Datasheet HMC8120 (Analog Devices) - 8

HMC8120 Data Sheet –6 0 V V V V CTLx = –5.0V VCTLx = –2.6V VCTLx = –1.2V CTLx = –5.0V CTLx = –2.6V CTLx = –1.2V VCTLx = –4.0V VCTLx = –2.2V VCTLx = –1.0V –8 VCTLx = –4.0V VCTLx = –2.2V VCTLx = –1.0V –2 V V V CTLx = –3.5V VCTLx = –2.0V CTLx = –3.5V CTLx = –2.0V V V V CTLx = –3.0V VCTLx = –1.5V CTLx = –3.0V CTLx = –1.5V –10 –4 –12 –6 B) B) d ( (d S –14 S –8 S S O O L –16 L –10 RN URN –18 U –12 T T E R RE –20 –14 –22 –16 –24 –18 –26 –20 71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0 71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0
-020 -017
FREQUENCY (GHz) FREQUENCY (GHz)
3150 13150 1 Figure 17. Input Return Loss vs. Frequency at Various Control Voltages Figure 20. Output Return Loss vs. Frequency at Various Control Voltages
–50 34 T T A = –55°C A = –55°C T –52 TA = +25°C 33 A = +25°C T T A = +85°C A = +85°C –54 32 –56 31 ) B d –58 ) 30 ( m B –60 d 29 TION A 3 ( IP OL –62 28 IS –64 27 –66 26 –68 25 –70 24 71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0 71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0
033 -019 0-
FREQUENCY (GHz) FREQUENCY (GHz)
13150 1315 Figure 18. Reverse Isolation vs. Frequency at Various Temperatures, Figure 21. Output IP3 vs. Frequency at Various Temperatures, V P CTL1/VCTL2 = −5 V IN = −10 dBm/Tone, VCTL1/VCTL2 = −5 V
25 25 T T A = –55°C A = –55°C T 24 TA = +25°C 24 A = +25°C T T A = +85°C A = +85°C 23 23 22 22 ) ) 21 21 m B Bm d ( 20 (d 20 B T d SA P1 19 P 19 18 18 17 17 16 16 15 15
1
71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0
18
71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0
02 0
FREQUENCY (GHz) FREQUENCY (GHz)
3150- 1 13150- Figure 19. Output P1dB vs. Frequency at Various Temperatures, Figure 22. PSAT vs. Frequency at Various Temperatures, V V CTL1/VCTL2 = −5 V CTL1/VCTL2 = −5 V Rev. A | Page 8 of 16 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS HANDLING PRECAUTIONS Storage Cleanliness Static Sensitivity Transients General Handling MOUNTING Eutectic Die Attach Epoxy Die Attach WIRE BONDING OUTLINE DIMENSIONS ORDERING GUIDE