Datasheet BC546, BC846 (NXP) - 10
| 制造商 | NXP |
| 描述 | NPN general-purpose transistors in Surface Mounted Device (SMD) plastic packages |
| 页数 / 页 | 14 / 10 — NXP Semiconductors. BC846/BC546 series. 65 V, 100 mA NPN general-purpose … |
| 文件格式/大小 | PDF / 382 Kb |
| 文件语言 | 英语 |
NXP Semiconductors. BC846/BC546 series. 65 V, 100 mA NPN general-purpose transistors. 10. Soldering
该数据表的模型线
BC546
文件文字版本
NXP Semiconductors BC846/BC546 series 65 V, 100 mA NPN general-purpose transistors 10. Soldering
2.90 2.50 solder lands solder resist
2 1
0.85 3.00 1.30 2.70 occupied area 0.85
3
solder paste 0.60 (3x) 0.50 (3x) 0.60 (3x) 1.00 3.30 MSA439 Dimensions in mm
Fig 15. Reflow soldering footprint SOT23 (TO-236AB)
3.40 1.20 (2x) solder lands solder resist occupied area
2 1
4.60 4.00 1.20
3
preferred transport direction during soldering 2.80 MSA427 4.50 Dimensions in mm
Fig 16. Wave soldering footprint SOT23 (TO-236AB)
BC846_BC546_SER_7 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 07 — 17 November 2009 10 of 14
Document Outline 1. Product profile 1.1 General description 1.2 Features 1.3 Applications 1.4 Quick reference data 2. Pinning information 3. Ordering information 4. Marking 5. Limiting values 6. Thermal characteristics 7. Characteristics 8. Package outline 9. Packing information 10. Soldering 11. Revision history 12. Legal information 12.1 Data sheet status 12.2 Definitions 12.3 Disclaimers 12.4 Trademarks 13. Contact information 14. Contents
2.90 2.50 solder lands solder resist
2 1
0.85 3.00 1.30 2.70 occupied area 0.85
3
solder paste 0.60 (3x) 0.50 (3x) 0.60 (3x) 1.00 3.30 MSA439 Dimensions in mm
Fig 15. Reflow soldering footprint SOT23 (TO-236AB)
3.40 1.20 (2x) solder lands solder resist occupied area
2 1
4.60 4.00 1.20
3
preferred transport direction during soldering 2.80 MSA427 4.50 Dimensions in mm
Fig 16. Wave soldering footprint SOT23 (TO-236AB)
BC846_BC546_SER_7 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 07 — 17 November 2009 10 of 14
Document Outline 1. Product profile 1.1 General description 1.2 Features 1.3 Applications 1.4 Quick reference data 2. Pinning information 3. Ordering information 4. Marking 5. Limiting values 6. Thermal characteristics 7. Characteristics 8. Package outline 9. Packing information 10. Soldering 11. Revision history 12. Legal information 12.1 Data sheet status 12.2 Definitions 12.3 Disclaimers 12.4 Trademarks 13. Contact information 14. Contents