Datasheet ADW12001 (Analog Devices) - 8
| 制造商 | Analog Devices |
| 描述 | Dual 14-Bit, 20/40/65 MSPS, 3 V Analog-to-Digital Converter |
| 页数 / 页 | 24 / 8 — ADW12001. ABSOLUTE MAXIMUM RATINGS. Table 5. Parameter1. Rating. THERMAL … |
| 文件格式/大小 | PDF / 678 Kb |
| 文件语言 | 英语 |
ADW12001. ABSOLUTE MAXIMUM RATINGS. Table 5. Parameter1. Rating. THERMAL RESISTANCE. Table 6. Thermal Resistance. Package Type
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ADW12001 ABSOLUTE MAXIMUM RATINGS Table 5.
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress
Parameter1 Rating
rating only; functional operation of the device at these or any Electrical other conditions above those indicated in the operational AVDD to AGND −0.3 V to +3.9 V section of this specification is not implied. Exposure to absolute DRVDD to DRGND −0.3 V to +3.9 V maximum rating conditions for extended periods may affect AGND to DRGND −0.3 V to +0.3 V device reliability. AVDD to DRVDD −3.9 V to +3.9 V Digital Outputs CLK_A, CLK_B, DCS, −0.3 V to MUX_SELECT, SHARED_REF to DRGND DRVDD + 0.3 V
THERMAL RESISTANCE
OEB, DFS to AGND −0.3 V to AVDD + 0.3 V θJA is specified for the worst-case conditions, that is, a device VIN±_A, VIN±_B to AGND −0.3 V to soldered in a circuit board for surface-mount packages. AVDD + 0.3 V VREF to AGND −0.3 V to
Table 6. Thermal Resistance
AVDD + 0.3 V
Package Type θJA Unit
SENSE to AGND −0.3 V to 64-Lead LFCSP 26.4 °C/W AVDD + 0.3 V REFB_A, REFB_B, REFT_A, REFT_B to AGND −0.3 V to AVDD + 0.3 V
ESD CAUTION
PDWN_A, PDWN_B to AGND −0.3 V to AVDD + 0.3 V Environmental2 Operating Temperature Range −45°C to +115 °C Junction Temperature 150°C Lead Temperature (10 sec) 300°C Storage Temperature Range −65°C to +150°C 1 Absolute maximum ratings are limiting values to be applied individually, and beyond which the serviceability of the circuit may be impaired. Functional operability is not necessarily implied. 2 Typical thermal impedances: 64-lead LFCSP, θJA = 26.4°C/W with heat slug soldered to the ground plane. These measurements were taken on a 4-layer board in still air, in accordance with EIA/JESD51-7. Rev. 0 | Page 8 of 24 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM PRODUCT HIGHLIGHTS TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS DC SPECIFICATIONS AC SPECIFICATIONS DIGITAL SPECIFICATIONS SWITCHING SPECIFICATIONS Timing Diagram ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TERMINOLOGY TYPICAL PERFORMANCE CHARACTERISTICS EQUIVALENT CIRCUITS THEORY OF OPERATION ANALOG INPUT Differential Input Configurations Single-Ended Input Configuration CLOCK INPUT AND CONSIDERATIONS POWER DISSIPATION AND STANDBY MODE DIGITAL OUTPUTS TIMING DATA FORMAT VOLTAGE REFERENCE Internal Reference Connection External Reference Operation THERMAL CONSIDERATIONS OUTLINE DIMENSIONS ORDERING GUIDE
ADW12001 ABSOLUTE MAXIMUM RATINGS Table 5.
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress
Parameter1 Rating
rating only; functional operation of the device at these or any Electrical other conditions above those indicated in the operational AVDD to AGND −0.3 V to +3.9 V section of this specification is not implied. Exposure to absolute DRVDD to DRGND −0.3 V to +3.9 V maximum rating conditions for extended periods may affect AGND to DRGND −0.3 V to +0.3 V device reliability. AVDD to DRVDD −3.9 V to +3.9 V Digital Outputs CLK_A, CLK_B, DCS, −0.3 V to MUX_SELECT, SHARED_REF to DRGND DRVDD + 0.3 V
THERMAL RESISTANCE
OEB, DFS to AGND −0.3 V to AVDD + 0.3 V θJA is specified for the worst-case conditions, that is, a device VIN±_A, VIN±_B to AGND −0.3 V to soldered in a circuit board for surface-mount packages. AVDD + 0.3 V VREF to AGND −0.3 V to
Table 6. Thermal Resistance
AVDD + 0.3 V
Package Type θJA Unit
SENSE to AGND −0.3 V to 64-Lead LFCSP 26.4 °C/W AVDD + 0.3 V REFB_A, REFB_B, REFT_A, REFT_B to AGND −0.3 V to AVDD + 0.3 V
ESD CAUTION
PDWN_A, PDWN_B to AGND −0.3 V to AVDD + 0.3 V Environmental2 Operating Temperature Range −45°C to +115 °C Junction Temperature 150°C Lead Temperature (10 sec) 300°C Storage Temperature Range −65°C to +150°C 1 Absolute maximum ratings are limiting values to be applied individually, and beyond which the serviceability of the circuit may be impaired. Functional operability is not necessarily implied. 2 Typical thermal impedances: 64-lead LFCSP, θJA = 26.4°C/W with heat slug soldered to the ground plane. These measurements were taken on a 4-layer board in still air, in accordance with EIA/JESD51-7. Rev. 0 | Page 8 of 24 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM PRODUCT HIGHLIGHTS TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS DC SPECIFICATIONS AC SPECIFICATIONS DIGITAL SPECIFICATIONS SWITCHING SPECIFICATIONS Timing Diagram ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TERMINOLOGY TYPICAL PERFORMANCE CHARACTERISTICS EQUIVALENT CIRCUITS THEORY OF OPERATION ANALOG INPUT Differential Input Configurations Single-Ended Input Configuration CLOCK INPUT AND CONSIDERATIONS POWER DISSIPATION AND STANDBY MODE DIGITAL OUTPUTS TIMING DATA FORMAT VOLTAGE REFERENCE Internal Reference Connection External Reference Operation THERMAL CONSIDERATIONS OUTLINE DIMENSIONS ORDERING GUIDE