus EBIF Sep./Mul. Sep./Mul. Sep./Mul. MDMAC (ch) 30 30 30 DMAC HDMAC (ch) 13 13 13 T32A (ch) 14 14 14 Timer function LTTMR (ch) 1 1 1 RTC (ch) 1 1 1 UART (ch) 3 3 3 FUART (ch) 1 1 1 Serial communication I2C (ch) 3 3 3 function TSPI (ch) 5 5 5 SMIF (ch) 1 1 1 CEC (ch) 1 1 1 12-bit ADC (ch) 16 16 16 Analog function 8-bit DAC (ch) 2 2 2 Motor control function A-PMD (ch) 1 1 1 Remote Control RMC (ch) 1 1 1 preprocessor peripherals Interval Sensor ISD(unit) 1 1 1 Detection peripherals LVD (ch) 1 1 1 SIWDT (ch) 1 1 1 System function OFD (ch) 1 1 1 POR 1 1 1 On-chip debug On-chip debug On-chip debug (JTAG/SW) (JTAG/SW) (JTAG/SW) Debug interface Debug TRACE(4bits) TRACE(4bits) TRACE(4bits) NBDIF NBDIF NBDIF LQFP100 Package Package type (14 mm x 14 mm, 0.5 mm pitch) 2018-11-12 8 / 132 Rev.4.1 Document Outline General Description Applications Features Products Lists Categorized by Functions 1. Block Diagram 2. Pin Assignment 2.1. LQFP176 2.2. LQFP144 2.3. LQFP128 2.4. LQFP100 2.5. VFBGA177 2.6. VFBGA145 3. Memory Map 3.1. List of Memory Sizes 4. Pin Description 4.1. Functional Pin Name and Function 4.1.1. Peripheral Function Pins 4.1.2. Debug Pins 4.1.3. Control Pins 4.1.4. Power Supply Pins 4.2. Functional Pin and Port Assignment (Pin Number) 4.3. Ports 4.3.1. Port Specifications Table 5. Functional Description and Operation Description 5.1. Reference Manuals 5.2. Processor Core 5.2.1. Core Information 5.2.2. Configurable Options 5.3. Clock Control and Operation Mode (CG) 5.4. Flash Memory (Code FLASH, Data FLASH) 5.5. Oscillation Circuit 5.6. Trimming Circuit (TRM) 5.7. Oscillation Frequency Detector (OFD) 5.8. Voltage Detection Circuit (LVD) 5.9. Digital Noise Filter Circuit (DNF) 5.10. Debug Interface (DEBUG) 5.11. Non Break Debug Interface(NBDIF) 5.12. Interval Sensor Detection Circuit(ISD) 5.13. DMA Controller 5.13.1. Multi-Function DMA Controller (MDMAC) 5.13.2. High Speed DMA Controller (HDMAC) 5.14. External Bus Interface (EBIF) 5.15. Serial Memory Interface (SMIF) 5.16. Asynchronous Serial Communication Circuit 5.16.1. Asynchronous Serial Communication Circuit (UART) 5.16.2. Full Universal Asynchronous Receiver Transmitter Circuit (FUART) 5.17. Serial Peripheral Interface (TSPI) 5.18. I2C Interface (I2C) 5.19. Consumer Electronics Control Circuit (CEC) 5.20. 8-bit Digital to Analog Converter (DAC) 5.21. 12-bit Analog to Digital Converter (ADC) 5.22. Advanced Programmable Motor Control Circuit (A-PMD) 5.23. 32-bit Timer Event Counter (T32A) 5.24. Long Term Timer (LTTMR) 5.25. Real Time Clock (RTC) 5.26. Clock Selective Watchdog Timer (SIWDT) 5.27. Remote Control Signal Preprocessor (RMC) 5.28. Boundary-scan (BSC) 6. Equivalent Circuit 6.1. Port 6.2. Analog Power pin 6.3. Control Pin 6.4. Clock control 7. Electrical Characteristics 7.1. Absolute Maximum Ratings 7.2. DC Electrical Characteristics (1/2) 7.3. DC Electrical Characteristics (2/2) (Consumption current) 7.4. 12-bit AD Converter Characteristics 7.5. 8-bit DA Converter Characteristics 7.6. Characteristics of Internal processing at RESET 7.7. Characteristics of Power on Reset 7.8. Characteristics of Voltage Detection Circuit 7.9. AC Electrical Characteristics 7.9.1. Serial Peripheral Interface (TSPI) 7.9.1.1. AC Measurement Conditions 7.9.1.2. AC Electrical Characteristics 7.9.2. I2C Interface (I2C) 7.9.3. 32-bit Timer Event Counter (T32A) 7.9.4. External Bus Interface(EBIF) 7.9.4.3. AC Electrical Characteristics (EEXBCLK asynchronous Separate Mode) 7.9.4.4. AC Electrical Characteristics (EEXBCLK asynchronous multiplex bus mode) 7.9.4.5. AC Electrical Characteristics (EEXBCLK synchronous separate bus mode / multiplex bus mode) 7.9.5. Serial Memory Interface (SMIF) 7.9.5.1. AC Measurement Conditions 7.9.6. External Interrupt 7.9.6.1. AC Measurement Conditions 7.9.6.2. AC Electrical Characteristics 7.9.7. Trigger Input (TRGINx) 7.9.7.1. AC Measurement Conditions 7.9.7.2. AC Electrical Characteristics 7.9.8. Debug Communication 7.9.8.1. AC Measurement Conditions 7.9.8.2. SWD Interface 7.9.8.3. JTAG Interface 7.9.8.4. ETM Trace 7.9.8.6. Noise Filter Characteristics 7.9.9. External Clock Input 7.9.9.1. AC Measurement Conditions 7.10. Flash Memory Characteristics 7.10.1. Code Flash 7.10.2. Data Flash 7.10.3. Chip Erase 7.11. Regulator 7.12. Oscillation Circuit 7.12.1. Internal Oscillator 7.12.2. External Oscillator 7.12.3. Ceramic Oscillator 7.12.4. Crystal Oscillator 7.12.5. Precautions for designing printed circuit board 8. Package Dimensions 8.1. P-LQFP176-2020-0.40-002 8.2. P-LQFP144-2020-0.50-002 8.3. P-LQFP128-1414-0.40-001 8.4. P-LQFP100-1414-0.50-002 8.5. P-VFBGA177-1313-0.80-001 8.6. P-VFBGA145-1212-0.80-001 9. Precautions 10. Revision History Part Naming Conventions