Datasheet AD9253-EP (Analog Devices) - 7
| 制造商 | Analog Devices |
| 描述 | Quad, 14-Bit, 80 MSPS/105 MSPS/125 MSPS Serial LVDS 1.8 V Analog-to-Digital Converter |
| 页数 / 页 | 11 / 7 — Enhanced Product. AD9253-EP. ABSOLUTE MAXIMUM RATINGS Table 5. THERMAL … |
| 修订版 | B |
| 文件格式/大小 | PDF / 233 Kb |
| 文件语言 | 英语 |
Enhanced Product. AD9253-EP. ABSOLUTE MAXIMUM RATINGS Table 5. THERMAL RESISTANCE. Parameter. Rating. Table 6. Air Flow. Package
该数据表的模型线
文件文字版本
Enhanced Product AD9253-EP ABSOLUTE MAXIMUM RATINGS Table 5. THERMAL RESISTANCE Parameter Rating Table 6.
Electrical
Air Flow
AVDD to AGND −0.3 V to +2.0 V
Package Velocity θJC θJC
DRVDD to AGND −0.3 V to +2.0 V
Type (m/sec) θ 1 JA ΨJT ΨJB TOP BOTTOM Unit
Digital Outputs (D0±x, D1±x, DCO+, −0.3 V to +2.0 V 48-Lead 0.0 20.3 0.10 5.9 6.1 1.0 °C/W DCO−, FCO+, FCO−) to AGND LFCSP 1.0 17.6 0.16 N/A2 N/A2 N/A2 °C/W CLK+, CLK− to AGND −0.3 V to +2.0 V 2.5 16.5 0.20 N/A2 N/A2 N/A2 °C/W VIN+x, VIN−x to AGND −0.3 V to +2.0 V 1 θ SCLK/DTP, SDIO/OLM, CSB to AGND −0.3 V to +2.0 V JA for a 4-layer printed circuit board (PCB) with solid ground plane (simulated). Exposed pad soldered to PCB. SYNC, PDWN to AGND −0.3 V to +2.0 V 2 N/A = not applicable. RBIAS to AGND −0.3 V to +2.0 V VREF, SENSE to AGND −0.3 V to +2.0 V
ESD CAUTION
Environmental Operating Temperature Range (Ambient) −55°C to +125°C Maximum Junction Temperature 150°C Lead Temperature (Soldering, 10 sec) 300°C Storage Temperature Range (Ambient) −65°C to +150°C Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. B | Page 7 of 11 Document Outline Features Applications General Description Functional Block Diagram Product Highlights Revision History Specifications DC Specifications AC Specifications Digital Specifications Switching Specifications Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Outline Dimensions Ordering Guide
Electrical
Air Flow
AVDD to AGND −0.3 V to +2.0 V
Package Velocity θJC θJC
DRVDD to AGND −0.3 V to +2.0 V
Type (m/sec) θ 1 JA ΨJT ΨJB TOP BOTTOM Unit
Digital Outputs (D0±x, D1±x, DCO+, −0.3 V to +2.0 V 48-Lead 0.0 20.3 0.10 5.9 6.1 1.0 °C/W DCO−, FCO+, FCO−) to AGND LFCSP 1.0 17.6 0.16 N/A2 N/A2 N/A2 °C/W CLK+, CLK− to AGND −0.3 V to +2.0 V 2.5 16.5 0.20 N/A2 N/A2 N/A2 °C/W VIN+x, VIN−x to AGND −0.3 V to +2.0 V 1 θ SCLK/DTP, SDIO/OLM, CSB to AGND −0.3 V to +2.0 V JA for a 4-layer printed circuit board (PCB) with solid ground plane (simulated). Exposed pad soldered to PCB. SYNC, PDWN to AGND −0.3 V to +2.0 V 2 N/A = not applicable. RBIAS to AGND −0.3 V to +2.0 V VREF, SENSE to AGND −0.3 V to +2.0 V
ESD CAUTION
Environmental Operating Temperature Range (Ambient) −55°C to +125°C Maximum Junction Temperature 150°C Lead Temperature (Soldering, 10 sec) 300°C Storage Temperature Range (Ambient) −65°C to +150°C Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. B | Page 7 of 11 Document Outline Features Applications General Description Functional Block Diagram Product Highlights Revision History Specifications DC Specifications AC Specifications Digital Specifications Switching Specifications Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Outline Dimensions Ordering Guide